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| Number | Title | Issue Date |
| 7438635 | Abrasive product having parallel base and abrasive threads The invention relates to an abrasive product intended to be driven in a particular grinding direction over the object to be abraded. The abrasive product is composed of parallel threads placed at a distance from one another and running in the grinding direction and ... | 10/21/2008 |
| 7399516 | Long-life workpiece surface influencing device structure and manufacturing method A top layer comprises a flexible support and a plurality of hard elements anchored in a binder over the flexible support, and a method of forming the same is provided. In one embodiment, certain ones of the hard elements have a contact surface adapted to contact the... | 07/15/2008 |
| 7357703 | Chemical mechanical polishing pad and chemical mechanical polishing method A chemical mechanical polishing pad of the present invention has the following two groups of grooves on the polishing surface: (i) a group of first grooves intersect a single virtual straight line extending from the center toward the periphery of the polishing surfa... | 04/15/2008 |
| 7300479 | Compositions for abrasive articles A structured abrasive article, methods of making an abrasive article, and methods of using an abrasive article. The abrasive composites forming the abrasive article have a height of at least 500 micrometers, and the abrasive particles in the composites have an avera... | 11/27/2007 |
| 7300993 | Process for the preparation of polyether polyols The invention relates to a process for the preparation of polyether polyols, which process involves: (a) contacting a phosphorus containing compound having at least one hydroxyl group with alkylene oxide to obtain alkoxylated initi... | 11/27/2007 |
| 7285233 | Method of manufacturing polishing pad A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the poly... | 10/23/2007 |
| 7267610 | CMP pad having unevenly spaced grooves A chemical mechanical polishing pad (100) having a circular polishing track (124) and a concentric center (116). The polishing pad (100) includes a polishing layer (104) having a groove pattern containing a plurality of grooves ( | 09/11/2007 |
| 7267700 | Structured abrasive with parabolic sides An abrasive article and methods of making and using the same are disclosed. The abrasive article includes a plurality of features on a backing. The features have a base and a body. The body is defined by sidewalls having parabolic sections. In some embodiments, the ... | 09/11/2007 |
| 7255809 | Polishing slurry for texturing Polishing slurry for texturing the surface of a magnetic hard disk substrate has abrading particles with diameters in the range of 1-10 nm dispersed in a dispersant such as water and a water-based aqueous solution. The abrading particles may be monocrystalline diamo... | 08/14/2007 |
| 7252582 | Optimized grooving structure for a CMP polishing pad A polishing pad for a chemical mechanical polishing has a body rotatable in a predetermined direction and having a working surface, the working surface being provided with grooves, the grooves being formed so that over the course of a single revolution of the pad sa... | 08/07/2007 |
| 7235296 | Formulations for coated diamond abrasive slurries The present invention is directed to an abrasive article and methods of making the abrasive article. An abrasive coating on the abrasive article comprises at least 20% by weight of a superabrasive particle. The abrasive coating is derived from an abrasive slurry. Th... | 06/26/2007 |
| 7229341 | Method and apparatus for chemical mechanical polishing A chemical mechanical polishing apparatus prevents scratches caused by a direct friction between a polishing pad and a wafer. The apparatus includes a polishing pad, in which grooves are regularly formed, for generating a dynamic pressure by rotation; a polishing ta... | 06/12/2007 |
| 7204742 | Polishing pad comprising hydrophobic region and endpoint detection port The invention provides a chemical-mechanical polishing pad comprising a polishing layer comprising a hydrophobic region, a hydrophilic region, and an endpoint detection port. The hydrophobic region is substantially adjacent to the endpoint detection port. The hydrop... | 04/17/2007 |
| 7192340 | Polishing pad, method of producing the same, and cushion layer for polishing pad The polishing pad of this invention is a polishing pad effecting stable planarizing processing, at high polishing rate, materials requiring surface flatness at high level, such as a silicon wafer for semiconductor devices, a magnetic disk, an optical lens etc. This ... | 03/20/2007 |
| 7189684 | Polishing composition and method for forming wiring structure using the same A polishing composition capable of satisfactorily polishing a semiconductor. The first polishing composition of the present invention includes silicon dioxide, at least one component selected from periodic acids and salts thereof, at least one component selected fro... | 03/13/2007 |
| 7169017 | Polishing pad having a window with reduced surface roughness The present invention provides a polishing pad for performing chemical mechanical planarization of semiconductor substrates. The polishing pad comprises a polishing pad body having an aperture formed therein and a window fixed in the aperture for performing in-situ ... | 01/30/2007 |
| 7169031 | Self-contained conditioning abrasive article Provided is a fixed abrasive article for polishing a workpiece having a hardness comprising (a) a substrate having a first surface and a second surface, (b) a region of abrasive composites distributed on the first surface of the substrate, and (c) a region of condit... | 01/30/2007 |
| 7156929 | Cast iron alloy The invention proposes a cast iron alloy for cast iron products which are highly thermally stable, the alloy containing, as nonferrous constituents, at least the elements C, Si, Mo, Al and, as admixtures, Ni, Mg and/or S, and the C content being less than 2.9% by we... | 01/02/2007 |
| 7140955 | Polishing apparatus A polishing apparatus includes a plurality of polishing fluid supply openings terminating in a polishing surface of a polishing table, and a plurality of grooves which are formed in the polishing surface and arranged so as not to be in direct communication with the ... | 11/28/2006 |
| 7132070 | Method of manufacturing polishing pad A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the poly... | 11/07/2006 |
| 7131895 | CMP pad having a radially alternating groove segment configuration A polishing pad (104) having an annular polishing track (122) and including a plurality of grooves (148) that each traverse the polishing track. Each groove includes a plurality of flow control segments (CS1–CS3) and at least two... | 11/07/2006 |
| 7118469 | Abrasive pad, method and system for making an abrasive pad An abrasive pad having dots of abrasive material disposed thereon includes a central alignment hole. The abrasive pad is formed by slipping a backing pad having a central alignment hole onto an alignment stud that extends from a support surface through the central a... | 10/10/2006 |
| 7118457 | Method of forming a polishing pad for endpoint detection A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing s... | 10/10/2006 |
| 7090570 | Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A first portion of... | 08/15/2006 |
| 7077737 | Flexible file and file dispenser system A flexible file system for providing abrasive files that can be used for wood or metal working that can be supplied in different sizes, stiffness and with different types of abrasive surfaces in different cross-sections. These flexible files can be attached to form ... | 07/18/2006 |
| 7066791 | Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of ... | 06/27/2006 |
| 7037179 | Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing surface, an... | 05/02/2006 |
| 7018274 | Polishing pad having slurry utilization enhancing grooves A chemical mechanical polishing pad (200) that includes a polishing layer (204) having a polishing region (208) and containing a plurality of grooves (212) extending at least partially into the polishing region. During polishing, the groo... | 03/28/2006 |
| 6986705 | Polishing pad and method of making same An article or polishing pad for altering a surface of a work piece includes a polymer matrix created by reaction injection molding of size controlled gas bubbles within a polyurethane matrix. The proposed liquid urethane precursor is first injected into an actuated ... | 01/17/2006 |
| 6976910 | Polishing pad A polishing pad comprising a recessed portion in the non-polishing surface. This polishing pad can prevent the surface to be polished of an object from being scratched. ... | 12/20/2005 |
| 6955587 | Grooved polishing pad and method A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) having a polishing region (164, 320, 420, 504) defined by first and second boundaries ((168, 17... | 10/18/2005 |
| 6951506 | Polish pad with non-uniform groove depth to improve wafer polish rate uniformity The present invention describes a method for creating a differential polish rate across a semiconductor wafer. The profile or topography of the semiconductor wafer is determined by locating the high points and low points of the wafer profile. The groove pattern of a... | 10/04/2005 |
| 6949012 | Polishing pad conditioning method and apparatus A method and apparatus is provided that comprises an improved substrate polishing pad conditioning plate. In one embodiment, the conditioning plate contains multiple channels interposed between the abrasive surfaces so as to manage slurry and debris to resist cloggi... | 09/27/2005 |
| 6918824 | Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device An assembly for a chemical-mechanical polishing process includes a platen having an outer edge, a top surface, and at least one inlet for introducing fluid to the top surface; a manifold system, entrenched in the top surface and in communication with the at least on... | 07/19/2005 |
| 6910949 | Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers A polishing head for use in an apparatus for chemically-mechanically polishing semiconductor wafers is provided. The polishing head includes a first side having at least a portion thereof operably connectable with a spindle on the apparatus; and a second side opposi... | 06/28/2005 |
| 6857941 | Multi-phase polishing pad An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishin... | 02/22/2005 |
| 6848974 | Polishing pad for semiconductor wafer and polishing process using thereof An object of the present invention is to provide a polishing pad for a semiconductor wafer which can perform a stable polishing while preventing a polishing layer from floating up from a supporting layer and a surface of a polishing pad from bending during polishing... | 02/01/2005 |
| 6846232 | Backing and abrasive product made with the backing and method of making and using the backing and abrasive product The invention provides a backing for an abrasive article comprising a sheet-like polymeric substrate having a first major surface including a pattern of non-abrasive raised areas and depressed areas and an opposite second major surface including a plurality of shape... | 01/25/2005 |
| 6837781 | Polishing pad A high quality polishing pad suitable for chemical mechanical polishing (CMP) of semiconductor wafer, etc. which is not affected by the change of polishing conditions during polishing and can attain excellent removal rate, capacity of step height reduction and unifo... | 01/04/2005 |
| 6837780 | Lapping and polishing device The invention concerns a polishing or lapping device comprising a surface whereon parts to be polished are to be applied, with an interposed abrasive suspension, and with a certain pressure. The invention is characterized in that said surface comprises a plurality o... | 01/04/2005 |
