Celebrity Inventors
Actress Jamie Lee Curtis is a patented inventor - she created a diaper equipped with a premoistened baby wipe. And that's no act!
PatentStorm News
Make the Most of PatentStorm
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest patents by subscribing to an RSS feed.
Got questions? Ask a Patent Expert!
Registered users: Manage your profile, comments and alerts.
| Number | Title | Issue Date |
| 7674156 | Cleaning device for chemical mechanical polishing equipment A cleaning device for chemical-mechanical equipment, which includes: an irrotatable center shaft irrotatably coupled with a spindle which is rotated, the irrotatable center shaft including a first channel and a second channel formed in an interior of the irrotatable... | 03/09/2010 |
| 7658666 | Superhard cutters and associated methods A cutting device comprises a plurality of individual polycrystalline cutting elements secured in a solidified organic material layer. Each of the plurality of individual polycrystalline cutting elements has a substantially matching geometric configuration. ... | 02/09/2010 |
| 7651386 | Methods of bonding superabrasive particles in an organic matrix Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protrudin... | 01/26/2010 |
| 7637802 | Lapping plate resurfacing abrasive member and method A lapping machine includes a lapping plate, and a workpiece carrier with a workpiece-holding hole disposed on the plate, a workpiece being fitted within the hole in the carrier. The workpiece is lapped while the plate and the carrier are individually rotated and loo... | 12/29/2009 |
| 7611400 | Smart conditioner rinse station A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioni... | 11/03/2009 |
| 7597608 | Pad conditioning device with flexible media mount A method and apparatus for conditioning is provided. In one embodiment, a conditioning disk includes a plurality of conditioning elements each having an abrasive working surface, and a flexible foundation having the conditioning elements coupled thereto. The flexibl... | 10/06/2009 |
| 7559827 | Dresser and apparatus for chemical mechanical polishing and method of dressing polishing pad A dresser adapted to a chemical mechanical polishing apparatus is used to perform dressing on a polishing pad for polishing a semiconductor wafer such that a circular-shaped support surface thereof is positioned opposite to and in contact with the polishing surface ... | 07/14/2009 |
| 7520796 | Polishing pad with grooves to reduce slurry consumption A chemical mechanical polishing pad having an annular polishing track and a concentric center O. The polishing pad includes a polishing layer having a plurality of pad grooves formed therein. The polishing pad is designed for use with a carrier, e.g., a wafer carrie... | 04/21/2009 |
| 7510463 | Extended life conditioning disk The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafer... | 03/31/2009 |
| 7503836 | Method of dressing grindstone for processing eyeglass lens, and dressing tool used in the method A method of dressing a grindstone for processing an eyeglass lens, comprises the step of pressing a melamine resin foam, which is used as a dressing tool, against a rotating grindstone. ... | 03/17/2009 |
| 7500904 | Glass substrate for information recording medium and method for producing same A glass substrate for an information recording medium is manufactured by polishing the surface of a raw material glass plate. The polishing of the raw material glass plate is divided into a step for performing a first polishing process to roughly polish the surface ... | 03/10/2009 |
| 7491116 | CMP pad dresser with oriented particles and associated methods CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser ... | 02/17/2009 |
| 7467989 | Ceramic polishing pad dresser and method for fabricating the same A ceramic polishing pad dresser and the method for fabricating the same are provided. Abrasive particles are adhered onto a ceramic substrate by heating a ceramic powder to be vitrified, thus forming a ceramic diamond disk. Meanwhile, a plastic base is mounted on th... | 12/23/2008 |
| 7452264 | Pad cleaning method A method for cleaning a polishing pad is disclosed. In CMP and ECMP, a polishing pad must be conditioned to obtain good and predictable polishing results. During conditioning, debris is generated that must be removed to prevent processing defects. An effective metho... | 11/18/2008 |
| 7442646 | Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry A slurry, chemical mechanical polishing (CMP) method using the slurry, and method of forming metal wiring using the slurry. The slurry may include a polishing agent, an oxidant, and at least one defect inhibitor to protect the metal film. The CMP method and method o... | 10/28/2008 |
| 7435157 | Grinding machine, computer software to operate such a machine, and their uses therefor An extremely precise computer controlled grinding machine having the capability to write its own computer programs for controlling the grinding machine to perform individual tasks, including both grinding and dressing to several millionths of an inch. A new device f... | 10/14/2008 |
| 7425172 | Customized polish pads for chemical mechanical planarization A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteri... | 09/16/2008 |
| 7422513 | Porous abrasive articles with agglomerated abrasives A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 and 1400° C., and the sintere... | 09/09/2008 |
| 7415978 | Assembly and a method for cutting or forming an object A method and an apparatus 10 for cutting an object 64, such as a grinding wheel. Particularly, the object 64 is placed in a horizontal manner and concomitantly rotated with the cutter 14 during the entire cutting operation. The rotation o... | 08/26/2008 |
| 7413498 | Lapping apparatus and lapping method A film feeder (FF1) feeds a film (1), a first drive (20) rotates a work (W), a second drive (30) moves the work (W) relative to the film (1), a shoe set handler (40) handles the shoe set (2) to press the film (1 | 08/19/2008 |
| 7410410 | Method and apparatus to produce a GRM lapping plate with fixed diamond using electro-deposition techniques A system and method are described for manufacturing a lapping plate. Diamond particles are premixed with a metal matrix. The diamond particles are electro-deposited onto the surface of a lapping plate. The lapping plate may have a substrate of hard metal with a soft... | 08/12/2008 |
| 7410411 | Method of determining the number of active diamonds on a conditioning disk The invention relates to a method for determining the number of active diamonds on a conditioning disk. In particular, the method comprises (a) contacting a diamond conditioner disk with a hard surface, wherein the diamond-containing side of the diamond conditioning... | 08/12/2008 |
| 7393261 | Cylindrical grinding method for producing hard metal tools and cylindrical grinding machine for grinding cylindrical starting bodies during the production of hard metal tools The invention relates to a grinding method and to a cylindrical grinding machine, in which a sintered hard metal round rod is completely pushed through a chuck of a workpiece spindle head, said chuck having chuck jaws. Two backrest seats are ground on the freely pro... | 07/01/2008 |
| 7370659 | Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines Stepper and/or scanner machines including cleaning devices and methods for cleaning stepper and/or scanner machines are disclosed herein. In one embodiment, a stepper and/or scanner machine includes a housing, an illuminator, a lens, a workpiece support, a cleaning ... | 05/13/2008 |
| 7371152 | Non-uniform subaperture polishing A method for subaperture polishing includes determining a first portion of a sample to be polished disproportionately compared to a second portion of the sample. Based on the determination of the first portion, a sweep frequency that is a first rate of lateral motio... | 05/13/2008 |
| 7371155 | Glass substrate for information recording medium and method for producing same A glass substrate for an information recording medium is manufactured by polishing the surface of a raw material glass plate. The polishing of the raw material glass plate is divided into a step for performing a first polishing process to roughly polish the surface ... | 05/13/2008 |
| 7371156 | Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system. The off-line tool comprises a platen having a first surface for holding a polishing pad and a motor for rotating the polishing pad. The motor is coupled to ... | 05/13/2008 |
| 7367866 | Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups a... | 05/06/2008 |
| 7367875 | CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same The present invention relates to a composite material and the method of making same, which comprises a CVD diamond coating applied to a composite substrate of ceramic material and an unreacted carbide-forming material of various configurations and for a variety of a... | 05/06/2008 |
| 7367872 | Conditioner disk for use in chemical mechanical polishing A conditioner disk for use on a polish pad in chemical mechanical polishing process includes a base structure a plurality of curved blades supported by the base structure. The blades radiate outwardly from a center region of the base structure and curve in a common ... | 05/06/2008 |
| 7364502 | Cutting wheel The present invention relates to an improved cutting wheel, comprising a disk-shaped abrasive body having two opposite faces and a non-uniform thickness. ... | 04/29/2008 |
| 7354333 | Detection of diamond contamination in polishing pad Methods for reconditioning a polishing pad and detecting diamond contamination of the polishing pad, are disclosed. In particular, the methods include the step of exposing the reconditioned polishing pad to an energy source to induce the diamond contamination to flu... | 04/08/2008 |
| 7354337 | Pad conditioner, pad conditioning method, and polishing apparatus The present invention provides: a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising a bending or deflecting or elastic member and a supporting section to support a base end of the bending... | 04/08/2008 |
| 7348276 | Fabrication process of semiconductor device and polishing method A method of fabricating a semiconductor device includes a polishing process of a substrate, wherein the polishing process includes the steps of applying a chemical mechanical polishing process to the substrate on a polishing pad while using slurry, and conditions a ... | 03/25/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7341501 | Gear grinding machine, method for dressing threaded grinding wheel and method for grinding work A gear grinding machine, a method for dressing a threaded grinding wheel, and a method for grinding a work are disclosed. A dressing tool is rotated in a vertical plane, with its position being fixed. The position of a threaded grinding wheel is NC-controlled, where... | 03/11/2008 |
| 7331845 | Double end face truing device, double end face truing tool, and double end face truing method First and second end surface truing sections are formed by protruding cylindrical first and second base bodies from opposite end surfaces of a disc-like base of an opposite end surface truing tool in the axial direction thereof and by providing on the external surfa... | 02/19/2008 |
| 7322879 | Reprofiling device for the rails of railroads that captures waste A device for the continuous reprofiling of the rails of railroads includes at least one abrasive rail reprofiling unit (2) guided along the railroad tracks and comprising at least one abrasive disk (3) that can be pressed against a rail (1). Thi... | 01/29/2008 |
| 7316603 | Compositions and methods for tantalum CMP A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises an abrasive, an organic oxidizer, and a liquid carrier therefor. The organic oxidizer has a standard redox potential (E0) of not more than about 0.5 V relative to a standard... | 01/08/2008 |
| 7306506 | In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging Chemical-mechanical planarization (CMP) apparatus and methods for detecting polishing pad properties using ultrasonic imaging is presented. An ultrasonic probe assembly transmits ultrasonic signals onto the surface of a polishing pad during a CMP process. Reflected ... | 12/11/2007 |