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| Number | Title | Issue Date |
| 7452265 | Abrasive article and methods of making same An abrasive article with an integral dust collection system. The abrasive article comprises a porous abrasive layer with openings, a first filter media with channels, a second filter media, a third filter media with channels, a fourth filter media, and an optional a... | 11/18/2008 |
| 7429210 | Materials for chemical mechanical polishing A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and... | 09/30/2008 |
| 7377840 | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, a... | 05/27/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7329175 | Abrasive article and methods of making same A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and a porous attachment interface. The screen abrasive has an abrasive layer comprising a plurality of erectly oriented abrasive particles and at... | 02/12/2008 |
| 7316605 | Sheet for mounting polishing workpiece and method for making the same The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interi... | 01/08/2008 |
| 7300340 | CMP pad having overlaid constant area spiral grooves A circular chemical mechanical polishing pad that includes a polishing surface having a concentrically located origin. The polishing surface includes groove sets each containing grooves arranged in a pattern in which ones of the grooves in one groove set cross ones ... | 11/27/2007 |
| 7300342 | Scratch removal device and method A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a c... | 11/27/2007 |
| 7294158 | Abrasive product, method of making and using the same, and apparatus for making the same The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providi... | 11/13/2007 |
| 7294048 | Abrasive article An abrasive article includes a substrate having opposed first and second surfaces, a make coat on at least a portion of the first surface, abrasive mineral particles on at least a portion of the make coat to provide an abrasive surface and a size coat arranged over ... | 11/13/2007 |
| 7285233 | Method of manufacturing polishing pad A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the poly... | 10/23/2007 |
| 7275311 | Apparatus and system for precise lapping of recessed and protruding elements in a workpiece An apparatus and system for precise lapping of recessed and protruding elements in a workpiece is disclosed. According to one embodiment, a system is provided having an air bearing surface with electrical components embedded therein to provide a desired surface dime... | 10/02/2007 |
| 7267610 | CMP pad having unevenly spaced grooves A chemical mechanical polishing pad (100) having a circular polishing track (124) and a concentric center (116). The polishing pad (100) includes a polishing layer (104) having a groove pattern containing a plurality of grooves ( | 09/11/2007 |
| 7238097 | Polishing pad and method of producing same A transparent pad having a polishing surface with an average surface roughness of 5 μm or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transpare... | 07/03/2007 |
| 7226345 | CMP pad with designed surface features A polishing pad for use with a polishing composition is disclosed. The polishing pad includes a layer having a first material, and polishing structures having a second material, where the plurality of polishing structures form a temporary reservoir region for the po... | 06/05/2007 |
| 7220168 | Processes for producing a whetstone and whetstone pellets with uniform abrasion layers A whetstone pellet 1 is composed of a columnar base body 2 to be fixed on a pedestal 9, and an abrasive grain part 5 containing numerous abrasive grains formed by electroless plating on an end surface 3 of the base body 2. U... | 05/22/2007 |
| 7214126 | Abrasive material A flexible layer is formed on a surface of a core, and a polishing layer mixed with abrasive particles is formed on a top of the flexible layer. The flexible layer is produced by applying an emulsion adhesive as a flexible layer onto a core and attaching abrasive pa... | 05/08/2007 |
| 7204742 | Polishing pad comprising hydrophobic region and endpoint detection port The invention provides a chemical-mechanical polishing pad comprising a polishing layer comprising a hydrophobic region, a hydrophilic region, and an endpoint detection port. The hydrophobic region is substantially adjacent to the endpoint detection port. The hydrop... | 04/17/2007 |
| 7201647 | Subpad having robust, sealed edges Provided are encapsulated belts and encapsulated pads for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other workpieces. The encapsulated belts and pads are characterized by a ro... | 04/10/2007 |
| 7192340 | Polishing pad, method of producing the same, and cushion layer for polishing pad The polishing pad of this invention is a polishing pad effecting stable planarizing processing, at high polishing rate, materials requiring surface flatness at high level, such as a silicon wafer for semiconductor devices, a magnetic disk, an optical lens etc. This ... | 03/20/2007 |
| 7192336 | Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to... | 03/20/2007 |
| 7189155 | Polishing body, polishing apparatus, semiconductor device, and semiconductor device manufacturing method The polishing body is attached to a substrates. The polishing body has a structure in which a polishing pad, a hard elastic member and a soft members are laminated in that order from the side of the polishing surface. For example, an IC1000 (commercial name) manufac... | 03/13/2007 |
| 7186168 | Chemical mechanical polishing apparatus and methods for chemical mechanical polishing The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for using the deformable pad and CMP apparatus of the present invention. The ... | 03/06/2007 |
| 7182677 | Chemical mechanical polishing pad for controlling polishing slurry distribution A polishing pad for a chemical mechanical polishing apparatus has a body with a polishing surface having a radius, a central region, and a peripheral region. The polishing surface has a plurality of main radial-line channels extending radially outwardly from the cen... | 02/27/2007 |
| 7179159 | Materials for chemical mechanical polishing A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and... | 02/20/2007 |
| 7169031 | Self-contained conditioning abrasive article Provided is a fixed abrasive article for polishing a workpiece having a hardness comprising (a) a substrate having a first surface and a second surface, (b) a region of abrasive composites distributed on the first surface of the substrate, and (c) a region of condit... | 01/30/2007 |
| 7169029 | Resilient structured sanding article A resilient hand-held abrasive article suitable, for example, for woodworking, includes a plurality of separated raised abrasive surfaces to allow the article to more effectively conform to a contoured surface. A method of making such an abrasive article is also dis... | 01/30/2007 |
| 7163446 | Vehicle headlight restoration A method of restoring a discolored automobile headlight lens without removal of the lens from the automobile consistent with certain embodiments involves wet abrading an outer surface of the lens with successively finer grit wet sanding disks, using a low speed rota... | 01/16/2007 |
| 7160181 | Polishing pad of CMP equipment for polishing a semiconductor wafer A polishing pad used for polishing the surface of a semiconductor wafer in CMP equipment, includes a support layer adhered to the top of a rotary plate of the CMP equipment, a polishing layer disposed on top of the support layer, and an adhesive layer interposed bet... | 01/09/2007 |
| 7137872 | Scratch removal device and method A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a c... | 11/21/2006 |
| 7134953 | Endless abrasive belt and method of making the same Endless abrasive belt useful for polishing or otherwise abrading surfaces. ... | 11/14/2006 |
| 7131901 | Polishing pad and fabricating method thereof A polishing pad having a polishing surface, a back surface and a sidewall is provided. The sidewall is connected to the polishing surface and the back surface. The polishing pad includes a polishing region and a region neighboring to the polishing region. Wherein, a... | 11/07/2006 |
| 7131895 | CMP pad having a radially alternating groove segment configuration A polishing pad (104) having an annular polishing track (122) and including a plurality of grooves (148) that each traverse the polishing track. Each groove includes a plurality of flow control segments (CS1–CS3) and at least two... | 11/07/2006 |
| 7104868 | Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of... | 09/12/2006 |
| 7097550 | Chemical mechanical polishing pad A chemical mechanical polishing pad which can be advantageously used for the polishing of a metal film or the polishing of an insulating film, provides a flat polished surface, enables slurry to be efficiently removed, has sufficiently long service life, can provide... | 08/29/2006 |
| 7077723 | Porous abrasive articles with agglomerated abrasives and method for making the agglomerated abrasives A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 and 1400° C., and the sintere... | 07/18/2006 |
| 7077737 | Flexible file and file dispenser system A flexible file system for providing abrasive files that can be used for wood or metal working that can be supplied in different sizes, stiffness and with different types of abrasive surfaces in different cross-sections. These flexible files can be attached to form ... | 07/18/2006 |
| 7070480 | Method and apparatus for polishing substrates Method and apparatus for polishing substrates. A chemical mechanical polishing article comprises a body and a patterned surface. The patterned surface comprises a plurality of slurry distribution grooves and a plurality of islands on the body. Each of the plurality ... | 07/04/2006 |
| 7063603 | Method and apparatus for cleaning a web-based chemical mechanical planarization system A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid ... | 06/20/2006 |
| 7059951 | Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method A polishing pad used for precise polishing of the surface of a lapped glass workpiece when a glass substrate for use in data recording media is manufactured from a glass workpiece. The polishing pad comprises a base and a polishing portion laminated on the base and ... | 06/13/2006 |
