Superstar singer Michael Jackson co-patented a "Method and means for creating anti-gravity illusion" in 1993.
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7255637 | Carrier head vibration damping A carrier head for chemical mechanical polishing that has a base having at least a portion formed of a polymer, a mounting assembly connected to the base having a surface for contacting a substrate, a retainer secured to the portion of the base to prevent the substr... | 08/14/2007 |
| 7255631 | Orbital polishing apparatus and method An abrasive flow apparatus for polishing a workpiece wherein a horizontal machine tool is adapted such that a workpiece may be secured to first shaft rotatable about a first longitudinal axis. A conjugate form to the workpiece may be secured to a second shaft which ... | 08/14/2007 |
| 7223307 | Disc coater A coater for separating primary particles that are coated with a sticky or tacky resin, and covering the surface of the primary particles with a secondary particle of smaller size is disclosed. The coater includes a disc having a periphery, a motor engaging the disc... | 05/29/2007 |
| 7137874 | Semiconductor wafer, polishing apparatus and method A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base (23), a turntable (27), a polishing pad (29) and a drive mechanism (45) for driven rotation of a polishing head (63). The polishing head... | 11/21/2006 |
| 7134950 | Center clamp A center clamp used with a machining tool having an annular edge has a C-shaped body having an inner end inside the edge and an outer end outside the edge and spaced from it along a clamp axis. A push rod extends along the axis through the outer body end. A rotary j... | 11/14/2006 |
| 7014545 | Vibration damping in a chemical mechanical polishing system A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retain... | 03/21/2006 |
| 6902469 | Work chamfering apparatus and work chamfering method A work chamfering apparatus includes a work holding portion. The work holding portion includes a work table and a clamper. The work table has an upper surface having two end portions each formed with holding grains projecting out of the upper surface. The two end po... | 06/07/2005 |
| 6733369 | Method and apparatus for polishing or lapping an aspherical surface of a work piece An apparatus for polishing or lapping an aspherical surface of a work piece comprises a tool rotatable about an axis, the working surface area of the tool being smaller than the work piece, and an arrangement by means of which the tool and the work piece are adjusta... | 05/11/2004 |
| 6726547 | Cutting device for sheet metal drum A drum slicing apparatus is capable of highly accurately and efficiently slicing a drum made of a thin metal sheet which is relatively highly flexible. The drum slicing apparatus has a support shaft rotatable about its own axis, a cylindrical drum holder supported o... | 04/27/2004 |
| 6676497 | Vibration damping in a chemical mechanical polishing system A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface.... | 01/13/2004 |
| 6656029 | Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same In a semiconductor device having a front surface where circuits are formed and a back surface, a hemispherical solid immersion lens is formed at the back surface of the semiconductor device in a body with the semiconductor device.... | 12/02/2003 |
| 6589103 | Device for the finishing treatment of shaft workpieces The invention relates to a device for the finishing treatment of shaft workpieces, in particular crankshafts and camshafts. The device comprises a carrier, at least one jaw for exerting contact pressure on the workpiece, and a linear guide for guiding the... | 07/08/2003 |
| 6524174 | Clamp for connecting/disconnecting a rotary head to/from a spindle in apparatus for manufacturing a semiconductor device An apparatus for manufacturing a semiconductor device includes a rotatable spindle, a head detachably connected to the spindle, and a clamp for clamping outer circumferential surfaces of the spindle and the head to one another so that the head may be driv... | 02/25/2003 |
| 6497765 | Multi piece swivel chuck for holding conical shaped work An improved chuck for supporting elongated work pieces having conical end portions, such as single crystal ingots used to fabricate semiconductor wafers, while such. The chuck is typically used in a lathe for positioning and allowing rotation of the work ... | 12/24/2002 |
| 6431954 | Method and apparatus for grinding workpieces with precision work performed at the same time as the grinding A description is given of an apparatus and a method for grinding a workpiece, in particular a shaft part. According to the method, the workpiece is clamped in place for the grinding working and its geometry is subsequently ground in such a way as to maint... | 08/13/2002 |
| 6409585 | Polishing apparatus and holder for holding an article to be polished This invention pertains to a substrate holding apparatus comprising a substrate holder having a center axis for rotation and adapted to hold a substrate to be polished and urge the substrate against a polishing pad, a drive shaft for drivingly rotating th... | 06/25/2002 |
| 6322422 | Apparatus for accurately measuring local thickness of insulating layer on semiconductor wafer during polishing and polishing system using the same A polishing system has a polishing pad, a wafer retainer for pressing an insulating layer formed on a semiconductor wafer against polishing slurry spread over a polishing pad and a measuring apparatus for measuring the thickness of different portions of t... | 11/27/2001 |
| 6206772 | Disc grinder A hand tool for holding a spinning disc while the circumference of the disc is being ground is noteworthy for its ability to accommodate disks of various thicknesses. The disc is gripped between two resilient grippers that rotate with the disc. The grippe... | 03/27/2001 |
| 6203401 | Device for superfinishing treated surfaces A device for superfinishing of ground surfaces of workpieces has a finishing block, which can be displaced by means of a drive device in a plane which is orthogonal with respect to the surface to be worked and is pivotable in this plane. By means of this ... | 03/20/2001 |
| 6145849 | Disk processing chuck A memory disk having a central opening and planar sides for receiving magnetic media on both of the sides is bounded by a cylindrical outside diameter peripheral edge and chamfered edges extending between each of the planar sides. The peripheral edge is c... | 11/14/2000 |
| 6099387 | CMP of a circlet wafer using disc-like brake polish pads Apparatus and method for polishing one or both sides of a semiconductor wafer that has a central opening are provided. In one aspect, the apparatus includes a mandrel for holding the wafer and a motor coupled to the mandrel that is operable to rotate the ... | 08/08/2000 |
| 6083092 | Multi-piece lathe chuck for silicon ingots Improved chucks for supporting elongate objects having conical end portions, such as single crystal ingots of semiconductor material, while such objects are held and rotated, as in a lathe. A base portion of the chuck includes bores to accept fasteners to... | 07/04/2000 |
| 6062961 | Wafer polishing head drive A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head d... | 05/16/2000 |
| 6017266 | Dynamic compensating machine tool chuck An improved machine tool chuck is described in which the chuck body has a rotational axis and master jaws mounted in grooves provided on the surface of the chuck body. Each master jaw is dynamically balanced and includes a gripping jaw and an associated u... | 01/25/2000 |
| 6012976 | Multi-piece lathe chuck for silicon ingots Improved chucks for supporting elongate objects having conical end portions, such as single crystal ingots of semiconductor material, while such objects are held and rotated, as in a lathe. A base portion of the chuck includes bores to accept fasteners to... | 01/11/2000 |
| 5797605 | Workholding apparatus Workholding apparatus for mounting a workpiece (6) on a machine tool, the apparatus comprising a diaphragm chuck portion (2) and a tailstock portion (4). The chuck (2) includes a backing ring (70) with face portion (74) attached to the diaphragm (44) with... | 08/25/1998 |
| 5791976 | Surface machining method and apparatus A wafer is rotated on its axis, which is biased with regard to an axis of a grinding wheel, and revolves around an axis which is biased with regard to the axis of the wafer and the axis of the grinding wheel. In this state, the grinding wheel is abutted a... | 08/11/1998 |
| 5616070 | Work drive orienting system for machine tool A work drive orienting system for a machine tool, such as a multiple belt grinder, comprises a head stock and a tail stock for supporting the workpiece to be machined, a locator retained by a spider in the head stock chuck, and a proximity sensor located ... | 04/01/1997 |
| 5609148 | Method and apparatus for dicing semiconductor wafers A method and apparatus for dicing a semiconductor wafer in which the wafer is bowed or bent by forcing it into contact with a spherical surface having parallel grooves therein and in which an array of parallel wire saws that are in registration with the g... | 03/11/1997 |
| 5571044 | Wafer holder for semiconductor wafer polishing machine A semi-conductor wafer polishing machine having at least one polishing pad assembly and at least one wafer holder positioned to hold a semi-conductor wafer against the polishing pad assembly includes a joint having two axes of rotation intersecting at a c... | 11/05/1996 |
| 5525092 | Device for preventing idle rotation in cylindrical ingot grinder When a cylindrical single crystal ingot terminating in generally conical parts at the opposite ends thereof is machined with a cylindrical grinder which is adapted to support the ingot in place by fastening the conical parts of the ingot to a spindle side... | 06/11/1996 |
| 5462475 | Blocking system for prescription lenses An adhesive blocking system, for generating and for fining and polishing eyeglass lenses, utilizes a collar which slides over and engages a lens block, which lens block is secured to a lens blank by a relatively thick adhesive pad, to uniformly transfer p... | 10/31/1995 |
| 5341605 | Dual mode floor sander A dual mode floor sander and having a housing with a front wall, back and side walls, a handle extending upwardly a sanding drum mounted in the housing, and a drive motor, a strip clamp on the drum for clamping a strip of abrasive material for use in the ... | 08/30/1994 |
| 5184432 | Tool for sharpening tungsten electrodes A tool for holding tungsten electrodes for sharpening by an abrasive wheel has a generally cylindrical body with an axial bore at each end for receiving an electrode. The bores have different diameters for use with two sizes of electrodes. The bore is siz... | 02/09/1993 |
| 5095786 | Method and apparatus for dampening brake lathe vibration The invention is directed to a brake lathe having a device to eliminate or reduce vibration. Various types of dampers may be mounted on the arbor shaft of the lathe.... | 03/17/1992 |
| 5081797 | Integrated buffing and grinding system The present invention provides an integrated buffing and grinding system. The system includes a first conveyor for transporting an article to a grinding station. The article is grasped by a robot and brought into and out of contact with an abrasive surfac... | 01/21/1992 |
| 5031303 | Methods and device for accurately positioning a roller segment for the purpose of finishing its pivoting bearing surface, and a method for machining the seats of device of this kind A roller segment (14) is held for the purpose of machining a spherical internal bearing surface (10). Its toric external surfaces (18) is supported against two fixed seats (17), immobilized with respect to rotation about an axis (VV') passing through the ... | 07/16/1991 |
| 5025595 | Method and device for finishing a concave spherical bearing surface on a roller segment, particularly for a homokinetic joint A segment (14) is held for the purpose of grinding its spherical internal bearing surface (10). A toric external surface (18) is supported by claws (21) against fixed (17) and movable (19) seats in such a manner as to have a center (T) and an axis (UU') a... | 06/25/1991 |
| 5005320 | Method and apparatus for tapering an end of an elongated object An elongated object in need of tapering at an end thereof is secured by holder means which comprises a ball bearing that rotates the elongated object and the holder means together by means of contact with a rotating grooved ring disposed upon a rotating p... | 04/09/1991 |
| 5001868 | Apparatus for grinding a point on a tungsten electrode An apparatus for grinding a point on a tip of an elongated tungsten-electrode rod has a base, a disk rotatable on the base about a disk axis and having a disk face substantially perpendicular to the disk axis, and a drive on the base for rotating the disk... | 03/26/1991 |