Did You Know...
...that Robert Adler has the dubious distinction of being the Father of the Couch Potato? Back in 1955 Adler was employed by what was then Zenith Radio Corp., where he was charged to invent something that would allow viewers to turn down the TV volume without leaving their chairs. After a series of flops (such as a wired contraption that people tripped over), Adler hit on the idea of using sound waves. Thus the Remote Control was born...
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| Number | Title | Issue Date |
| 8052507 | Damping polyurethane CMP pads with microfillers A system for preparing a microcellular polyurethane material, includes a froth, prepared, for instance, by inert gas frothing a urethane prepolymer, preferably an aliphatic isocyanate polyether prepolymer, in the presence of a surfactant; a filler soluble in a CMP s... | 11/08/2011 |
| 8016647 | Polishing pad and method thereof A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.... | 09/13/2011 |
| 7901275 | Sanding apparatus Embodiments of the present invention generally relate to an improved sanding apparatus for minimizing scoring of drywall and other sensitive finishes. In one embodiment of the present invention, a sanding apparatus comprises a flexible, resilient core having a top a... | 03/08/2011 |
| 7841927 | Hybrid fiber-foam buffing pad A buffing pad primarily for automobiles includes a foam layer and filaments of textile material interspersed throughout the foam layer and extending passed or exposed at the working surface of the pad. The filaments are needle punched through the foam layer. The fil... | 11/30/2010 |
| 7677959 | Multilayer polishing pad and method of making A polishing pad has a polishing layer with a polishing surface and a first registration mark, and a backing layer connected to the polishing layer and having a second registration mark aligned with the first registration mark. The polishing pad may have a window tha... | 03/16/2010 |
| 7662028 | Polishing pad having groove structure for avoiding stripping of a polishing surface of the polishing pad A groove structure for avoiding stripping of a polishing surface of a polishing pad, the polishing pad including a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the ... | 02/16/2010 |
| 7641540 | Polishing pad and cushion layer for polishing pad A polishing pad includes at least a polishing layer and a cushion layer and is characterized in that the difference in hardness in Shore D hardness between the polishing layer and the cushion layer is 3 or more. ... | 01/05/2010 |
| 7442116 | Chemical mechanical polishing pad A chemical mechanical polishing pad having a face for polishing an object to be polished, a non-polishing face opposite to the face and a side face for interconnecting these faces and including the pattern of recessed portions which are formed on the non-polishing f... | 10/28/2008 |
| 7438631 | Surface-protecting sheet and semiconductor wafer lapping method It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and fouling of a wafer even when a wafer having high bumps which are hig... | 10/21/2008 |
| 7435165 | Transparent microporous materials for CMP The invention is directed to a chemical-mechanical polishing pad substrate comprising a porous material having an average pore size of about 0.01 microns to about 1 micron. The polishing pad substrate has a light transmittance of about 10% or more at at least one wa... | 10/14/2008 |
| 7422513 | Porous abrasive articles with agglomerated abrasives A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 and 1400° C., and the sintere... | 09/09/2008 |
| 7414080 | Polyurethane polishing pad The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed with an isocyanate-terminated reaction product formed from a prepolymer reaction of... | 08/19/2008 |
| 7399330 | Agglomerate abrasive grains and methods of making the same An abrasive agglomerate includes a plurality of abrasive grains bonded together in a three-dimensional structure by a substantially continuous, non-porous inorganic binder, wherein the abrasive grains have an average size of between about 0.5 microns and about 1500 ... | 07/15/2008 |
| 7396497 | Method of forming a polishing pad having reduced striations The present invention provides a method of forming a chemical mechanical polishing pad, comprising providing a tank with polymeric materials and providing a storage hopper with microspheres having an initial bulk density, wherein the storage hopper further comprises... | 07/08/2008 |
| 7381121 | Base pad polishing pad and multi-layer pad comprising the same Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same. Since the base pad according to the present invention does not have fine ... | 06/03/2008 |
| 7374476 | Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates A planarizing pad for planarizing a microelectronic substrate, and a method and apparatus for forming the planarizing pad. In one embodiment, planarizing pad material is mixed with compressed gas to form a plurality of discrete elements that are distributed on a fil... | 05/20/2008 |
| 7371160 | Elastomer-modified chemical mechanical polishing pad The chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix with an elastomeric polymer distributed within the polymeric matrix. The polymeric matrix ha... | 05/13/2008 |
| 7364501 | Sanding block and method of making same A sanding block includes a compressible core having at least one pair of sides characterized such that an abrasive material is adhered to said sides substantially along the surface thereof and having a juncture area defined between said two sides which does not have... | 04/29/2008 |
| 7363195 | Methods of configuring a sensor network A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-seri... | 04/22/2008 |
| 7357705 | Diamond disk A novel diamond disc is disclosed. The diamond disc comprises a plurality of diamond grains 2 bound on a disc. The diamond grains 2 are arranged in such a manner that a distance m1 between diamond grains 2 which are located on a common ro... | 04/15/2008 |
| 7357698 | Polishing pad and chemical mechanical polishing apparatus using the same A polishing pad for chemically mechanically polishing a semiconductor wafer comprises a first groove pattern circularly formed on the surface of the polishing pad, and a second groove pattern formed on the surface of the polishing pad while spirally extending from t... | 04/15/2008 |
| 7357703 | Chemical mechanical polishing pad and chemical mechanical polishing method A chemical mechanical polishing pad of the present invention has the following two groups of grooves on the polishing surface: (i) a group of first grooves intersect a single virtual straight line extending from the center toward the periphery of the polishing surfa... | 04/15/2008 |
| 7354334 | Reducing polishing pad deformation A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring module can be positioned in a cavity formed in part by the recess. A... | 04/08/2008 |
| 7349067 | Lithographic apparatus and device manufacturing method A lithographic apparatus having an improved transfer unit, is presented. The lithographic apparatus includes a processing unit that performs a lithographic process involving exchangeable objects in which the processing unit includes an illumination system that provi... | 03/25/2008 |
| 7335094 | Single-layer polishing pad and method of producing the same A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may... | 02/26/2008 |
| 7335239 | Chemical mechanical planarization pad A Chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarazation characteristics throughout planarization applications. Shearing, hardness, wearing, w... | 02/26/2008 |
| 7329171 | Fixed abrasive article for use in modifying a semiconductor wafer An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element. ... | 02/12/2008 |
| 7329170 | Method of producing polishing pad A method of producing a polishing pad having a polishing layer is characterized in that the polishing layer is produced by a photolithographic method including: forming a sheet molding from a curing composition containing at least an initiator and an energy ray-reac... | 02/12/2008 |
| 7329174 | Method of manufacturing chemical mechanical polishing pad The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate. T... | 02/12/2008 |
| 7316605 | Sheet for mounting polishing workpiece and method for making the same The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interi... | 01/08/2008 |
| 7311862 | Method for manufacturing microporous CMP materials having controlled pore size A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to prod... | 12/25/2007 |
| 7311590 | Polishing pad with grooves to retain slurry on the pad texture A rotational chemical mechanical polishing pad designed for use with a polishing medium. The polishing pad includes a polishing layer having a polishing surface containing a plurality of grooves. At least a portion of each of the plurality of grooves has a shape and... | 12/25/2007 |
| 7312160 | Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device The removing solution containing a cerium (IV) nitrate salt, periodic acid or a hypochlorite can be applied to metals containing copper, silver or palladium and also to metals containing other metals having a relatively large oxidation-reduction potential. ... | 12/25/2007 |
| 7306507 | Polishing pad assembly with glass or crystalline window Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. ... | 12/11/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7300335 | Glass substrate for data recording medium, manufacturing method thereof and polishing pad used in the method A polishing pad is used when a surface of a glass workpiece is polished for manufacturing a glass substrate of information recording medium. The polishing pad has a nap layer. The nap layer includes an inner layer that contains a plurality of closed cells, and an ou... | 11/27/2007 |
| 7297170 | Method of using abrasive product The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providi... | 11/20/2007 |
| 7294048 | Abrasive article An abrasive article includes a substrate having opposed first and second surfaces, a make coat on at least a portion of the first surface, abrasive mineral particles on at least a portion of the make coat to provide an abrasive surface and a size coat arranged over ... | 11/13/2007 |
| 7294049 | Method and apparatus for removing material from microfeature workpieces Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface.... | 11/13/2007 |
| 7294038 | Process control in electrochemically assisted planarization In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer... | 11/13/2007 |
