Quotables
"Inventing is a combination of brains and materials. The more brains you use, the less material you need."
Charles Kettering
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7410413 | Structured abrasive article and method of making and using the same A structured abrasive article comprises a backing, a structured abrasive layer affixed to the backing, the structured abrasive layer comprising: a plurality of raised abrasive regions, each raised abrasive region consisting essentially of a close-packed plurality of... | 08/12/2008 |
| 7367872 | Conditioner disk for use in chemical mechanical polishing A conditioner disk for use on a polish pad in chemical mechanical polishing process includes a base structure a plurality of curved blades supported by the base structure. The blades radiate outwardly from a center region of the base structure and curve in a common ... | 05/06/2008 |
| 7354337 | Pad conditioner, pad conditioning method, and polishing apparatus The present invention provides: a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising a bending or deflecting or elastic member and a supporting section to support a base end of the bending... | 04/08/2008 |
| 7329171 | Fixed abrasive article for use in modifying a semiconductor wafer An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element. ... | 02/12/2008 |
| 7317041 | Method for the preparation of biliquid foam compositions A method for the preparation of a biliquid foam which does not rely upon the initial formation of a gas foam, in which a stirrer having a single or a multiplicity of blades is used, the stirrer being operated in a manner such that at least one part of the stirrer me... | 01/08/2008 |
| 7302946 | Industrial scarifier assembly A scarifier assembly including a generally rectangular shaped case with a hollow interior, a resilient generally rectangular pad located in the hollow interior of the case, and a removable work performing surface insert having work surfaces for grinding, cutting or ... | 12/04/2007 |
| 7297170 | Method of using abrasive product The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providi... | 11/20/2007 |
| 7261621 | Pad conditioner for chemical mechanical polishing apparatus A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relative... | 08/28/2007 |
| 7220164 | Advanced finishing control An apparatus and method of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. The method uses operative sensors such as friction sensors for detecting and improving control during finishing. The method can aid con... | 05/22/2007 |
| 7204745 | Device in a circular, disk-shaped element intended for cleaning purposes The invention relates to a device in a circular disk-shaped cleaning element intended for cleaning by means of a cleaning machine. The element is designed with a number of recesses (3) distributed over the active cleaning surface (2a) thereof Gr... | 04/17/2007 |
| 7188661 | Process for joining members of a heat transfer assembly and assembly formed thereby A method and assembly that makes use of an adhesive to form a joint structure between two members, such as two heat transfer components. A first member has a slot in a surface thereof, while the second member has an edge received in the slot of the first member. One... | 03/13/2007 |
| 7186164 | Processing pad assembly with zone control An electrochemical mechanical processing station having a zoned polishing pad assembly is provided. The zoned polishing pad assembly includes a conductive layer coupled to an upper layer having a non-conductive processing surface. At least two zones of different cur... | 03/06/2007 |
| 7169029 | Resilient structured sanding article A resilient hand-held abrasive article suitable, for example, for woodworking, includes a plurality of separated raised abrasive surfaces to allow the article to more effectively conform to a contoured surface. A method of making such an abrasive article is also dis... | 01/30/2007 |
| 7156717 | situ finishing aid control A method of using finishing aids for advanced finishing control is described. A finishing surface is used generally to induce frictional wear. The finishing aids with preferred in situ control can improve control of the coefficient of friction, the tangential force ... | 01/02/2007 |
| 7140955 | Polishing apparatus A polishing apparatus includes a plurality of polishing fluid supply openings terminating in a polishing surface of a polishing table, and a plurality of grooves which are formed in the polishing surface and arranged so as not to be in direct communication with the ... | 11/28/2006 |
| 7131900 | Grinding wheel in combination with a grinding ring A combination between a grinding ring and a grinding wheel is disclosed, wherein the grinding ring has a centrally defined hole, a tubular extension extending from a periphery defining the hole, an annular extension extending from an outer periphery of the tubular e... | 11/07/2006 |
| 7131890 | In situ finishing control An apparatus and method of using a in situ finishing information for finishing semiconductor wafers is described. The method uses operative sensors such as friction sensors for detecting and improving control during finishing. The method can aid control of finishing... | 11/07/2006 |
| 7124753 | Brazed diamond tools and methods for making the same Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as ... | 10/24/2006 |
| 7121938 | Polishing pad and method of fabricating semiconductor substrate using the pad It is provided a polishing pad of novel construction capable of controlling actively and efficiently a slurry flow during polishing a surface of a semiconductor substrate, such as a wafer, thus making it possible to precisely and stably performing a desired polishin... | 10/17/2006 |
| 7118469 | Abrasive pad, method and system for making an abrasive pad An abrasive pad having dots of abrasive material disposed thereon includes a central alignment hole. The abrasive pad is formed by slipping a backing pad having a central alignment hole onto an alignment stud that extends from a support surface through the central a... | 10/10/2006 |
| 7077737 | Flexible file and file dispenser system A flexible file system for providing abrasive files that can be used for wood or metal working that can be supplied in different sizes, stiffness and with different types of abrasive surfaces in different cross-sections. These flexible files can be attached to form ... | 07/18/2006 |
| 7066800 | Conductive polishing article for electrochemical mechanical polishing An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adap... | 06/27/2006 |
| 7066801 | Method of manufacturing a fixed abrasive material Provided is a method for manufacturing a fixed abrasive material suitable for use in CMP planarization pads from an aqueous polymer dispersion that also includes abrasive particles that involves frothing the polymer dispersion, applying the froth to a substrate, mol... | 06/27/2006 |
| 7018282 | Customized polishing pad for selective process performance during chemical mechanical polishing The present invention comprises a customized polishing pad for use in a wafer polishing machine. The polishing pad of the present invention includes a polishing surface integral with the polishing pad. The polishing surface is adapted to frictionally contact a wafer... | 03/28/2006 |
| 7004823 | Multi-zone grinding and/or polishing sheet The invention relates to grinding/polishing sheet, which comprises 2 or more annular grinding/polishing zones (1-5) separated by intermediate annular distancing zones (6). One or more of the grinding polishing zones (1-5) comprises one or more n... | 02/28/2006 |
| 6986705 | Polishing pad and method of making same An article or polishing pad for altering a surface of a work piece includes a polymer matrix created by reaction injection molding of size controlled gas bubbles within a polyurethane matrix. The proposed liquid urethane precursor is first injected into an actuated ... | 01/17/2006 |
| 6964598 | Polishing apparatus and method for forming an integrated circuit In one embodiment, a semiconductor substrate (38) is uniformly polished using a polishing pad (16) that has a first polishing region (26), a second polishing region (28), and a third polishing region (30). The semiconductor substra... | 11/15/2005 |
| 6964603 | Fiber flocked dental polishing tips A dental polishing tip is adapted to be coupled to a dental drive apparatus. The apparatus rotates the tip, thereby polishing the teeth. The tip includes: (i) a post having a proximal end and an opposing distal end, the proximal end being adapted to be coupled to th... | 11/15/2005 |
| 6951506 | Polish pad with non-uniform groove depth to improve wafer polish rate uniformity The present invention describes a method for creating a differential polish rate across a semiconductor wafer. The profile or topography of the semiconductor wafer is determined by locating the high points and low points of the wafer profile. The groove pattern of a... | 10/04/2005 |
| 6949012 | Polishing pad conditioning method and apparatus A method and apparatus is provided that comprises an improved substrate polishing pad conditioning plate. In one embodiment, the conditioning plate contains multiple channels interposed between the abrasive surfaces so as to manage slurry and debris to resist cloggi... | 09/27/2005 |
| 6929534 | Polisher and polishing method A polisher for polishing a curved surface such as a concave surface of a spectacle lens has a structure in which a polishing pad 3 comprising water passing grooves 5 having a width W of 0.1 to 5 mm is adhered to a dome-shaped elastic base member 2 | 08/16/2005 |
| 6926583 | Grinding wheel A grinding wheel including a circular grinding region (1) with a plurality of through-openings (3) formed therein, a central mounting region (2) coaxial with the grinding region (1), and a plurality of cutting bodies (4) having a r... | 08/09/2005 |
| 6918824 | Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device An assembly for a chemical-mechanical polishing process includes a platen having an outer edge, a top surface, and at least one inlet for introducing fluid to the top surface; a manifold system, entrenched in the top surface and in communication with the at least on... | 07/19/2005 |
| 6896606 | Drywall sanding implement A drywall sanding implement having a shaft, a yoke attached to the shaft, a block pivotably mounted to the yoke, a pair of spindles mounted to the block, and a sanding block removably mounted on each spindle. ... | 05/24/2005 |
| 6855034 | Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoint detection without lowering the polishing performance a... | 02/15/2005 |
| 6848974 | Polishing pad for semiconductor wafer and polishing process using thereof An object of the present invention is to provide a polishing pad for a semiconductor wafer which can perform a stable polishing while preventing a polishing layer from floating up from a supporting layer and a surface of a polishing pad from bending during polishing... | 02/01/2005 |
| 6840843 | Method for manufacturing a polishing pad having a compressed translucent region A method for producing a polishing pad comprising (a) providing a porous polymer structure, (b) compressing at least a region of the porous polymer structure to provide a translucent region, and (c) forming a polishing pad comprising the porous polymer structure, wh... | 01/11/2005 |
| 6837781 | Polishing pad A high quality polishing pad suitable for chemical mechanical polishing (CMP) of semiconductor wafer, etc. which is not affected by the change of polishing conditions during polishing and can attain excellent removal rate, capacity of step height reduction and unifo... | 01/04/2005 |
| 6824455 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings. ... | 11/30/2004 |
| 6736709 | Grooved polishing pads for chemical mechanical planarization An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron... | 05/18/2004 |
