Did You Know...
...that the inventor of the electric motor was a blacksmith named Thomas Davenport? Described as "a brilliantly unsuccessful inventor", Davenport invented the first rotary electric motor. In 1836 he headed out -- on foot -- from his Vermont home to file a patent application at the Patent Office in Washington, D.C. By the time he got there, he had squandered away his money and couldn't afford the $30 filing fee so he turned around and went home. When he later mailed in his application with money he'd raised, the Patent office was destroyed in a fire. He did finally get credit for his invention on Feb. 5, 1837.
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| Number | Title | Issue Date |
| 7442116 | Chemical mechanical polishing pad A chemical mechanical polishing pad having a face for polishing an object to be polished, a non-polishing face opposite to the face and a side face for interconnecting these faces and including the pattern of recessed portions which are formed on the non-polishing f... | 10/28/2008 |
| 7278908 | Polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular A polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular is disclosed, which comprises a support body, to which a foam layer is attached, wherein a polishing film bears against the foam layer. The polishing fi... | 10/09/2007 |
| 7223164 | Optical surface-finishing tool An optical surface-finishing tool includes a rigid support (4) having a transverse end surface (13); an elastically-compressible interface (5) which is applied against the end surface (13) such as to cover same; and a flexible buffer (... | 05/29/2007 |
| 7217176 | Polishing tool with several pressure zones The invention refers to a polishing tool for optical lenses with at least one polishing pad adaptable at least partially to the shape of a lens surface of said lenses and drivable by means of a drive shaft, said polishing pad having a membrane, wherein said polishin... | 05/15/2007 |
| 7189141 | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from the chemical ... | 03/13/2007 |
| 7108597 | Polishing pad having grooves configured to promote mixing wakes during polishing A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) containing a plurality of grooves ((148, 152, 156)(304, 308, 324)(404, 408, 424)(... | 09/19/2006 |
| 7066792 | Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods Systems and methods for beveling microfeature workpiece edges are disclosed. A system in accordance with one embodiment is configured to remove material from a microfeature workpiece having a first face, a second face facing opposite from the first face, an edge sur... | 06/27/2006 |
| 7040964 | Polishing media stabilizer A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support... | 05/09/2006 |
| 7018274 | Polishing pad having slurry utilization enhancing grooves A chemical mechanical polishing pad (200) that includes a polishing layer (204) having a polishing region (208) and containing a plurality of grooves (212) extending at least partially into the polishing region. During polishing, the groo... | 03/28/2006 |
| 7014549 | Polishing pad and method of making the same A polishing pad for polishing curved surfaces has a pad element having an axis, a central opening adjoining the axis and forming an inner edge, and an outer peripheral edge, first engaging means provided on the outer peripheral edge for engaging an outer periphery o... | 03/21/2006 |
| 6986706 | Polishing pad and method of producing the same A polishing pad has a working layer provided with an abrasive powder, an attaching layer for attaching a pad to a polishing head of a power tool, and a connection layer which connects the working layer with the attaching layer, the connection layer being located bet... | 01/17/2006 |
| 6979249 | CMP pad having isolated pockets of continuous porosity and a method for using such pad A chemical mechanical polishing pad and a system and a method for using such a pad are described. The polishing pad includes pockets of continuous porosity, each of the pockets being separated from the other pockets by a non-porous matrix. The non-porous matrix may ... | 12/27/2005 |
| 6974372 | Polishing pad having grooves configured to promote mixing wakes during polishing A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) containing a plurality of grooves ((148, 152, 156)(304, 308, 324)(404, 408, 424)(... | 12/13/2005 |
| 6960120 | CMP pad with composite transparent window The invention is directed to chemical-mechanical polishing pads comprising a transparent window. In one embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material comprises about 20 wt. % or more of the... | 11/01/2005 |
| 6955587 | Grooved polishing pad and method A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) having a polishing region (164, 320, 420, 504) defined by first and second boundaries ((168, 17... | 10/18/2005 |
| 6929534 | Polisher and polishing method A polisher for polishing a curved surface such as a concave surface of a spectacle lens has a structure in which a polishing pad 3 comprising water passing grooves 5 having a width W of 0.1 to 5 mm is adhered to a dome-shaped elastic base member 2 | 08/16/2005 |
| 6913527 | Edge-sealed pad for CMP process The present invention discloses a polishing pad that can facilitate process stability, extend length of use, and mitigate process non-uniformity and process induced defects for chemical mechanical planarization processes. The polishing pad of the present invention i... | 07/05/2005 |
| 6899602 | Porous polyurethane polishing pads A porous polishing pad is useful for polishing semiconductor substrates. The porous polishing pad has a porous matrix formed from a coagulated polyurethane and a non-fibrous polishing layer. The non-fibrous polishing layer has a polishing surface with a pore count o... | 05/31/2005 |
| 6896585 | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from the chemical ... | 05/24/2005 |
| 6869336 | Methods and compositions for chemical mechanical planarization of ruthenium Methods and compositions are provided for the chemical mechanical planarization of ruthenium. The method includes polishing the ruthenium layer using a low contact pressure and exposing the ruthenium layer to a planarization composition while polishing. The planariz... | 03/22/2005 |
| 6843711 | Chemical mechanical polishing pad having a process-dependent groove configuration A polishing body, e.g., pad (200, 230, 260, 300) or belt (400, 500) having a polishing layer (214, 404) that includes a backmixing region (202, 232, 262, 308, 416, 508) wherein backmixing can occur within a slurry (116) between a w... | 01/18/2005 |
| 6832947 | CMP pad with composite transparent window The invention is directed to chemical-mechanical polishing pads comprising a transparent window comprising a polymer resin having a first index of refraction and an inorganic material having a second index of refraction. The transparent window has a light transmitta... | 12/21/2004 |
| 6749485 | Hydrolytically stable grooved polishing pads for chemical mechanical planarization An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron... | 06/15/2004 |
| 6729950 | Chemical mechanical polishing pad having wave shaped grooves Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with a plurality of concentric wave-shaped grooves having different radiuses while having the same shape. Each groove has a desired depth, width, and shape. The chemical mechanica... | 05/04/2004 |
| 6705928 | Through-pad slurry delivery for chemical-mechanical polish The present invention describes an apparatus that includes a polish pad, the polish pad including a first through-opening; a vertical distribution layer located below the polish pad, the vertical distribution layer connected to the through-opening; a lateral distrib... | 03/16/2004 |
| 6645059 | Device for retaining abrasive pad on lap in eyeglass lens making apparatus A retainer for retaining an abrasive pad on a lens making machine and an abrasive pad adapted to such retention comprises a retainer nestable with a lap of a lens making machine wherein when such retainer is nested, a pad placed upon said lap before nesti... | 11/11/2003 |
| 6641463 | Finishing components and elements New, versatile finishing surfaces are described. Unitary finishing elements having discrete finishing members attached to unitary resilient body are disclosed for finishing microdevices such as semiconductor wafers. Finishing surfaces such as discrete fin... | 11/04/2003 |
| 6575825 | CMP polishing pad A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when b... | 06/10/2003 |
| 6561886 | Device for retaining abrasive pad on lap in eyeglass lens making apparatus A retainer for retaining an abrasive pad on a lens making machine and an abrasive pad adapted to such retention comprises a retainer nestable with a lap of a lens making machine wherein when such retainer is nested, a pad placed upon the lap before nestin... | 05/13/2003 |
| 6530829 | CMP pad having isolated pockets of continuous porosity and a method for using such pad A chemical mechanical polishing pad and a system and a method for using such a pad are described. The polishing pad includes pockets of continuous porosity, each of the pockets being separated from the other pockets by a non-porous matrix. The non-porous ... | 03/11/2003 |
| 6524164 | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from th... | 02/25/2003 |
| 6491570 | Polishing media stabilizer A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and ... | 12/10/2002 |
| 6458018 | Abrasive article suitable for abrading glass and glass ceramic workpieces An abrasive article is provided which comprises a backing and at least one three-dimensional abrasive coating bonded to a surface of the backing. The abrasive coating comprises a binder formed from a cured binder precursor having dispersed therein a plura... | 10/01/2002 |
| 6390891 | Method and apparatus for improved stability chemical mechanical polishing A single-layer polishing pad is grooved in a pattern having relatively large turn radius bends (i.e., greater than the 90° bends of conventional rectangular grid grooving) to improve stability. The large radius bends allow slurry to be more easily and un... | 05/21/2002 |
| 6390890 | Finishing semiconductor wafers with a fixed abrasive finishing element A fixed abrasive finishing element having a continuous phase of synthetic resin and discrete synthetic resin particles dispersed in the continuous phase of synthetic resin is described. The synthetic resin particles have abrasive particles dispersed there... | 05/21/2002 |
| 6331137 | Polishing pad having open area which varies with distance from initial pad surface A polishing pad having a cross-sectional open area which varies with depth from the pad surface is provided. The cross-sectional open area of the pad may increase and/or decrease moving away from the outer pad surface. In some cases, the cross-sectional o... | 12/18/2001 |
| 6254456 | Modifying contact areas of a polishing pad to promote uniform removal rates A polishing pad surface having a surface designed for chemical mechanical polishing of a substrate surface is described. The polishing pad surface includes a first area on the surface exposed to and capable of contacting a first amount of the substrate su... | 07/03/2001 |
| 6217426 | CMP polishing pad A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when b... | 04/17/2001 |
| 6190746 | Polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine A polishing cloth according to the present invention includes: a polishing cloth substrate; a pressure-sensitive adhesive layer laminated on one face of the polishing cloth substrate; and a release sheet attached to the pressure-sensitive adhesive layer i... | 02/20/2001 |
| 6093085 | Apparatuses and methods for polishing semiconductor wafers The present disclosure relates to a polishing pad including a pad structure having at least first and second polishing regions defined along a polishing surface of the pad structure. The first polishing region of the pad structure is less compressible tha... | 07/25/2000 |
