Did You Know...
...that a workman who left the soap mixing machine on too long was responsible for making Ivory Soap? He was so embarrassed by his mistake that he threw the mess in a stream. Imagine his dismay when the evidence of his error floated to the surface! Result: Ivory soap, the soap that floats.
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| Number | Title | Issue Date |
| 8110013 | Polishing composition A polishing composition includes a copolymer and an abrasive. The copolymer has a constitutional unit expressed as the following formula (I) and at least one of constitutional units expressed as the following formulas (II) to (IV). Methoxypolyethylene glycol methacr... | 02/07/2012 |
| 8105404 | Blast material A blast media for removal of thick coatings from heavy steel and lighter aluminum substrates where a profile is desired for new paint adhesion. The blast media is applied as a free flowing particulate in a stream of a pressurized fluid. The blast media comprises a m... | 01/31/2012 |
| 8080074 | Polycrystalline diamond compacts, and related methods and applications Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating such PDCs. In an embodiment of a “two-step” manufactured PDC, a PDC includes a substrate and a pre-sintered polycrystalline diamond (“PCD”) table ... | 12/20/2011 |
| 8075647 | Slurry for slicing silicon ingot and method for slicing silicon ingot using the same The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 2... | 12/13/2011 |
| 8070843 | Polishing fluids and methods for CMP Provided are several polishing compositions useful for modifying a surface, such as a semiconductor wafer suitable for fabrication of a semiconductor device, especially when used in fixed abrasive planarization techniques. The polishing compositions include a synerg... | 12/06/2011 |
| 8062395 | Adjuvant for CMP slurry Disclosed is an adjuvant in use for a process of polishing a cationically charged material and an anionically charged material at the same time with abrasive particles, which is absorbed onto the cationically charged material thereby to restrain the cationically cha... | 11/22/2011 |
| 8057562 | Thermally stable ultra-hard polycrystalline materials and compacts Thermally stable ultra-hard polycrystalline materials and compacts comprise an ultra-hard polycrystalline body that wholly or partially comprises one or more thermally stable ultra-hard polycrystalline region. A substrate can be attached to the body. The thermally s... | 11/15/2011 |
| 8043392 | Mixture of molten alumina-zirconia grains The mixture of molten alumina-zircon grains has the following chemical composition in percentage by weight to give 100%: 40-45.5% ZrO+HfO2; 46-58% Al2O3; 0-10% additive; | 10/25/2011 |
| 8012224 | Polishing composition A polishing composition includes a copolymer and an abrasive. The copolymer has a constitutional unit expressed as the following formula (I) and at least one of constitutional units expressed as the following formulae (II) to (IV). Methoxypolyethylene glycol methacr... | 09/06/2011 |
| 8007552 | Cubic boron nitride compact A CBN compact comprises CBN and a matrix phase incorporating a secondary hard phase selected from TiCN, TiC, TiN and mixtures and solid solutions thereof and a maximum amount of titanium diboride where the XRD peak height of the (101) titanium diboride peak (after b... | 08/30/2011 |
| 8002858 | Cutting segment, method for manufacturing cutting segment, and cutting tool comprising the same A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond... | 08/23/2011 |
| 8002861 | Abrasive grain powder Abrasive grain powder, in particular intended for machining silicon ingots, such that the granulometric fraction D40-D60 comprises more than 15% and less than 80%, as percentages by volume, of grains having circularity of less than 0.85. ... | 08/23/2011 |
| 8002860 | CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a metho... | 08/23/2011 |
| 8002859 | Manufacture of thermally stable cutting elements A method of forming a thermally stable cutting element that includes disposing at least a portion of a polycrystalline abrasive body containing a catalyzing material to be leached into a leaching agent; and subjecting the polycrystalline abrasive object to an elevat... | 08/23/2011 |
| 7998228 | Tantalum CMP compositions and methods A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises about 0.1 to about 10 percent by weight of a zirconia or fumed alumina abrasive, about 0.1 to about 10 percent by weight of an alkali metal iodate salt and an aqueous carrier. The comp... | 08/16/2011 |
| 7976596 | High density abrasive compacts A method of producing a high-density abrasive compact material includes the steps of providing an electrically conductive mixture of a bonding powder material and abrasive particles or grit; compressing the electrically conductive mixture; and subjecting the compres... | 07/12/2011 |
| 7964005 | Copper CMP slurry composition A composition that rapidly passivates copper-containing surface to yield a uniform layer of insoluble copper oxide, the composition being useful in chemical-mechanical planarization of copper-containing surfaces is disclosed. The composition is a solution having a p... | 06/21/2011 |
| 7951213 | Superabrasive compact, drill bit using same, and methods of fabricating same Superabrasive compacts, methods of fabricating such compacts, and drilling tools that may utilize such compacts are disclosed. In one aspect of the present invention, a superabrasive compact includes a substrate and a superabrasive table attached to the substrate. A... | 05/31/2011 |
| 7947363 | Coated article with nanolayered coating scheme A coated article that includes a substrate and a wear-resistant coating scheme. The coated article may be a cutting insert shown to improve performance in chip-forming material removal operations or a wear-resistant component used in chipless forming operations. The... | 05/24/2011 |
| 7931714 | Composition useful to chemical mechanical planarization of metal A chemical mechanical polishing composition, the polishing composition includes polishing abrasive, an oxidizing agent, an accelerating compound, an inhibitor, a co-inhibitor, and a solvent as the remaining. The composition can maintain a high removal rate through p... | 04/26/2011 |
| 7927390 | Stable aqueous suspension liquid of finely divided diamond particles, metallic film containing diamond particles and method of producing the same An aqueous suspension liquid of finely divided diamond particles comprising 0.05 to 160 parts by weight of a finely divided diamond particles in 1000 parts of water, wherein; (i) the finely divided diamond particles have an element composition consisting mainly of 7... | 04/19/2011 |
| 7901474 | Polishing composition and polishing method The present invention provide a chemical-mechanical polishing composition for inhibiting dishing and erosion as well as rapidly polishing an insulating film and barrier film at the same time while maintaining the flatness of the substrate surface polished. The prese... | 03/08/2011 |
| 7887608 | Agglomerate abrasive grains and methods of making the same An abrasive agglomerate includes a plurality of abrasive grains bonded together in a three-dimensional structure by a substantially continuous, non-porous inorganic binder, wherein the abrasive grains have an average size of between about 0.5 microns and about 1500 ... | 02/15/2011 |
| 7862634 | Polycrystalline composites reinforced with elongated nanostructures A sintered polycrystalline composite for cutting tools that includes a plurality of diamond or cubic boron nitride particles; a plurality of nanotube materials; and a refractory or binder material is disclosed. Methods of forming such polycrystalline composites that... | 01/04/2011 |
| 7857876 | Method of producing polishing material comprising diamond clusters Diamond clusters are used as a polishing material of free abrading particles, each being a combination of artificial diamond particles having primary particle diameters of 20 nm or less and impurities that are attached around these diamond particles. The density of ... | 12/28/2010 |
| 7736405 | Chemical mechanical polishing compositions for copper and associated materials and method of using same A CMP composition containing a rheology agent, e.g., in combination with oxidizing agent, chelating agent, inhibiting agent, abrasive and solvent. Such CMP composition advantageously increases the materials selectivity in the CMP process and is useful for polishing ... | 06/15/2010 |
| 7708788 | Cerium oxide abrasive and method of polishing substrates A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m.2/... | 05/04/2010 |
| 7699901 | Alumina-film-polishing composition and chemical mechanical polishing method using the same An alumina-film-polishing composition is for use in chemical mechanical polishing of an object to be polished that includes an alumina film with an irregular surface, so as to planarize the irregular surface. The polishing composition contains an alumina abrasive gr... | 04/20/2010 |
| 7666238 | Polishing composition A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a substrate comprising polishing a substrate to be polished using the above-men... | 02/23/2010 |
| 7632323 | Reducing abrasive wear in abrasion resistant coatings An abrasion resistant coating and method are provided wherein the abrasion resistant coating contains both ductile and brittle components. The abrasion resistant coating is initially applied to a substrate and is further conditioned such that the wear which occurs a... | 12/15/2009 |
| 7621974 | Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool A cutting tip for a drilling tool includes a cemented carbide cutting base, a diamond element supported by the cutting base, and a bonding layer formed between the cutting base and the diamond element in order to bond them. The bonding layer includes diffusion layer... | 11/24/2009 |
| 7585341 | Polishing material comprising diamond clusters Diamond clusters are used as a polishing material of free abrading particles, each being a combination of artificial diamond particles having primary particle diameters of 20 nm or less and impurities that are attached around these diamond particles. The density of ... | 09/08/2009 |
| 7578862 | Abrasive compound for glass hard disk platter The present invention provides an abrasive compound suitable for polishing the surface of a glass substrate for an optical disk platter or a magnetic disk platter. More specifically, the present invention provides an abrasive compound for a glass hard disk platter, ... | 08/25/2009 |
| 7553345 | Polishing composition A microwaviness reducing agent for polishing a substrate for a precision part, containing either a surfactant having two or more ionic hydrophilic groups, or a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH ... | 06/30/2009 |
| 7553346 | Abrasive product The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providi... | 06/30/2009 |
| 7550020 | Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method A chemical mechanical polishing aqueous dispersion comprises abrasives in a concentration of not more than 1.5% by mass, wherein the abrasives comprise ceria and have an average dispersed particle diameter of not less than 1.0 μm. A chemical mechanical polishing me... | 06/23/2009 |
| 7547335 | Metal polishing composition and method of polishing using the same A metal polishing composition comprising at least one of the compound represented by formula (1) defined herein and the compound represented by formula (2) defined herein, and an oxidizing agent, and a chemical mechanical polishing method comprising bringing the met... | 06/16/2009 |
| 7524346 | Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon comprising a noble metal, noble metal alloy, noble metal oxide, or any combi... | 04/28/2009 |
| 7524347 | CMP composition comprising surfactant The invention provides a polishing composition comprising fumed alumina, alpha alumina, silica, a nonionic surfactant, a metal chelating organic acid, and a liquid carrier. The invention further provides a method of chemically-mechanically polishing a substrate comp... | 04/28/2009 |
| 7513920 | Free radical-forming activator attached to solid and used to enhance CMP formulations A CMP composition having: a fluid comprising water and at least one oxidizing compound that produces free radicals when contacted with an activator; and a plurality of particles having a surface and comprising at least one activator selected from ions or compounds o... | 04/07/2009 |
