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| Number | Title | Issue Date |
| 8162728 | Dual-pore structure polishing pad The polishing pad is useful for polishing at least one of magnetic, optical and semiconductor substrates. A porous polishing layer includes a dual porosity structure within a polyurethane matrix. The dual porosity structure has a primary set of pores having pore wal... | 04/24/2012 |
| 8128464 | Chemical mechanical polishing pad A chemical mechanical polishing pad used for chemical mechanical polishing comprises a polishing surface, a non-polishing surface that is provided opposite to the polishing surface, a side surface that connects an outer edge of the polishing surface and an outer edg... | 03/06/2012 |
| 8123597 | Polishing pad The polishing pad includes a polishing surface, on which is formed with a plurality of first grooves and a plurality of second grooves, wherein the characteristic of the polishing pad is in that: the first grooves are connected to the second grooves, the width of fi... | 02/28/2012 |
| 8066555 | Polishing pad A polishing pad includes polishing elements interdigitated with one another over a surface of the polishing pad. Each of the polishing elements is secured so as to restrict lateral movement thereof with respect to others of the polishing elements, but remains moveab... | 11/29/2011 |
| 8062103 | High-rate groove pattern The invention provides a polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad. The polishing pad comprises a center, an inner region surrounding the center, a tr... | 11/22/2011 |
| 8062102 | Polishing pads including slurry and chemicals thereon and methods of fabricating the same Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer... | 11/22/2011 |
| 8011999 | Polishing pad, method for manufacturing the polishing pad A polishing pad with first plural concave portions regularly allocated with prescribed spacing or/and a groove formed on the surface of the polishing pad; and a second concave portion randomly allocated without corresponding to the first plural concave portions or/a... | 09/06/2011 |
| 8002611 | Chemical mechanical polishing pad having improved groove pattern A chemical mechanical polishing pad and method for chemical-mechanical polishing is provided, wherein the polishing pad has a plurality of first mesas and one or more second mesas defined on a surface thereof. The plurality of first mesas are generally distributed a... | 08/23/2011 |
| 7993185 | Device for smoothing the surfaces of hard or soft materials The present invention is a finishing plate and method of fabricating a finishing plate. The finishing plate can be fabricated to various shapes, and can be used with various surfacing machines. In a preferred mode, the present invention is a disc cutting plate which... | 08/09/2011 |
| 7963827 | Backingless abrasive article An abrasive article includes an abrasive layer having an array of protrusions. The abrasive layer has a thickness not greater than about 500 mils. The abrasive article is free of a backing layer. ... | 06/21/2011 |
| 7867066 | Polishing pad A polishing pad having a novel structure, which is applicable to highly accurate various polishing process, such as a CMP process, is provided. An annular rear plane groove (22) extending in a circumferential direction is formed on a rear plane (20) of... | 01/11/2011 |
| 7762872 | Superhard cutters and associated methods A cutting device comprises a base having a solidified organic material layer disposed thereon. A plurality of individual polycrystalline cutting elements are secured in the solidified organic material layer. Each of the plurality of individual polycrystalline cuttin... | 07/27/2010 |
| 7604529 | Three-dimensional network for chemical mechanical polishing The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a three-dimensional network of interconnect... | 10/20/2009 |
| 7604530 | Inlaid polishing pad A surface treatment or a two-step injection molding is used to make an inlaid polishing pad. A surface of the inlaid polishing pad has areas of different rigidity to control the rigidity and compressibility of the inlaid polishing pad. Furthermore, methods of making... | 10/20/2009 |
| 7530887 | Chemical mechanical polishing pad with controlled wetting Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising a polishing texture that exhibits a dimensionless roughness, R, is between 0.01 and 0.75. Also provided are methods of making the chemic... | 05/12/2009 |
| 7520800 | Raised island abrasive, lapping apparatus and method of use Flexible abrasive sheet materials having annular bands of precise height flat-topped raised island structures that are coated with a mono layer of abrasive particles or abrasive agglomerates, processes for manufacture of the abrasive sheet materials, processes for u... | 04/21/2009 |
| 7517277 | Layered-filament lattice for chemical mechanical polishing The polishing pad (104) is useful for polishing at least one of a magnetic, optical and semiconductor substrate (112) in the presence of a polishing medium (120). The polishing pad 104 includes multiple layers of polishing filaments (2... | 04/14/2009 |
| 7497768 | Flexible abrasive article and method of making A flexible hand-held abrasive article includes a conformable backup pad having opposed major surfaces, a backing layer affixed to one surface of the backup pad, the backing layer containing a plurality of biaxially oriented openings, and abrasive particles arranged ... | 03/03/2009 |
| 7494404 | Tools for polishing and associated methods Polishing tools and associated methods are disclosed. In one aspect, a tool for polishing a work piece is provided. Such a tool may include a solid substrate with a greater than 10 wt % graphite having a high degree of graphitization. The solid substrate may have a ... | 02/24/2009 |
| 7458885 | Chemical mechanical polishing pad and methods of making and using same Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for... | 12/02/2008 |
| 7438635 | Abrasive product having parallel base and abrasive threads The invention relates to an abrasive product intended to be driven in a particular grinding direction over the object to be abraded. The abrasive product is composed of parallel threads placed at a distance from one another and running in the grinding direction and ... | 10/21/2008 |
| 7435161 | Multi-layer polishing pad material for CMP The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer, wherein the bottom layer is substantially coextensive with the polishing layer, the polishing layer being joined... | 10/14/2008 |
| 7429210 | Materials for chemical mechanical polishing A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and... | 09/30/2008 |
| 7422516 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad s... | 09/09/2008 |
| 7410413 | Structured abrasive article and method of making and using the same A structured abrasive article comprises a backing, a structured abrasive layer affixed to the backing, the structured abrasive layer comprising: a plurality of raised abrasive regions, each raised abrasive region consisting essentially of a close-packed plurality of... | 08/12/2008 |
| 7399516 | Long-life workpiece surface influencing device structure and manufacturing method A top layer comprises a flexible support and a plurality of hard elements anchored in a binder over the flexible support, and a method of forming the same is provided. In one embodiment, certain ones of the hard elements have a contact surface adapted to contact the... | 07/15/2008 |
| 7378004 | Pad designs and structures for a versatile materials processing apparatus An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member conta... | 05/27/2008 |
| 7377840 | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, a... | 05/27/2008 |
| 7374477 | Polishing pads useful for endpoint detection in chemical mechanical polishing A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through ... | 05/20/2008 |
| 7367872 | Conditioner disk for use in chemical mechanical polishing A conditioner disk for use on a polish pad in chemical mechanical polishing process includes a base structure a plurality of curved blades supported by the base structure. The blades radiate outwardly from a center region of the base structure and curve in a common ... | 05/06/2008 |
| 7364500 | Sanding apparatus and method of manufacture An improved resilient sanding block of the type comprising a core having a plurality of exterior surfaces, including a first major surface and a second major surface and side surfaces, and having a layer of abrasive material disposed thereon. The resilient sanding b... | 04/29/2008 |
| 7364497 | Polish pad and chemical mechanical polishing apparatus comprising the same A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical p... | 04/29/2008 |
| 7357698 | Polishing pad and chemical mechanical polishing apparatus using the same A polishing pad for chemically mechanically polishing a semiconductor wafer comprises a first groove pattern circularly formed on the surface of the polishing pad, and a second groove pattern formed on the surface of the polishing pad while spirally extending from t... | 04/15/2008 |
| 7357703 | Chemical mechanical polishing pad and chemical mechanical polishing method A chemical mechanical polishing pad of the present invention has the following two groups of grooves on the polishing surface: (i) a group of first grooves intersect a single virtual straight line extending from the center toward the periphery of the polishing surfa... | 04/15/2008 |
| 7354337 | Pad conditioner, pad conditioning method, and polishing apparatus The present invention provides: a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising a bending or deflecting or elastic member and a supporting section to support a base end of the bending... | 04/08/2008 |
| 7354527 | Chemical mechanical polishing pad and chemical mechanical polishing process A chemical mechanical polishing pad which has a storage elastic modulus E′(30° C.) at 30° C. of 120 MPa or less and an (E′(30° C.)/E′(60° C.)) ratio of the storage elastic modulus E′(30° C.) at 30° C. to the storage elastic modulus E′(60° C.) at 60Â... | 04/08/2008 |
| 7344431 | Pad assembly for electrochemical mechanical processing Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A... | 03/18/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7338355 | Abrasive article and methods of making and using the same An abrasive article having an apertured coated abrasive member, filter media, and an attachment interface member is formed by an ultrasonic welding process. The abrasive article is useful for abrading a workpiece. ... | 03/04/2008 |
| 7335094 | Single-layer polishing pad and method of producing the same A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may... | 02/26/2008 |
