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Class 451/56 - With tool treating or forming


Subclass of Class 451 - Abrading
Definition: Method wherein the abradant, either particulate material
No. of patents: 860
Last issue date: 01/31/2012


1                      
NumberTitleIssue Date
8105131Method and apparatus for removing material from microfeature workpieces
Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface....
01/31/2012
8016644Method and apparatus for micro-machining a surface
An apparatus and method for micro-machining a surface of a workpiece having a complex surface profile including desired profile features and finer undesired profile features to be removed, including shaping a formable polishing tool using either the workpiece itself...
09/13/2011
7997958Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for conditioning a polishing pad includes a member having a first surface and a plurality of contact elements p...
08/16/2011
7963826Apparatus and methods for conditioning a polishing pad
Apparatus and methods for conditioning a polishing pad include an arm adapted to support a conditioning disk; a drive mechanism coupled to the arm; and a flexible coupling between the drive mechanism and the conditioning disk adapted to allow the conditioning disk t...
06/21/2011
7934978Ice skate blade sharpening machine
A ice skate blade sharpening machine comprises a skate holder which holds the blade in a releasably fixed position, a rotatable grinding wheel having a periphery and rotatable about a grinding wheel axis, and a contouring tool having a contour surface, moveable betw...
05/03/2011
7922563Cutting blade hard-facing method and apparatus
A hard-faced cutting blade and hard-facing method is provided. A hard-facing material is applied to a cutting edge of a cutting blade such that a heat-affected transition zone may be created between the base metal and the hard-facing material. The heat-affected tran...
04/12/2011
7914363Smart conditioner rinse station
A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioni...
03/29/2011
7901272Methods of bonding superabrasive particles in an organic matrix
Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protrudin...
03/08/2011
7798888Diamond wire saw
A diamond wire saw with an improved structure is provided. The diamond wire saw is capable of cutting operation along curved paths with small radii of curvature. In addition, the diamond wire saw is configured to prevent a diamond particle layer covering a surface t...
09/21/2010
7762871Pad conditioner design and method of use
A polishing pad conditioning apparatus includes a laser beam generating unit along with a system to transmit or focus the beam. The unit is mounted on a conditioning arm, such that the laser beam may be directed perpendicular to the plane of the polishing pad, which...
07/27/2010
7731569Pad conditioner, pad conditioning method, and polishing apparatus
A pad conditioning apparatus and method for conditioning a surface of a polishing pad which is used in a polishing apparatus for polishing works, having a bending or deflecting or elastic member and a supporting section to support a base end of the bending or deflec...
06/08/2010
7713109Quick-change grinding pad and mounting system
A quick change mounting system for grinding and other surface preparation pads provides a simple and effective way for the pads to be mounted and changed on the mounting plate of a large surface preparation machine without removing the mounting plate from the machin...
05/11/2010
7708622Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for conditioning a polishing pad includes a member having a first surface and a plurality of contact elements p...
05/04/2010
7674156Cleaning device for chemical mechanical polishing equipment
A cleaning device for chemical-mechanical equipment, which includes: an irrotatable center shaft irrotatably coupled with a spindle which is rotated, the irrotatable center shaft including a first channel and a second channel formed in an interior of the irrotatable...
03/09/2010
7658666Superhard cutters and associated methods
A cutting device comprises a plurality of individual polycrystalline cutting elements secured in a solidified organic material layer. Each of the plurality of individual polycrystalline cutting elements has a substantially matching geometric configuration. ...
02/09/2010
7651386Methods of bonding superabrasive particles in an organic matrix
Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protrudin...
01/26/2010
7637802Lapping plate resurfacing abrasive member and method
A lapping machine includes a lapping plate, and a workpiece carrier with a workpiece-holding hole disposed on the plate, a workpiece being fitted within the hole in the carrier. The workpiece is lapped while the plate and the carrier are individually rotated and loo...
12/29/2009
7611400Smart conditioner rinse station
A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioni...
11/03/2009
7597608Pad conditioning device with flexible media mount
A method and apparatus for conditioning is provided. In one embodiment, a conditioning disk includes a plurality of conditioning elements each having an abrasive working surface, and a flexible foundation having the conditioning elements coupled thereto. The flexibl...
10/06/2009
7559827Dresser and apparatus for chemical mechanical polishing and method of dressing polishing pad
A dresser adapted to a chemical mechanical polishing apparatus is used to perform dressing on a polishing pad for polishing a semiconductor wafer such that a circular-shaped support surface thereof is positioned opposite to and in contact with the polishing surface ...
07/14/2009
7520796Polishing pad with grooves to reduce slurry consumption
A chemical mechanical polishing pad having an annular polishing track and a concentric center O. The polishing pad includes a polishing layer having a plurality of pad grooves formed therein. The polishing pad is designed for use with a carrier, e.g., a wafer carrie...
04/21/2009
7510463Extended life conditioning disk
The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafer...
03/31/2009
7503836Method of dressing grindstone for processing eyeglass lens, and dressing tool used in the method
A method of dressing a grindstone for processing an eyeglass lens, comprises the step of pressing a melamine resin foam, which is used as a dressing tool, against a rotating grindstone. ...
03/17/2009
7500904Glass substrate for information recording medium and method for producing same
A glass substrate for an information recording medium is manufactured by polishing the surface of a raw material glass plate. The polishing of the raw material glass plate is divided into a step for performing a first polishing process to roughly polish the surface ...
03/10/2009
7491116CMP pad dresser with oriented particles and associated methods
CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser ...
02/17/2009
7467989Ceramic polishing pad dresser and method for fabricating the same
A ceramic polishing pad dresser and the method for fabricating the same are provided. Abrasive particles are adhered onto a ceramic substrate by heating a ceramic powder to be vitrified, thus forming a ceramic diamond disk. Meanwhile, a plastic base is mounted on th...
12/23/2008
7452264Pad cleaning method
A method for cleaning a polishing pad is disclosed. In CMP and ECMP, a polishing pad must be conditioned to obtain good and predictable polishing results. During conditioning, debris is generated that must be removed to prevent processing defects. An effective metho...
11/18/2008
7442646Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry
A slurry, chemical mechanical polishing (CMP) method using the slurry, and method of forming metal wiring using the slurry. The slurry may include a polishing agent, an oxidant, and at least one defect inhibitor to protect the metal film. The CMP method and method o...
10/28/2008
7435157Grinding machine, computer software to operate such a machine, and their uses therefor
An extremely precise computer controlled grinding machine having the capability to write its own computer programs for controlling the grinding machine to perform individual tasks, including both grinding and dressing to several millionths of an inch. A new device f...
10/14/2008
7425172Customized polish pads for chemical mechanical planarization
A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteri...
09/16/2008
7422513Porous abrasive articles with agglomerated abrasives
A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 and 1400° C., and the sintere...
09/09/2008
7415978Assembly and a method for cutting or forming an object
A method and an apparatus 10 for cutting an object 64, such as a grinding wheel. Particularly, the object 64 is placed in a horizontal manner and concomitantly rotated with the cutter 14 during the entire cutting operation. The rotation o...
08/26/2008
7413498Lapping apparatus and lapping method
A film feeder (FF1) feeds a film (1), a first drive (20) rotates a work (W), a second drive (30) moves the work (W) relative to the film (1), a shoe set handler (40) handles the shoe set (2) to press the film (1
08/19/2008
7410411Method of determining the number of active diamonds on a conditioning disk
The invention relates to a method for determining the number of active diamonds on a conditioning disk. In particular, the method comprises (a) contacting a diamond conditioner disk with a hard surface, wherein the diamond-containing side of the diamond conditioning...
08/12/2008
7410410Method and apparatus to produce a GRM lapping plate with fixed diamond using electro-deposition techniques
A system and method are described for manufacturing a lapping plate. Diamond particles are premixed with a metal matrix. The diamond particles are electro-deposited onto the surface of a lapping plate. The lapping plate may have a substrate of hard metal with a soft...
08/12/2008
7393261Cylindrical grinding method for producing hard metal tools and cylindrical grinding machine for grinding cylindrical starting bodies during the production of hard metal tools
The invention relates to a grinding method and to a cylindrical grinding machine, in which a sintered hard metal round rod is completely pushed through a chuck of a workpiece spindle head, said chuck having chuck jaws. Two backrest seats are ground on the freely pro...
07/01/2008
7371155Glass substrate for information recording medium and method for producing same
A glass substrate for an information recording medium is manufactured by polishing the surface of a raw material glass plate. The polishing of the raw material glass plate is divided into a step for performing a first polishing process to roughly polish the surface ...
05/13/2008
7371152Non-uniform subaperture polishing
A method for subaperture polishing includes determining a first portion of a sample to be polished disproportionately compared to a second portion of the sample. Based on the determination of the first portion, a sweep frequency that is a first rate of lateral motio...
05/13/2008
7371156Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system
An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system. The off-line tool comprises a platen having a first surface for holding a polishing pad and a motor for rotating the polishing pad. The motor is coupled to ...
05/13/2008
7370659Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines
Stepper and/or scanner machines including cleaning devices and methods for cleaning stepper and/or scanner machines are disclosed herein. In one embodiment, a stepper and/or scanner machine includes a housing, an illuminator, a lens, a workpiece support, a cleaning ...
05/13/2008
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