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Class 501/98.4 - Aluminum nitride containing (AIN)


Subclass of Class 501 - Compositions: ceramic
Definition: Subject matter in which aluminum nitride (AlN) is found.
No. of patents: 228
Last issue date: 04/03/2012


1            
NumberTitleIssue Date
8148283Aluminum nitride sintered body
A high-purity aluminum nitride sintered body is provided by efficiently removing oxides contained in a raw material powder in producing an aluminum nitride sintered body and preventing composite oxide produced by reaction of oxides contained in the raw material powd...
04/03/2012
8022001Aluminum nitride sintered product, method for producing the same, and electrostatic chuck including the same
A method for producing an aluminum nitride sintered product according to the present invention includes the steps of (a) preparing a powder mixture that contains AlN, 2 to 10 parts by weight of Eu2O3 with respect to 100 parts by weight of AlN, ...
09/20/2011
7803733Aluminum nitride sintered body and semiconductor manufacturing apparatus member
The aluminum nitride sintered body includes at least europium, aluminum, and oxygen. It was found that a grain boundary phase having a peak having a X-ray diffraction profile substantially the same as that of an Sr3Al2O6 phase could ...
09/28/2010
7741237Sealing composition for sealing aluminum nitride and aluminum oxynitride ceramics
There is described a sealing composition for sealing aluminum nitride and aluminum oxynitride ceramics comprising: a mixture of SiO2, at least one other metal oxide, and a silicon additive comprising at least one of silicon metal or a silicide. The silico...
06/22/2010
7737065Process for producing aluminum nitride sintered compacts
The present invention relates to a process of producing an aluminum nitride sintered body which satisfies both high thermal conductivity and reduction in the shrinkage factor at the time of sintering. The aluminum nitride sintered body is a sintered body of a powder...
06/15/2010
7662736High thermally conductive aluminum nitride sintered product
The high thermal conductive aluminum nitride sintered body according to the present invention has: a thermal conductivity of 220 W/m·K or more; and a three point bending strength of 250 MPa or more; wherein a ratio (IAl2Y
02/16/2010
7629282Aluminum nitride sintered body, semiconductor manufacturing device and method of manufacturing
A conductive channel formed of an (Sm, Ce)Al11O18 is interconnected in grain boundaries of aluminum nitride (AlN) particles, thereby reducing the temperature dependency of the volume resistivity of an AlN sintered body formed therefrom. At the ...
12/08/2009
7605102Aluminum nitride ceramic and semiconductor manufacturing member
An aluminum nitride ceramic including aluminum nitride grains and grain boundary phases comprises a grain boundary phase-rich layer including more amount of the grain boundary phases in a surface layer of the aluminum nitride ceramic than in an inside of the aluminu...
10/20/2009
7592280Aluminum nitride sintered body, method of manufacturing aluminum nitride sintered body, and member
An aluminum nitride sintered body is provided, wherein an average crystal grain diameter is 2.0 μm or less, a crystalline phase detected by an X-ray diffractometer is an AlN phase only or an AlN phase and an AlON phase only, and SiO2 or MgO is present in...
09/22/2009
7553787Aluminum nitride-based ceramic sintered body and member for semiconductor manufacturing device
An aluminum nitride-based ceramic sintered body is provided, which is manufactured by sintering an aluminum nitride powder comprising aluminum nitride as a main component, carbon in an amount of 0.1 wt % or more to 1.0 wt % or less, and containing oxygen in an amoun...
06/30/2009
7479467High thermally conductive aluminum nitride sintered product
The high thermal conductive aluminum nitride sintered body according to the present invention has: a thermal conductivity of 220 W/m·K or more; and a three point bending strength of 250 MPa or more; wherein a ratio (IAl2Y
01/20/2009
7407903Material for high temperatures
The present invention relates to a material for use at temperatures exceeding 1200° C. and in oxidizing atmospheres consisting generally of an alloy between a metal, aluminium (Al) and carbon (C) or nitrogen (N). The invention is characterized in that the alloy has...
08/05/2008
7371704Sintered bodies of yttrium-aluminum garnet, a method of producing the same and sintering aid therefor
An object of the present invention is to lower the sintering temperature required for a sintered body of yttrium-aluminum garnet, to improve the corrosion resistance of the sintered body and to prevent the reduction of the transmittance thereof. A sintered body of y...
05/13/2008
7361220Method of manufacturing group III nitride single crystal, device used for the method and group III nitride single crystal obtained by the method
The present invention provides a method of manufacturing a gallium nitride single crystal that can suppress the decomposition of gallium nitride and improve production efficiency in a sublimation method. According to the manufacturing method, a material (GaN powder)...
04/22/2008
7341969Aluminum nitride sintered body
The object of the present invention is to provide a susceptor with superior thermal uniformity by minimizing pores in an aluminum nitride sintered body. In an aluminum nitride sintered body according to the present invention, the tin content and sulfur conten...
03/11/2008
7338723Aluminum nitride substrate and production method
An aluminum nitride substrate comprises a planar sintered aluminum nitride body containing carbon including free carbon and a substantially planar electrode buried in the sintered aluminum nitride body. The sintered aluminum nitride body includes a work mounting por...
03/04/2008
7319916High speed and repeatability serial sectioning method for 3-D reconstruction of microstructures using optical microscopy
A high speed, high precision, high repeatability serial sectioning method for 3-D reconstruction of microstructure specimen is disclosed. The invention employs high-precision motorized metallographic polishing, viewing and computer controlled digital imaging of micr...
01/15/2008
7319914High speed and repeatability serial sectioning method for 3-D reconstruction of microstructures using scanning electron microscope
A high speed, high precision, high repeatability serial sectioning method for 3-D reconstruction of microstructure specimens is disclosed. The invention employs high-precision motorized metallographic polishing, viewing and computer controlled digital imaging of mic...
01/15/2008
7319080Aluminum nitride sintered compact
An aluminum nitride sintered body comprising crystal grains of an average grain size (D50) of 0.1 to 2.5 μm, and having a pore area ratio of not larger than 1×10−7, a pore density of not larger than 0.05 pores/mm2 of pores having...
01/15/2008
7319915High speed and repeatability serial sectioning device for 3-D reconstruction of microstructures
A high speed, high precision, high repeatability serial sectioning device and method for 3-D reconstruction of microstructure specimens. The invention employs a high-precision motorized metallographic polishing unit, a microscope for viewing and computer controlled ...
01/15/2008
7317964High speed and repeatability serial sectioning method for 3-D reconstruction of microstructures
A high speed, high precision, high repeatability serial sectioning method for 3-D reconstruction of microstructure specimens is disclosed. The invention employs high-precision motorized metallographic polishing, viewing and computer controlled digital imaging of mic...
01/08/2008
7314519Vapor-phase epitaxial apparatus and vapor phase epitaxial method
A vapor-phase growth apparatus including a reaction furnace, a wafer container disposed in said furnace, a gas supply member, and a heating member, wherein the apparatus is designed to form a grown film on a front surface of the wafer by supplying a source gas in a ...
01/01/2008
7309672Lightweight boron carbide materials with improved mechanical properties and process for their manufacture
This disclosure describes sintered bodies comprising about 90 wt % to about 99 wt % of boron carbide, having a B:C atomic ratio ranging from 3.8 to 4.5:1; 0 to 1 wt % free carbon; 0 to 1 wt % BN or AlN, remainder an oxide binder phase; said sintered body having a un...
12/18/2007
7303723Method of forming nanostructures on ceramics
A method for manufacturing oriented arrays of ceramic or metal oxide nanostructures, such as titania (TiO2) nanofibers. The nanofibers are formed on the surface of a body that is first sintered at a temperature in the range of about 1,100 to about 1,400 d...
12/04/2007
7294199Nitride single crystal and producing method thereof
A method of producing a nitride single crystal includes the step of forming a material transport medium layer containing a compound of rare earth element on a surface of a nitride crystal, and the step of making a seed crystal in contact with the material transport ...
11/13/2007
7288496Aluminum nitride sintered body and method of evaluation for the same
An aluminum nitride sintered body is provided, including a polycrystalline structure in which grain boundary fracture toughness KICgb is 1.6 MPa·m1/2 or more. The grain boundary fracture toughness KICgb is dete...
10/30/2007
7285259Sintering resistant catalyst material and a method for the preparation thereof
Preparation of sintering resistant hexaaluminates, AAl11O18, wherein A is an alka-line earth or rare earth metal, and more particularly lanthanum, by a combination of sol-gel and microemulsion techniques using a water soluble salt of A, and a method of forming spher...
10/23/2007
7282669Ceramic heater and method for manufacturing the same
A ceramic heater 1 includes a silicon nitride ceramic substrate 13 and a resistance-heating member 10 embedded in the silicon nitride ceramic substrate 13 . The silicon nitride ceramic substrate 13 contains oxygen derived from a si...
10/16/2007
7280341Electrostatic chuck
An electrostatic chuck is provided in which a lower oxide coating, an electrode, and an upper oxide coating are formed on a substrate. The lower oxide coating is formed by spraying an oxide of Gd, Tb, Dy, Ho, Er, Tm, Yb or Lu and has a dielectric strength of 15-50 k...
10/09/2007
7267808Aluminum nitride powder, method for producing the same and use thereof
The present invention is to produce an aluminum nitride powder which is turned into a sintered body at a temperature of not more than 1600° C., thereby obtaining a sintered aluminum nitride in which the density and thermal conductivity are high and which can be pro...
09/11/2007
7247591Translucent PCA ceramic, ceramic discharge vessel, and method of making
A translucent polycrystalline material suitable for use in ceramic discharge vessels for metal halide lamps is produced by sintering an alumina powder doped with a MgO sintering aid in a nitrogen atmosphere containing a partial pressure of a vapor phase carbon-conta...
07/24/2007
7247589Transparent polycrystalline sintered ceramic of cubic crystal structure
Transparent polycrystalline sintered ceramic of cubic crystal structure. The invention relates to the field of technical ceramic and relates to transparent polycrystalline sintered ceramics of cubic crystal structure for applications with increased mechanical stress...
07/24/2007
7211153Ceramic joined body, substrate holding structure and substrate processing apparatus
A substrate holding structure having excellent corrosion resistance and airtightness, excellent dimensional accuracy and sufficient durability when mechanical or thermal stress is applied thereto is obtained. A holder (1) serving as the substrate holding stru...
05/01/2007
7211216Aluminum nitride ceramic, semiconductor manufacturing member, and manufacturing method for aluminum nitride ceramic
An aluminum nitride ceramic including aluminum nitride grains and grain boundary phases comprises a grain boundary phase-rich layer including more amount of the grain boundary phases in a surface layer of the aluminum nitride ceramic than in an inside of the aluminu...
05/01/2007
7209339Electrostatic chuck for an electrically insulative substrate, and a method of using same
An electrostatic chuck for attracting an insulative substrate to be processed, the electrostatic chuck comprising a dielectric layer having a first surface which attracts an insulative substrate, and a second surface on which are provided a plurality of electrodes, ...
04/24/2007
7175714Electrode-built-in susceptor and a manufacturing method therefor
An electrode-built-in susceptor comprises a mounting plate and a supporting plate which are made of an aluminium-nitride-group-sintered member, an inner electrode which is made of a conductive aluminium-nitride-tantalum-nitride-composite-sintered-member or a conduct...
02/13/2007
7166823Method of making a heating element of molybdenum silicide type and a heating element
A method for the production of a heating element that is composed essentially of molybdenum silicide and alloys of that basic material, and a heating element formed from such material. A material is produced that contains substantially Mo(Si1-xAlx
01/23/2007
7148166Aluminum nitride ceramics and a member used for the production of semiconductors
An aluminum nitride ceramic having a low volume resistivity at room temperature and a relatively low samarium content is provided. The aluminum nitride ceramic contains aluminum nitride as a main component and samarium in a converted content, calculated as samarium ...
12/12/2006
7122490Aluminum nitride materials and members for use in the production of semiconductors
A novel aluminum nitride material having a low room temperature volume resistivity is provided. The aluminum nitride material has an aluminum nitride main component and includes at least 0.03 mol % of europium oxide. The aluminum nitride material has an aluminum nit...
10/17/2006
7105235Isotropic zero CTE reinforced composite materials
A reinforced composite material, having isotropic thermal expansion properties and a low coefficient of thermal expansion over at least the temperature range of from about 0° C. to at least about 150° C., which composite material comprises in combination a first c...
09/12/2006
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