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| Number | Title | Issue Date |
| 7815496 | Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same The surface(s) of a polishing pad for polishing an object has a first portion including hydrophilic material and a second portion including hydrophobic material. The first portion of the polishing surface is located in a first region of the polishing pad and the sec... | 10/19/2010 |
| 7645186 | Chemical mechanical polishing pad manufacturing assembly A chemical mechanical polishing pad manufacturing assembly is provided having a subpad layer having a top surface and a bottom surface; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate... | 01/12/2010 |
| 7427340 | Conductive pad A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made of a conductive composite disposed on a conductive carrier. The raised... | 09/23/2008 |
| 7374476 | Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates A planarizing pad for planarizing a microelectronic substrate, and a method and apparatus for forming the planarizing pad. In one embodiment, planarizing pad material is mixed with compressed gas to form a plurality of discrete elements that are distributed on a fil... | 05/20/2008 |
| 7364501 | Sanding block and method of making same A sanding block includes a compressible core having at least one pair of sides characterized such that an abrasive material is adhered to said sides substantially along the surface thereof and having a juncture area defined between said two sides which does not have... | 04/29/2008 |
| 7329171 | Fixed abrasive article for use in modifying a semiconductor wafer An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element. ... | 02/12/2008 |
| 7275980 | Abrasive articles with novel structures and methods for grinding Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade, but are characterized by excellent mechanical strength and grinding p... | 10/02/2007 |
| 7273407 | Transparent polishing pad The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an in-situ optical end-point detection apparatus without the need for a sep... | 09/25/2007 |
| 7267601 | Method of producing polishing cloth A polishing cloth to be produced has a surface layer stacked over a base material. The surface layer is made of a foamed layer and a non-foamed layer, the foamed layer including air bubble cells and the non-foamed layer having an externally exposed surface where lin... | 09/11/2007 |
| 7264641 | Polishing pad comprising biodegradable polymer The invention is directed to a polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer. The biodegradable polymer comprises a repeat unit selected from the group consisting of glycolic acid, lactic acid, hydroxyalkanoic acids, hydro... | 09/04/2007 |
| 7258602 | Polishing pad having grooved window therein and method of forming the same A polishing pad having grooved window therein is provided. The polishing pad comprises a polishing layer and a window, wherein the polishing layer has at least one first groove therein and the window has at least one second groove therein. More particularly, the fir... | 08/21/2007 |
| 7222515 | Impact test apparatus and impact test method An impact test apparatus includes a holding device for holding a test piece at an arbitrary holding force, an impact applying device for applying an impact force to the test piece held by the holding device, a force sensor for sensing the impact force applied to the... | 05/29/2007 |
| 7189155 | Polishing body, polishing apparatus, semiconductor device, and semiconductor device manufacturing method The polishing body is attached to a substrates. The polishing body has a structure in which a polishing pad, a hard elastic member and a soft members are laminated in that order from the side of the polishing surface. For example, an IC1000 (commercial name) manufac... | 03/13/2007 |
| 7163450 | Abrasive pad The present invention provides an abrasive pad for abrading a surface to be abraded in the presence of an abrasive solution, which includes a hydrophobic polymer as a base material, and in which a graft-polymer chain having a hydrophilic group is introduced into the... | 01/16/2007 |
| 7137872 | Scratch removal device and method A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a c... | 11/21/2006 |
| 7134939 | Method for reducing wear of mechanically interacting surfaces The invention is about reducing friction and wear and risk of seizure of mechanically interacting lubricated surfaces. A working surface of a mechanical piece engaged with another piece in relative sliding movement is processed for reduced friction. Two distinctly s... | 11/14/2006 |
| 7134952 | Polishing cloth A polishing cloth has a surface layer stacked over a base material. The surface layer is made of a foamed layer and a non-foamed layer, the foamed layer including air bubble cells and the non-foamed layer having an externally exposed surface where linear cuts are fo... | 11/14/2006 |
| 7087187 | Meta oxide coated carbon black for CMP Using coated carbon black particles, coated with a selected coating material, as an abrasive in slurries or polishing pads for chemical-mechanical polishing processes. By adjusting the coating material on the carbon black particles, new abrasive particles for chemic... | 08/08/2006 |
| 7077737 | Flexible file and file dispenser system A flexible file system for providing abrasive files that can be used for wood or metal working that can be supplied in different sizes, stiffness and with different types of abrasive surfaces in different cross-sections. These flexible files can be attached to form ... | 07/18/2006 |
| 7070480 | Method and apparatus for polishing substrates Method and apparatus for polishing substrates. A chemical mechanical polishing article comprises a body and a patterned surface. The patterned surface comprises a plurality of slurry distribution grooves and a plurality of islands on the body. Each of the plurality ... | 07/04/2006 |
| 6986705 | Polishing pad and method of making same An article or polishing pad for altering a surface of a work piece includes a polymer matrix created by reaction injection molding of size controlled gas bubbles within a polyurethane matrix. The proposed liquid urethane precursor is first injected into an actuated ... | 01/17/2006 |
| 6935931 | Microporous polishing pads The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 μm or less, wherein about 75% or more of the pores have a por... | 08/30/2005 |
| 6929539 | Flexible abrasive product and method of making and using the same The present invention provides a flexible abrasive product comprised of an open cell foam backing, a foraminous barrier coating and a shaped foraminous abrasive coating. The flexible abrasive article of the invention is made by applying a curable barrier coating ove... | 08/16/2005 |
| 6921566 | Cushioned grip tape A multi-layer flexible non-skid cushioning tape having a top layer of plastic material having a frictional surface thereon, an elastomeric cushioning layer comprising a neoprene/EPDM/SBR blend, and an adhesion layer of a plastic sheet with a pressure sensitive adhes... | 07/26/2005 |
| 6915796 | Superabrasive wire saw and associated methods of manufacture A superabrasive wire saw having a plurality of individual coated superabrasive particles attached to a wire with an organic binder is disclosed and described. The superabrasive particle can be coated with a solidified coating of a molten braze alloy that is chemical... | 07/12/2005 |
| 6905526 | Fabrication of an ion exchange polish pad Embodiments of the invention include an ion exchange polish pad for polishing a semiconductor substrate, on which various conductive, semiconductive, and/or insulative layers are formed, for example a conductive copper layer. Embodiments also include the method for ... | 06/14/2005 |
| 6899598 | Microporous polishing pads The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 μm or less, wherein about 75% or more of the pores have a por... | 05/31/2005 |
| 6896593 | Microporous polishing pads The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 μm or less, wherein about 75% or more of the pores have a por... | 05/24/2005 |
| 6881483 | Ceramic aggregate particles Ceramic aggregate particles comprising a plurality of solid particulates bonded together by ceramic binding material and methods of providing a plurality of such particles having substantially uniform cross-sectional shape are provided. The ceramic aggregate particl... | 04/19/2005 |
| 6875097 | Fixed abrasive CMP pad with built-in additives This invention discloses fixed abrasive chemical mechanical polishing pads, wherein the pad itself comprises at least one material selected from the group consisting of oxidants, wetting agents and other additives normally delivered via a polishing slurry, which ass... | 04/05/2005 |
| 6846232 | Backing and abrasive product made with the backing and method of making and using the backing and abrasive product The invention provides a backing for an abrasive article comprising a sheet-like polymeric substrate having a first major surface including a pattern of non-abrasive raised areas and depressed areas and an opposite second major surface including a plurality of shape... | 01/25/2005 |
| 6840843 | Method for manufacturing a polishing pad having a compressed translucent region A method for producing a polishing pad comprising (a) providing a porous polymer structure, (b) compressing at least a region of the porous polymer structure to provide a translucent region, and (c) forming a polishing pad comprising the porous polymer structure, wh... | 01/11/2005 |
| 6837781 | Polishing pad A high quality polishing pad suitable for chemical mechanical polishing (CMP) of semiconductor wafer, etc. which is not affected by the change of polishing conditions during polishing and can attain excellent removal rate, capacity of step height reduction and unifo... | 01/04/2005 |
| 6790126 | Agglomerate abrasive grain and a method of making the same Agglomerate abrasive grain is disclosed. The agglomerate abrasive grain can be incorporated into abrasive products such as coated abrasives, bonded abrasives, nonwoven abrasives, and abrasive brushes. A method of making agglomerate abrasive grain is also disclosed. | 09/14/2004 |
| 6786801 | Method for gasket removal Method for removing gasket material from a surface using nonwoven, three dimensional fibrous web articles employ phenolic particles. ... | 09/07/2004 |
| 6752708 | Pad conditioner for semiconductor substrates A pad conditioner for semiconductor substrates for performing conditioning by slide contact with the abrasive surface of the polishing pad comprises a support member having a surface opposed to the polishing pad, a joining alloy layer covering the above surface of t... | 06/22/2004 |
| 6716092 | Apparatus for making a polishing pad with a partial adhesive coating A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesi... | 04/06/2004 |
| 6632129 | Fixed abrasive article for use in modifying a semiconductor wafer An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element.... | 10/14/2003 |
| 6616520 | Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate A polishing cloth includes: a polishing cloth substrate; a first-pressure adhesive layer formed on a back face of the polishing cloth substrate; as support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive a... | 09/09/2003 |
| 6582289 | Flap disc A flap disc consists of a backing plate to whose peripheral zone laminae overlapping like a fan or roof tiles are attached. In order to improve the abrasive effect of such a flap disc using less material and simpler production, the lamellae 10 consist of ... | 06/24/2003 |
