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| Number | Title | Issue Date |
| 7654887 | Vacuum chuck and suction board The vacuum chuck according to the present invention is provided with a sucking plate for sucking and holding an object to be sucked, in which a sucking layer made of a porous ceramic and a dense material layer are integrated, the sucking layer being located on the s... | 02/02/2010 |
| 7402098 | Carrier head for workpiece planarization/polishing An edge control system for deployment on a CMP carrier head comprising a bladder and a carrier head housing having a passage extending therethrough. The bladder includes a flexible diaphragm and is coupled to the carrier head housing. The edge control system compris... | 07/22/2008 |
| 7396022 | System and method for optimizing wafer flatness at high rotational speeds The present invention is a chuck having a vacuum groove that is capable of holding a wafer as the chuck rotates on a spindle. As the chuck rotates the air pressure above the center of the wafer is reduced. In order to reduce the bowing of the wafer that can result f... | 07/08/2008 |
| 7381119 | Fixture for grinding machines A fixture for grinding machines includes a first base (10) and a second base (20). The first base has a first surface (12) which defines a first holding groove (11). The first base defines a plurality of first suction holes (13) on... | 06/03/2008 |
| 7381116 | Polishing media stabilizer A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support... | 06/03/2008 |
| 7364496 | Polishing head for polishing semiconductor wafers A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconducto... | 04/29/2008 |
| 7363954 | Tamping labeler By providing projections extending outwardly from the base of a wet tamping face of a tamping labeler, which projections maintain at least a substantial portion of a label at a stand off from said base, the surface tension between the label and tamping face is reduc... | 04/29/2008 |
| 7357115 | Wafer clamping apparatus and method for operating the same A wafer clamping apparatus is provided to secure a wafer within a chamber during wafer processing. The wafer clamping apparatus creates a pressure differential between a top surface and a bottom surface of the wafer. The pressure differential serves to pull the wafe... | 04/15/2008 |
| 7357699 | Substrate holding apparatus and polishing apparatus A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a ... | 04/15/2008 |
| 7341087 | Apparatus for applying discrete parts to a moving web An apparatus and method for engaging and transferring a discrete part having a varying thickness to a substrate web. The apparatus includes one or more transfer assemblies and a web conveyor supporting the substrate web. Each transfer assembly includes a carrier mem... | 03/11/2008 |
| 7335092 | Carrier head for workpiece planarization/polishing A carrier head for supporting a workpiece is provided. The carrier head comprises a mount plate having an aperture therethrough, and a clamp ring having a foot portion and a first leg portion extending therefrom. The first leg portion extends through the aperture, a... | 02/26/2008 |
| 7326104 | Apparatus for holding lenses and method for use thereof An apparatus for holding a plurality of lenses, including: a block having a mounting surface; a cavity defined in the block at the mounting surface; and a through hole defined in the block, the through hole being in communication with the cavity, wherein the mountin... | 02/05/2008 |
| 7311585 | Substrate holding apparatus and polishing apparatus The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a... | 12/25/2007 |
| 7303466 | Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is defined between the membrane and the bottom surface of the support; ... | 12/04/2007 |
| 7294040 | Method and apparatus for supporting a microelectronic substrate relative to a planarization pad A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing pad and the opposite surface of the microelectronic substrate is positioned proximate to a substrate sup... | 11/13/2007 |
| 7295002 | Vacuum chuck spinstand for testing magnetic heads and disks A spinstand having a vacuum chuck clamping mechanism for securing magnetic discs includes a cap (9) and a base (10). A disk-to-be-clamped is held between the cap (9) and the base (10). Vacuum, applied through a port (4) in a mounti... | 11/13/2007 |
| 7294041 | Moving head for semiconductor wafer polishing apparatus Disclosed herein is a moving head for a semiconductor wafer polishing apparatus. The semiconductor wafer polishing apparatus has a table on which a polishing pad is formed, and the moving head mounted via a support unit to hold a wafer relative to a polishing surfac... | 11/13/2007 |
| 7286764 | Reconfigurable modulator-based optical add-and-drop multiplexer An optical add and drop multiplexer system comprising a first module for providing a first signal; a second module for providing a second signal; and a modulator for receiving a channel of the first signal at a first location, the first location configured to actuat... | 10/23/2007 |
| 7285037 | Systems including differential pressure application apparatus A differential pressure application apparatus is configured to apply different amounts of pressure to different locations of a substrate, such as a semiconductor device structure. The apparatus may be used during polishing or planarization processes. The apparatus i... | 10/23/2007 |
| 7258599 | Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of t... | 08/21/2007 |
| 7255771 | Multiple zone carrier head with flexible membrane A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion co... | 08/14/2007 |
| 7255637 | Carrier head vibration damping A carrier head for chemical mechanical polishing that has a base having at least a portion formed of a polymer, a mounting assembly connected to the base having a surface for contacting a substrate, a retainer secured to the portion of the base to prevent the substr... | 08/14/2007 |
| 7255630 | Methods of manufacturing carrier heads for polishing micro-device workpieces Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a carrier assembly includes a head having a chamber, a magnetic field ... | 08/14/2007 |
| 7255634 | Draining device and lens processing system having the same A draining device for removing processing water attached to a lens includes: a first lens holding shaft to which a cup attached to a refractive surface of the lens as a processing jig can be fitted; and a rotating unit which rotates the first lens holding shaft to r... | 08/14/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7220175 | Device for carrying thin wafers and method of carrying the thin wafers A thin wafer carrying device includes a laminated board made of layers of compound material so that the thin wafer is put on the circular board. The compound material includes reinforcement material and high-polymer resin. A metal film good in electric conductivity ... | 05/22/2007 |
| 7207871 | Carrier head with multiple chambers A system for chemical mechanical polishing having a carrier head with pressurizeable chambers that can be configured into pressure zones is described. The system includes a carrier head with a membrane for contacting a substrate during polishing. Pressurizeable cham... | 04/24/2007 |
| 7207554 | Semiconductor element holding apparatus and semiconductor device manufactured using the same A semiconductor element holding apparatus includes a collet for suctioning a semiconductor element by negative pressure to hold the semiconductor element. The collet has a protrusion formed at the semiconductor element-holding surface thereof, and the protrusion is ... | 04/24/2007 |
| 7207868 | Cutting apparatus A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing ta... | 04/24/2007 |
| 7189313 | Substrate support with fluid retention band An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath ... | 03/13/2007 |
| 7186165 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 03/06/2007 |
| 7186171 | Composite retaining ring A two part retaining ring is described that has a lower ring and an upper ring. The lower ring contacts a polishing surface during chemical mechanical polishing. The upper surface and the lower surface of the lower ring have matching grooves formed therein to increa... | 03/06/2007 |
| 7179155 | Device for grinding liquid crystal display panel Disclosed is a device for grinding a liquid crystal display panel improving the efficiency of using equipment by independently operating first and second grinding units for grinding the unit liquid crystal display panel. The present invention includes a first grindi... | 02/20/2007 |
| 7175508 | Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method The present invention provides a polishing apparatus for a semiconductor wafer in which a slide member and a swing holding member are provided in a polishing member that is provided so as to block an opening in a head housing, a slide guide member and a ring member ... | 02/13/2007 |
| 7177081 | High contrast grating light valve type device A grating light valve has with a plurality of spaced reflective ribbons are spatially arranged over a substrate with reflective surfaces. The grating light valve is configured to optimized the conditions for constructive and destructive interference with an incident... | 02/13/2007 |
| RE39471 | Apparatus for and method for polishing workpiece A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus ha... | 01/16/2007 |
| 7163441 | Semiconductor wafer grinder A grinder designed to provide an automatic grinding operation for the manufacture of a semiconductor device wafer. The grinder includes a base, a rotatable index table mounted to the base, and a grinding wheel assembly including a grinding wheel for grinding a flat ... | 01/16/2007 |
| 7160179 | Methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing pla... | 01/09/2007 |
| 7160105 | Temperature controlled vacuum chuck A temperature controllable vacuum chuck includes a mounting bracket, a porous plate, a heating element, and a temperature sensor. The porous plate is mounted to the mounting bracket and is configured for securing a substrate to the vacuum chuck when air is suctioned... | 01/09/2007 |
| 7156720 | Substrate holding apparatus A substrate holding apparatus can accurately control temperature of a substrate in a direct manner with a relatively simple arrangement. The substrate holding apparatus has a top ring configured to hold a substrate to be polished and press the substrate against a po... | 01/02/2007 |
