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...Daniel Webster invented a "bull plow" to pull out tree stumps. It didn't catch on because it was huge and required four oxen to pull it!
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| Number | Title | Issue Date |
| 8414362 | Methods of bonding superabrasive particles in an organic matrix Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protrudin... | 04/09/2013 |
| 8398466 | CMP pad conditioners with mosaic abrasive segments and associated methods A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also prov... | 03/19/2013 |
| 8393938 | CMP pad dressers An abrasive tool includes an assembly of tool precursors. At least one of the tool precursors has a continuous polycrystalline diamond, polycrystalline cubic boron nitride, or ceramic material cutting element formed into a blade shape. The abrasive tool can addition... | 03/12/2013 |
| 8382558 | Apparatus for dressing a polishing pad, chemical mechanical polishing apparatus and method An apparatus dresses a polishing pad. The apparatus includes a dresser drive shaft which is rotatable and vertically movable, a dresser flange coupled to the dresser drive shaft and configured to secure a dressing member thereto, a spherical bearing provided in the ... | 02/26/2013 |
| 8382557 | Chemical mechanical planarization pad conditioner and methods of forming thereof A CMP pad conditioner is provided that includes a substrate having a surface and three dimensional structures protruding relative to the surface of the substrate. The three dimensional structures include CVD carbon-containing material selected from the group consist... | 02/26/2013 |
| 8298048 | CMP pad dresser with oriented particles and associated methods CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser ... | 10/30/2012 |
| 8192256 | Rotary dressing tool containing brazed diamond layer A disc-shaped, rotary dressing tool has a rigid core and an abrasive rim around at least one surface of the periphery of the rigid core, the rigid core and the abrasive rim being oriented in a direction orthogonal to the axis of rotation of the tool. The abrasive ri... | 06/05/2012 |
| 8096858 | Polishing pad conditioner The invention provides a polishing pad conditioner that enables stabilization of brazing metal melting point, minimization of abrasive grain detachment by uniformizing and stabilizing abrasive grain brazing condition, and enhancement of flatness by minimizing therma... | 01/17/2012 |
| 8043145 | CMP pad dresser with oriented particles and associated methods CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser ... | 10/25/2011 |
| 7815495 | Pad conditioner A pad conditioner is provided for conditioning a polishing pad in chemical mechanical planarization (CMP). The pad conditioner comprises a plastic abrasive portion having a first hardness and optionally a brush portion having a second hardness less than the first ha... | 10/19/2010 |
| 7690971 | Methods of bonding superabrasive particles in an organic matrix Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protrudin... | 04/06/2010 |
| 7670209 | Pad conditioner, pad conditioning method, and polishing apparatus The present invention provides a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising: a substrate disposed opposite to the polishing pad; a plurality of pellets removably attached to the su... | 03/02/2010 |
| 7641538 | Conditioning disk An abrasive article includes a plurality of abrasive particles securely affixed to a substrate with a corrosion resistant matrix material. The matrix material includes a sintered corrosion resistant powder and a brazing alloy. The brazing alloy includes an element w... | 01/05/2010 |
| 7572174 | Abrasive grain and grindstone An abrasive grain 1 includes a crystal defect CD in its crystal structure CS. The crystal defect CD is formed by a laser irradiation. ... | 08/11/2009 |
| 7563157 | Apparatus for conditioning chemical-mechanical polishing pads An apparatus for conditioning a polishing pad, or conditioner, includes a supporting substrate and abrasive elements. The abrasive elements of the conditioner are used to condition a polishing pad to be used in abrasive, or at least partially mechanical, semiconduct... | 07/21/2009 |
| 7544117 | Tools for polishing and associated methods Methods for making polishing tools and associated tools are disclosed. In one aspect, a method of making a polishing tool is provided. Such a method may include truing a working surface of a nano-diamond impregnated substrate. The method may further include forming ... | 06/09/2009 |
| 7540802 | CMP pad conditioner A CMP pad conditioner is provided with a grinding part formed by fixing abrasive grains on a metal base by soldering, wherein the grinding part has a flat part near an inner periphery and an inclined part near an outer periphery, wherein abrasive grains having regul... | 06/02/2009 |
| 7438632 | Method and apparatus for cleaning a web-based chemical mechanical planarization system A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid ... | 10/21/2008 |
| 7435157 | Grinding machine, computer software to operate such a machine, and their uses therefor An extremely precise computer controlled grinding machine having the capability to write its own computer programs for controlling the grinding machine to perform individual tasks, including both grinding and dressing to several millionths of an inch. A new device f... | 10/14/2008 |
| 7413498 | Lapping apparatus and lapping method A film feeder (FF1) feeds a film (1), a first drive (20) rotates a work (W), a second drive (30) moves the work (W) relative to the film (1), a shoe set handler (40) handles the shoe set (2) to press the film (1 | 08/19/2008 |
| 7410410 | Method and apparatus to produce a GRM lapping plate with fixed diamond using electro-deposition techniques A system and method are described for manufacturing a lapping plate. Diamond particles are premixed with a metal matrix. The diamond particles are electro-deposited onto the surface of a lapping plate. The lapping plate may have a substrate of hard metal with a soft... | 08/12/2008 |
| 7410411 | Method of determining the number of active diamonds on a conditioning disk The invention relates to a method for determining the number of active diamonds on a conditioning disk. In particular, the method comprises (a) contacting a diamond conditioner disk with a hard surface, wherein the diamond-containing side of the diamond conditioning... | 08/12/2008 |
| 7404757 | Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system An apparatus for breaking in new pad conditioning disks for use in a chemical mechanical polishing (CMP) system that polishes a semiconductor wafer by pressing the semiconductor wafer against a moving polishing pad. The apparatus comprises a break-in head that is re... | 07/29/2008 |
| 7371155 | Glass substrate for information recording medium and method for producing same A glass substrate for an information recording medium is manufactured by polishing the surface of a raw material glass plate. The polishing of the raw material glass plate is divided into a step for performing a first polishing process to roughly polish the surface ... | 05/13/2008 |
| 7371156 | Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system. The off-line tool comprises a platen having a first surface for holding a polishing pad and a motor for rotating the polishing pad. The motor is coupled to ... | 05/13/2008 |
| 7367872 | Conditioner disk for use in chemical mechanical polishing A conditioner disk for use on a polish pad in chemical mechanical polishing process includes a base structure a plurality of curved blades supported by the base structure. The blades radiate outwardly from a center region of the base structure and curve in a common ... | 05/06/2008 |
| 7367875 | CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same The present invention relates to a composite material and the method of making same, which comprises a CVD diamond coating applied to a composite substrate of ceramic material and an unreacted carbide-forming material of various configurations and for a variety of a... | 05/06/2008 |
| 7354337 | Pad conditioner, pad conditioning method, and polishing apparatus The present invention provides: a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising a bending or deflecting or elastic member and a supporting section to support a base end of the bending... | 04/08/2008 |
| 7341501 | Gear grinding machine, method for dressing threaded grinding wheel and method for grinding work A gear grinding machine, a method for dressing a threaded grinding wheel, and a method for grinding a work are disclosed. A dressing tool is rotated in a vertical plane, with its position being fixed. The position of a threaded grinding wheel is NC-controlled, where... | 03/11/2008 |
| 7335091 | Methods and apparatus for machining a coupling A method facilitates fabricating a coupling including a first annular coupling member and a second annular coupling member. The method comprises coupling the first coupling member to a machine assembly that includes a plurality of grinding wheels coupled to a tool s... | 02/26/2008 |
| 7331845 | Double end face truing device, double end face truing tool, and double end face truing method First and second end surface truing sections are formed by protruding cylindrical first and second base bodies from opposite end surfaces of a disc-like base of an opposite end surface truing tool in the axial direction thereof and by providing on the external surfa... | 02/19/2008 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7300521 | Wall scrubber for blown insulation An insulation system comprising: a supply of material having discrete elements; an applicator assembly for installation of the material having discrete elements to a surface; and a scrubber for finishing the face of the material, the scrubber including: (a) a vacuum... | 11/27/2007 |
| 7300338 | CMP diamond conditioning disk A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A ... | 11/27/2007 |
| 7291799 | Electrode dressing template Disclosed are various embodiments of an EDM electrode dressing template comprising a body made of an electrically conductive material. Bonded to the body is a pad with an electrically conductive material with hardness greater than the body. An electrode with an erod... | 11/06/2007 |
| 7289872 | Method and apparatus for prediction of polishing condition, and computer product A polishing-condition predicting apparatus determines optimum parameters to be substituted into various function models by performing calibration by use of a TEG. A polishing condition enabling polishing of a thin film formed on a substrate to be designed so as to o... | 10/30/2007 |
| 7288165 | Pad conditioning head for CMP process In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between... | 10/30/2007 |
| 7285039 | Tools for polishing and associated methods Methods for making polishing tools and associated tools are disclosed. In one aspect, a method of making a polishing tool is provided. Such a method may include truing a working surface of a nano-diamond impregnated substrate. The method may further include forming ... | 10/23/2007 |
| 7278905 | Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The con... | 10/09/2007 |
| 7278901 | Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided. In a preferred method, for example, a first displacement of a semicon... | 10/09/2007 |
