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| Number | Title | Issue Date |
| 7637800 | Method for machining an edge of a high pressure-resistant component, in particular for hydro-erosively rounding an edge To optimize the results of rounding and therefore to optimize the high pressure resistance of the component, it is firstly proposed that prior to the machining step of hydro-erosive rounding, the edge (5) and the surfaces (4, 6) of the high pressure-re... | 12/29/2009 |
| 7621799 | Polishing method and polishing device Disclosed herein is a polishing method for polishing the end surface of a wafer by using a polishing tape, wherein the end surface of the wafer is polished in the condition where a polishing liquid containing an oxidizing agent is supplied to the end surface of the ... | 11/24/2009 |
| 7591712 | Method of producing silicon blocks and silicon wafers A method of producing silicon blocks by cutting a silicon ingot is provided. The method uses a silicon ingot cutting slurry containing abrasive grains and an alkaline substance so as to provide the silicon blocks that can be produced into silicon wafers each having ... | 09/22/2009 |
| 7578724 | Incorporation of particulate additives into metal working surfaces A mechanical device for lapping, and a method therefore, the device including: (a) a metal workpiece having a metal working surface; (b) a contact surface, disposed generally opposite the working surface, for moving in a relative motion to the working surface; (c) a... | 08/25/2009 |
| 7559825 | Method of polishing a semiconductor wafer Semiconductor wafers have a front surface, a back surface, a notch, and an edge. A method of polishing a wafer includes polishing at least one of the surfaces and the notch of the wafer using a polishing pad and slurry. At least one surface of the wafer is cleaned o... | 07/14/2009 |
| 7527546 | Viscoelastic polisher and polishing method using the same A viscoelastic polisher to be used for polishing. The viscoelastic polisher includes a viscoelastic layer provided on a major surface of a base disk and having a hole of a predetermined radius formed in a center portion thereof, and the base disk has a plurality of ... | 05/05/2009 |
| 7520795 | Grooved retaining ring A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another. ... | 04/21/2009 |
| 7513820 | Method and apparatus for producing micro-texture on a slider substrate using chemical and mechanical polishing techniques A system and method for producing micro-texture on a slider substrate using chemical & mechanical polishing techniques is described. In certain embodiments of the present invention, this is accomplished by a method comprising formulating an abrasive slurry solution ... | 04/07/2009 |
| 7470169 | Method of polishing semiconductor wafers by using double-sided polisher During polishing of the semiconductor wafer by using a double-sided polisher, a larger difference as compared to the prior art is created between a frictional resistance acting on a front surface of a silicon wafer from an upper surface plate side and a frictional r... | 12/30/2008 |
| 7427227 | Method and apparatus for fluid polishing In a fluid polishing method for processing a fine aperture by slurry 7, the slurry is supplied from a cylinder 2a in a slurry flow rate target process until the flow rate increases to a target value of a slurry feed flow rate. When the flow rate... | 09/23/2008 |
| 7422512 | Method and apparatus for surface treatment of a long piece of material An inline-ready method of finishing the surface of a long material (W) capable of preventing any environmental problem from occurring and the mechanical properties of the long material from deteriorating, comprising the steps of holding the long material (W) by two ... | 09/09/2008 |
| 7419421 | Slider having rounded corners and edges, and method for producing the same A slider body characterized by rounded corners and edges and smooth surfaces, formed by polishing with a polymeric fiber and a free abrasive slurry of submicron particles. ... | 09/02/2008 |
| 7413832 | Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask In a method of producing a glass substrate for a mask blank, a surface of the glass substrate is polished by the use of a polishing liquid having a pH value between 7.0 and 7.6 that contains abrasive grains, and the abrasive grains include colloidal silica abrasive ... | 08/19/2008 |
| 7410409 | Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a metho... | 08/12/2008 |
| 7390241 | Linear motion apparatus and method for manufacturing thereof A linear motion apparatus has a guide shaft including a spiral-shaped or linear-shaped rolling element rolling groove, a movable body including a spiral-shaped or linear-shaped rolling element rolling groove opposed to the rolling element rolling groove of the guide... | 06/24/2008 |
| 7390423 | Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate A self-cleaning colloidal slurry and process for finishing a surface of a glass, ceramic, glass-ceramic, metal or alloy substrate for use in a data storage device, for example. The slurry comprises a carrying fluid, colloidal particles, etchant, and a surfactant ads... | 06/24/2008 |
| 7386935 | Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field The lapping of a slider is controlled based on an amplitude of a readback signal which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes at least one magnetic head having a read sensor. During the lapping, ... | 06/17/2008 |
| 7377836 | Versatile wafer refining Methods of refining using a plurality of refining elements are discussed. A refining apparatus having refining elements that can be smaller than the workpiece being refined are disclosed. New refining methods, refining apparatus, and refining elements disclosed. Met... | 05/27/2008 |
| 7374473 | Texturing slurry and texturing method by using same Texturing slurry for texturing a substrate for a magnetic hard disk is obtained by dispersing abrading particles of a specified kind in a specified kind of dispersant. The abrading particles include diamond clusters formed with artificial diamond particles with prim... | 05/20/2008 |
| 7371685 | Low stress barrier layer removal Apparatus and methods of fabricating an interconnect in a dielectric material, such as by a damascene or dual damascene processes. In specific, with the use of a barrier layer, such as to contain copper-containing materials used in the fabrication of the interconnec... | 05/13/2008 |
| 7368387 | Polishing composition and polishing method A polishing composition includes fumed alumina, alumina other than fumed alumina, colloidal silica, a first organic acid, a second organic acid, an oxidizing agent, and water. When the second organic acid is citric acid, the first organic acid is preferably malic ac... | 05/06/2008 |
| 7367870 | Polishing fluid and polishing method A polishing slurry including an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5. The metal oxide dissolver contains one or more compounds selected from one or more acids (A-group) selected from acids of which the negative va... | 05/06/2008 |
| 7367865 | Methods for making wafers with low-defect surfaces, wafers obtained thereby and electronic components made from the wafers The electronic semiconductor component has a crystalline wafer substrate with an active surface and a semiconductor layer coating the active surface. So that the semiconductor layer has a few surface defects the crystalline wafer substrate is a sapphire or silicon c... | 05/06/2008 |
| 7368017 | Method and apparatus for semiconductor wafer planarization Broadly speaking, the present invention provides a method and an apparatus for planarizing a semiconductor wafer (“wafer”). More specifically, the present invention provides for depositing a planarizing layer over the wafer, wherein the planarizing layer serves ... | 05/06/2008 |
| 7364495 | Wafer double-side polishing apparatus and double-side polishing method The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding ... | 04/29/2008 |
| 7357694 | Jet singulation Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable... | 04/15/2008 |
| 7354526 | Processing method for glass substrate, processed glass product and stress applying apparatus A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part having a different etching rate from that of other parts with respec... | 04/08/2008 |
| 7351662 | Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization A low solids-content slurry for polishing (e.g., chemical mechanical planarization) of substrates comprising a dielectric and an associated method using the slurry are described. The slurry and associated method afford high removal rates of dielectric during polishi... | 04/01/2008 |
| 7347767 | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece duri... | 03/25/2008 |
| 7344989 | CMP wafer contamination reduced by insitu clean Reducing CMP wafer contamination by in-situ clean is disclosed herein. The invention can be employed in a method in which a conductive layer is formed on a surface of a semiconductor wafer. After a portion of the conductive layer is removed, an acidic solution is di... | 03/18/2008 |
| 7331847 | Vibration damping in chemical mechanical polishing system A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retain... | 02/19/2008 |
| 7332055 | Substrate processing apparatus A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 a... | 02/19/2008 |
| 7331844 | Polishing method A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow... | 02/19/2008 |
| 7333218 | Systems and methods for determining the location and angular orientation of a hole with an obstructed opening residing on a surface of an article Provided are systems 10 and methods 100 for determining both the location and angular orientation of holes 12 with openings 14 on a surface 16 of an article 18 that are at least partially obstructed. In a method of the prese... | 02/19/2008 |
| 7332224 | Cleaning article containing hydrophilic polymers The invention relates to a cloth that can function as a moisturizing cleanser. When the cloth is moistened with water, it works up into a warm, sudsy cleansing lotion that feels great and works well as a facial cleansing cloth. The cloth contains water, at least one... | 02/19/2008 |
| 7331846 | Blasting apparatus for outer surface of pipe The present invention provides a blasting apparatus for an outer surface of a pipe which ejects a blast material to an outer side of a pipe and grinds the outer surface, comprising: a blast head containing a nozzle which ejects the blast material and a suction port ... | 02/19/2008 |
| 7330250 | Nondestructive evaluation of subsurface damage in optical elements A non-destructive process for evaluating subsurface damage in an optical element focuses a microscope at points within the optical element and measures the intensity of reflected light. In one embodiment, a microscope focus a laser beam at a measurement point with t... | 02/12/2008 |
| 7326356 | Substrate and method of forming substrate for fluid ejection device A method of forming an opening through a substrate having a first side and a second side opposite the first side includes abrasive machining a first portion of the opening into the substrate from the second side toward the first side, and abrasive machining a second... | 02/05/2008 |
| 7323189 | Liquid and low melting coatings for stents A method for forming liquid coatings for medical devices such as stents and angioplasty balloons is provided. The liquid coatings can be made from biodegradable materials in liquid, low melting solid, or wax forms, which preferably degrade in the body without produc... | 01/29/2008 |
| 7323416 | Method and composition for polishing a substrate Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at... | 01/29/2008 |