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| Number | Title | Issue Date |
| 8182314 | Automated edged lens deblocking system A lens deblocking system (1) used for removing a lens (51) from an edging block (22). The system (1) includes opposed movable arms (4, 5) that are constrained to travel longitudinally within an aperture (3) so as to grip a l... | 05/22/2012 |
| 8137161 | Disk-shaped substrate manufacturing method The disk-shaped substrate manufacturing method is provided with: generating an air stream downward from an upper area during grinding a disk-shaped substrate in a grinding apparatus; arranging the grinding apparatus on an upper floor face of a floor and arranging wa... | 03/20/2012 |
| 8100742 | Grinding method for wafer having crystal orientation A grinding method for a wafer having a mark indicating the crystal orientation. The grinding method includes a first grinding step for grinding the upper surface of the wafer by rotating a chuck table holding the wafer thereon, rotating a grinding ring, positioning ... | 01/24/2012 |
| 8052505 | Wafer processing method for processing wafer having bumps formed thereon A wafer processing method for processing a wafer (20) having bumps (B) formed on a front surface (21) comprises the steps of: holding on a table (51), a bump region-conforming member (40) that has an outer shape conforming only to a bump ... | 11/08/2011 |
| 8038512 | Glass substrate for information recording medium and method for manufacturing same A method for manufacturing a glass substrate for an information recording medium having a high level of cleanness and superior smoothness. The manufacturing method includes washing a disk-shaped glass plate with an acid washing liquid, removing at least part of a su... | 10/18/2011 |
| 7931523 | Glass substrate for information recording medium and method for manufacturing same A method for manufacturing a glass substrate for an information recording medium having a high level of cleanness and superior smoothness. The manufacturing method includes washing a disk-shaped glass plate with an acid washing liquid, removing at least part of a su... | 04/26/2011 |
| 7597607 | Magnetic recording tape edge processing A method for manufacturing magnetic recording tape includes applying a front coat including a magnetic component to a substrate to provide a coated substrate. The coated substrate defines a first face and an opposing, second face, the first face extending between a ... | 10/06/2009 |
| 7591714 | Wafer grinding and tape attaching apparatus and method A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer. ... | 09/22/2009 |
| 7438631 | Surface-protecting sheet and semiconductor wafer lapping method It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and fouling of a wafer even when a wafer having high bumps which are hig... | 10/21/2008 |
| 7429209 | Method of polishing a glass substrate for use as an information recording medium An information recording medium glass substrate manufactured by polishing the surface of a raw material glass plate. The polishing is divided into two steps, a step for performing a first polishing process to roughly polish the surface of the raw material glass plat... | 09/30/2008 |
| 7404988 | Headlight lens resurfacing apparatus and method Refinishing an exterior automotive lens having a damaged exterior surface in situ using a continuous movement and oscillating motion, with first, a 320 grit sanding disc, next a 600 grit sanding disc and finally a 1500 grit sanding pad while flushing the surface wit... | 07/29/2008 |
| 7402096 | Device for machining material plates A device for working of glass panes (1) has a support (5) for the glass panes (1) and a nozzle (2) from which a water jet emerges for cutting the glass panes (1). The nozzle (2) can be moved on a guide (8) parallel to... | 07/22/2008 |
| 7347765 | Honing installation with several work stations A honing installation for honing workpieces comprises a plurality of work stations, each work station being configured for performing at least one working step on a workpiece and at least part of the work station is set up as a honing station for performing at least... | 03/25/2008 |
| 7341503 | Surface treating method for golf club head A surface treating method for a golf club head includes applying polishing pretreatment on a golf club head and grinding at least one surface of the golf club head with a resilient grinding rod. The resilient grinding rod includes at least one resilient matrix and a... | 03/11/2008 |
| 7335089 | Water jet stripping and recontouring of gas turbine buckets and blades A method for water jet stripping and recontouring of a coated article of manufacture is provided. The method includes dimensionally scanning the coated article and establishing a three-dimensional model for the coated article. The method further includes establishin... | 02/26/2008 |
| 7322877 | Production method for optical lens The method for making an optical lens according to the present invention is characterized in comprising: a optical lens preform fabrication step of fabricating a optical lens preform which comprises a first curved portion which serves as an optically functioning par... | 01/29/2008 |
| 7303463 | Semiconductor wafer polishing apparatus, and method of polishing semiconductor wafer Aimed at thoroughly preventing abrasive and dusts from adhering onto the circuit-forming region of a wafer, improving yield ratio of semiconductor devices, and thereby improving operation rates of the individual manufacturing apparatuses in the succeeding stage, a s... | 12/04/2007 |
| 7278904 | Method of abrading a workpiece A method of abrading a surface of a workpiece with a structured abrasive article in the presence of a liquid comprising water and at least one of a sulfonate or sulfate anionic surfactant. ... | 10/09/2007 |
| 7278906 | Adhesive tape and edging method using same An adhesive tape which is to be arranged between a lens and at least one of a plurality of chucks in an edge-machining apparatus comprises an adhesive face for being in contact with the lens. A measurement of an adhesive strength of the adhesive face is 4 gf (0.0392... | 10/09/2007 |
| 7276193 | Method for forming ultrafine particle brittle material at low temperature and ultrafine particle brittle material for use therein A method for forming an ultrafine particle brittle material at low temperature which includes the steps of applying a mechanical impact force or a pressure to a ultrafine particle brittle material so as to have a percentage in the ultrafine particles having a primar... | 10/02/2007 |
| 7273406 | Glass treatment system and method A system for abrading and scoring glass. An abrading/scoring station includes a table for supporting a large sheet of glass on a generally flat support. A first tool support moves an abrading tool for abrading a coating material from the glass. A second tool support... | 09/25/2007 |
| 7267603 | Back grinding methods for fabricating an image sensor Back grinding methods for fabricating an image sensor are disclosed. An example method of back grinding an image sensor comprises: forming a profile anti-deformation film on a micro lens of the image sensor; grinding a backside of a semiconductor substrate of the im... | 09/11/2007 |
| 7264539 | Systems and methods for removing microfeature workpiece surface defects Systems and methods for removing microfeature workpiece surface defects are disclosed. A method for processing a microfeature workpiece in accordance with one embodiment includes removing surface defects from a surface of a microfeature workpiece by engaging the sur... | 09/04/2007 |
| 7254900 | Wafer edge wheel with drying function An edge wheel for supporting and rotating a disk-shaped substrate includes a wheel body having a peripheral groove configured to support an edge of a substrate and at least one radial channel extending into said wheel body from said peripheral groove. An edge wheel ... | 08/14/2007 |
| 7238087 | Planarizing device and a planarization method for semiconductor substrates A substrate-planarizing device and method of using the device comprising a substrate storage stage outside a room, and on a base inside the room, a multi-joint transfer robot, a temporary alignment platform, a movable transfer pad, a grinding process stage in which ... | 07/03/2007 |
| 7235003 | Method and apparatus for grinding of concrete floors A method for dry finishing of a floor surface consisting of concrete, stone, marble, terrazzo, densite or other hard materials is disclosed. The method comprises finishing of the floor surface using a cutting, grinding and/or polishing tool. In the method, a vapor o... | 06/26/2007 |
| 7220173 | Wafer holder and wafer conveyor system equipped with the same The present invention is directed to a wafer holder and a related wafer conveyor system. The wafer holder holds a wafer and moves horizontally within a chamber. A contact area between the wafer and the wafer holder is reduced, and potential contaminants generated by... | 05/22/2007 |
| 7210987 | Wafer grinding method Methods for grinding low-K interlayer dielectric (ILD) wafers are described herein. In various embodiments, the method may include cutting and severing a semiconductor wafer into a plurality of portions, the cutting and severing being performed in a manner that allo... | 05/01/2007 |
| 7204742 | Polishing pad comprising hydrophobic region and endpoint detection port The invention provides a chemical-mechanical polishing pad comprising a polishing layer comprising a hydrophobic region, a hydrophilic region, and an endpoint detection port. The hydrophobic region is substantially adjacent to the endpoint detection port. The hydrop... | 04/17/2007 |
| 7201633 | Systems and methods for wafer polishing An electromagnetic polish head (100) comprises at least one electromagnet. An embodiment may also include the addition of a slurry component or components that can be affected by an electromagnetic field. During polishing or planarization, a field or fields m... | 04/10/2007 |
| 7198545 | Method of calibration and data evaluation for eddy current metrology systems Methods are provided for calibrating a tool using an eddy current probe and calibration wafers that each have a measurable predetermined property and a measurement of the measurable predetermined property of a first calibration wafer is different than a measurement ... | 04/03/2007 |
| 7198552 | Polishing apparatus A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable wi... | 04/03/2007 |
| 7193805 | Flying-type disk drive slider with micropad A slider (2′) with a reduced fly height is disclosed. The slider includes a small micropad (66) on the lower surface (22′) of the slider (2′). A sensor region (62) of a head (61) that is carried by the slider (2... | 03/20/2007 |
| 7189145 | Method of and apparatus for producing roll A belt grinding is integrated with an electroerosion machine for contouring the working surface of a mill roll and providing a texture thereon. The belt grinder can superfinish the roll and remove peaks in the surface without significantly affecting the mean surface... | 03/13/2007 |
| 7182673 | Method and apparatus for post-CMP cleaning of a semiconductor work piece A method and apparatus are provided for post-CMP cleaning of a semiconductor work piece. The method comprises the steps of subjecting the work piece to a first cleaning composition having one of an acidic pH and a basic pH and subjecting the work piece to a second c... | 02/27/2007 |
| 7172497 | Fabrication of semiconductor interconnect structures A system and a method of forming copper interconnect structures in a surface of a wafer is provided. The method includes a step of performing a planar electroplating process in an electrochemical mechanical deposition station for filling copper material into a plura... | 02/06/2007 |
| 7169015 | Apparatus for optical inspection of wafers during processing The present invention is aimed to provide a measurement system installable within a processing equipment and more specifically within the exit station of a polishing machine. The optical scheme of this system includes a spectrophotometric channel, an imaging channel... | 01/30/2007 |
| 7163446 | Vehicle headlight restoration A method of restoring a discolored automobile headlight lens without removal of the lens from the automobile consistent with certain embodiments involves wet abrading an outer surface of the lens with successively finer grit wet sanding disks, using a low speed rota... | 01/16/2007 |
| 7160180 | Substrate delivery mechanism A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring ... | 01/09/2007 |
| 7153191 | Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods are disclosed. A method in accordance with one embodiment of the invention includes disposing a polishing liquid on a polishing surface of a microf... | 12/26/2006 |
