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| Number | Title | Issue Date |
| 7753761 | Wafer polishing apparatus and wafer polishing method The present invention provides a wafer polishing apparatus, comprising: a polishing pad to which a polishing liquid is supplied for polishing a wafer; a carrier head to carry the wafer; and one or more polishing liquid supplying device which supplies the polishing l... | 07/13/2010 |
| 7572172 | Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of t... | 08/11/2009 |
| 7438630 | Polishing method, polishing device, glass substrate for magnetic recording medium, and magnetic recording medium There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is poli... | 10/21/2008 |
| 7419419 | Slurry supply unit for CMP apparatus A slurry supply unit for a CMP apparatus is disclosed. The slurry supply unit includes a slurry flow sensor in a slurry injection pipe to measure the flow of the injected slurry, an auxiliary pump engaged with a slurry distribution line to discharge the slurry at a ... | 09/02/2008 |
| 7413497 | Chemical mechanical polishing slurry pump monitoring system and method According to one embodiment of the invention, a chemical mechanical polishing monitoring system includes a pump delivering a slurry to a polishing pad and a rotation sensing device coupled to the pump. The rotation sensing device senses a rotation of the pump and ge... | 08/19/2008 |
| 7402094 | Fixed-abrasive chemical-mechanical planarization of titanium nitride Planarizing solutions, and their methods of use, for removing titanium nitride from the surface of a substrate using a fixed-abrasive planarizing pad. The planarizing solutions take the form of an etchant solution or an oxidizing solution. The etchant solutions are ... | 07/22/2008 |
| 7390240 | Method of shaping and forming work materials Method of processing a workpiece comprising (a) providing a tool and a workpiece, wherein the workpiece has an initial shape; (b) placing the workpiece and the tool in contact to form an interface, applying force to the tool and/or the workpiece, and moving the tool... | 06/24/2008 |
| 7384329 | Coolant delivery system for grinding tools An abrasive grinding wheel having an annular grinding face depending from a substantially circular body includes a tubular inner wall which defines an axial bore configured to convey coolant in a downstream direction therethrough. The inner wall is coupled to a conc... | 06/10/2008 |
| 7367867 | Two-side working machine A two-side working machine, comprising an upper and a lower working disc which hold on, and are fixed to, an upper and a lower carrier disc, and which are disposed coaxially with each other and are adapted to be rotationally driven relative to each other by a workin... | 05/06/2008 |
| 7367871 | Semiconductor processing methods of removing conductive material The invention includes a semiconductive processing method of electrochemical-mechanical removing at least some of a conductive material from over a surface of a semiconductor substrate. A cathode is provided at a first location of the wafer, and an anode is provided... | 05/06/2008 |
| 7364600 | Slurry for CMP and method of polishing substrate using same Disclosed herein is a polishing slurry and a method of producing the same. The polishing slurry has high selectivity in terms of a polishing speed of an oxide layer to that of a nitride layer used in CMP of an STI process which is essential to produce ultra highly i... | 04/29/2008 |
| 7361603 | Passivative chemical mechanical polishing composition for copper film planarization A CMP composition containing 5-aminotetrazole, e.g., in combination with oxidizing agent, chelating agent, abrasive and solvent and a method of use. Such CMP composition may be diluted during the CMP polish to minimize the occurrence of dishing or other adverse plan... | 04/22/2008 |
| 7357694 | Jet singulation Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable... | 04/15/2008 |
| 7357700 | Riding floor polishing and grinding machine for treating concrete, terrazzo, stone and similar surfaces The invention is a riding floor polishing and grinding machine that uses one or more gangs of polishing heads (242) to treat concrete and similar surface flooring (208). A compact vehicle (210) equipped with a front loader arm (235) is fi... | 04/15/2008 |
| 7347767 | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece duri... | 03/25/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7338352 | Slurry delivery system, chemical mechanical polishing apparatus and method for using the same A slurry delivery system, a chemical mechanical polishing (CMP) apparatus, and method for using the same are provided. An apparatus for supplying slurry to a polishing unit may include a first feed line through which an abrasive may be supplied at a first velocity. ... | 03/04/2008 |
| 7337672 | Method for inspecting grinding wheels This invention discloses a method of evaluating the internal structure of a grinding wheel through ultrasonic inspection. ... | 03/04/2008 |
| 7331844 | Polishing method A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow... | 02/19/2008 |
| 7327034 | Compositions for planarization of metal-containing surfaces using halogens and halide salts A planarization method includes providing a metal-containing surface (preferably, a Group VIII metal-containing surface, and more preferably a platinum-containing surface) and positioning it for contact with a polishing surface in the presence of a planarization com... | 02/05/2008 |
| 7316603 | Compositions and methods for tantalum CMP A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises an abrasive, an organic oxidizer, and a liquid carrier therefor. The organic oxidizer has a standard redox potential (E0) of not more than about 0.5 V relative to a standard... | 01/08/2008 |
| 7314402 | Method and apparatus for controlling slurry distribution A method and apparatus for ‘through-the-pad’ delivery of slurry polishing agents directly to the land areas of a polishing pad is disclosed. The present invention further provides for improved control of the chemical composition of the slurry to address loss of ... | 01/01/2008 |
| 7312160 | Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device The removing solution containing a cerium (IV) nitrate salt, periodic acid or a hypochlorite can be applied to metals containing copper, silver or palladium and also to metals containing other metals having a relatively large oxidation-reduction potential. ... | 12/25/2007 |
| 7306508 | Multi-wire saw A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating th... | 12/11/2007 |
| 7294044 | Slurry composition and method for polishing organic polymer-based ophthalmic substrates The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and a pyrrolidone compound. The abrasive ... | 11/13/2007 |
| 7291057 | Apparatus for polishing a substrate A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extend... | 11/06/2007 |
| 7291058 | Method and apparatus for improving media flow The flow of media in shot peening, blast cleaning, and similar equipment is improved by applying a time varying magnetic field to the media to thereby degauss the media, allowing the media to flow through equipment without clogging and clumping due to magnetic attra... | 11/06/2007 |
| 7288021 | Chemical-mechanical polishing of metals in an oxidized form The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized form, (b) contacting a portion of the substrate with a chemical-mechanic... | 10/30/2007 |
| 7287314 | One step copper damascene CMP process and slurry A Chemical Mechanical Polish (CMP) process and slurry therefore slurry that is capable of removing NiFe, SiO2, Photoresist, Ta, alumina and Cu at substantially the same rate. The slurry is useful for obtaining a substantially planar surface of several materials whil... | 10/30/2007 |
| 7267605 | Method and apparatus for abrasive recycling and waste separation system The present invention provides a method of handling abrasive solids materials used in an abrasive cutting procedure which jets a high-pressure abrasive slurry through a nozzle (7) onto a work piece over and/or in a catcher tank (8). This handling metho... | 09/11/2007 |
| 7261619 | Method and apparatus for abrasive recycling and waste separation system The present invention provides a method of handling abrasive solids materials used in an abrasive cutting procedure which jets a high-pressure abrasive slurry through a nozzle (7) onto a work piece over and/or in a catcher tank (8). This handling metho... | 08/28/2007 |
| 7258598 | Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mi... | 08/21/2007 |
| 7255631 | Orbital polishing apparatus and method An abrasive flow apparatus for polishing a workpiece wherein a horizontal machine tool is adapted such that a workpiece may be secured to first shaft rotatable about a first longitudinal axis. A conjugate form to the workpiece may be secured to a second shaft which ... | 08/14/2007 |
| 7250330 | Method of making an electronic package A method of making an electronic package is described, wherein a substrate is provided with a pattern of conductive pads and a portion of solder positioned on selected ones of the pattern of copper pads. The solder is then reflowed to form partial hemispherically sh... | 07/31/2007 |
| 7249995 | Apparatus and method for feeding slurry A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow... | 07/31/2007 |
| 7246427 | Method to achieve both narrow track width and effective longitudinal stabilization in a CPP GMR read head Biasing schemes used for CIP GMR devices were previously thought to be impractical for CPP devices due to current shunting by the abutted hard magnets. In the present invention the CPP stripe is a narrow conductor directly above the free layer. The resistivity of th... | 07/24/2007 |
| RE39714 | Hand-holdable gas/abrasion apparatus A hand-holdable apparatus useful for abrading a surface is provided. The invention is particularly useful for dental applications using a stream of abrasive particles suspended in a gas stream to abrade the surface of a tooth. The apparatus of the invention may be m... | 07/03/2007 |
| 7237321 | Method for fabricating a CPP magnetic transducer using CMP-assisted lift-off and a CMP-resistant metal layer A method is described which uses a CMP resistant metal layer to replace the upper dielectric layer in the track width definition phase of a TMR or CPP spin valve magnetic head. The metal which is selected to be resistant to the CMP process can be rhodium (Rh), plati... | 07/03/2007 |
| 7232360 | Uninterrupted abrasive fluid supply A substantially uninterrupted flow of a pressurised abrasive slurry is maintained by successively charging each of a plurality of vessels V1, V2 with an abrasive material while discharging an abrasive slurry from another of the vessels at a common outl... | 06/19/2007 |
| 7232363 | Polishing solution retainer A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing... | 06/19/2007 |
