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| Number | Title | Issue Date |
| 8070557 | Method of polishing glass substrate An object of the present invention is to provide a polishing method for diminishing concave defects of a glass substrate used in a reflective mask for EUVL and the like. The invention relates to a method of polishing a glass substrate which comprises polishing a maj... | 12/06/2011 |
| 8038510 | Apparatus and method for spiral polishing with electromagnetic abrasive An apparatus and method for spiral polishing with electromagnetic abrasive has adopted the principle of electromagnetic and magnetic abrasive along with a lead screw to polish the inner or outer surface of a precise screw or a complicated part. The apparatus include... | 10/18/2011 |
| 7959493 | Method for polishing glass substrate and process for producing glass substrate Spots generated on a glass substrate after a polishing step are reduced. The present invention relates to a method for polishing a glass substrate including injecting a silica abrasive and a high-boiling solvent in a final glass substrate polishing step. The high-bo... | 06/14/2011 |
| 7959492 | Disk-shaped substrate inner circumference polishing method The disk-shaped substrate inner circumference polishing method for polishing an inner circumference of a disk-shaped substrate including a portion having an opening hole at the center thereof includes inserting a brush having a shaft core into the portion having the... | 06/14/2011 |
| 7950983 | Retainer ring A retainer ring and a method of using the retainer ring are provided. The retainer ring has openings along a bottom surface. Grooves encompass the openings and extend to an interior portion of the retainer ring wherein a semiconductor wafer may be held. In operation... | 05/31/2011 |
| 7938716 | Apparatus and method for spiral polishing with electromagnetic abrasive An apparatus and method for spiral polishing with electromagnetic abrasive has adopted the principle of electromagnetic and magnetic abrasive along with a lead screw to polish the inner or outer surface of a precise screw or a complicated part. The apparatus include... | 05/10/2011 |
| 7934977 | Fluid system and method for thin kerf cutting and in-situ recycling A fluid jet system for achieving a kerf width less than 0.015 inches is provided. In one embodiment, the system includes an orifice mount having a high-pressure fluid bore and an abrasive bore configured to communicate an abrasive mixture in form of a paste or foam ... | 05/03/2011 |
| 7871308 | Abrasive, method of polishing target member and process for producing semiconductor device To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxid... | 01/18/2011 |
| 7867060 | Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same Disclosed is a polishing method for polishing a surface of a structure for magnetic-head manufacture by CMP in the process of manufacturing a magnetic head using a ceramic substrate made of a ceramic material containing AlTiC, the structure including the ceramic sub... | 01/11/2011 |
| 7758403 | System, method and apparatus for lapping workpieces with soluble abrasives A soluble abrasive is used to lap workpieces to overcome the problem of embedding and retaining abrasive particles in the workpieces. The soluble abrasives are dissolved from the workpiece even if they become embedded in the workpiece. For example, the abrasives may... | 07/20/2010 |
| 7753760 | Apparatus and method for polishing drill bits A finishing device for finishing the exterior, flutes and tip of a drill bit is disclosed. The finishing device includes a containment vessel which houses an abrasive media which may have a visco-elastic component and an abrasive component. The drill bit is inserted... | 07/13/2010 |
| 7695345 | Polishing compound for semiconductor integrated circuit device, polishing method and method for producing semiconductor integrated circuit device To provide a technique employed when a plane to be polished of a silicon dioxide type material layer is polished in production of a semiconductor integrated circuit device, which is capable of polishing protruded portions by priority while suppressing polishing at r... | 04/13/2010 |
| 7690968 | Aqueous fluid compositions for abrasive slurries, methods of production, and methods of use thereof Aqueous slurry compositions for use in loose-abrasive machining processes, particularly aqueous abrasive slurries for use in wire saw processes. These aqueous slurry compositions comprise abrasive particles uniformly and stably dispersed in lubricant, which comprise... | 04/06/2010 |
| 7637800 | Method for machining an edge of a high pressure-resistant component, in particular for hydro-erosively rounding an edge To optimize the results of rounding and therefore to optimize the high pressure resistance of the component, it is firstly proposed that prior to the machining step of hydro-erosive rounding, the edge (5) and the surfaces (4, 6) of the high pressure-re... | 12/29/2009 |
| 7621799 | Polishing method and polishing device Disclosed herein is a polishing method for polishing the end surface of a wafer by using a polishing tape, wherein the end surface of the wafer is polished in the condition where a polishing liquid containing an oxidizing agent is supplied to the end surface of the ... | 11/24/2009 |
| 7591712 | Method of producing silicon blocks and silicon wafers A method of producing silicon blocks by cutting a silicon ingot is provided. The method uses a silicon ingot cutting slurry containing abrasive grains and an alkaline substance so as to provide the silicon blocks that can be produced into silicon wafers each having ... | 09/22/2009 |
| 7578724 | Incorporation of particulate additives into metal working surfaces A mechanical device for lapping, and a method therefore, the device including: (a) a metal workpiece having a metal working surface; (b) a contact surface, disposed generally opposite the working surface, for moving in a relative motion to the working surface; (c) a... | 08/25/2009 |
| 7559825 | Method of polishing a semiconductor wafer Semiconductor wafers have a front surface, a back surface, a notch, and an edge. A method of polishing a wafer includes polishing at least one of the surfaces and the notch of the wafer using a polishing pad and slurry. At least one surface of the wafer is cleaned o... | 07/14/2009 |
| 7527546 | Viscoelastic polisher and polishing method using the same A viscoelastic polisher to be used for polishing. The viscoelastic polisher includes a viscoelastic layer provided on a major surface of a base disk and having a hole of a predetermined radius formed in a center portion thereof, and the base disk has a plurality of ... | 05/05/2009 |
| 7520795 | Grooved retaining ring A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another. ... | 04/21/2009 |
| 7513820 | Method and apparatus for producing micro-texture on a slider substrate using chemical and mechanical polishing techniques A system and method for producing micro-texture on a slider substrate using chemical & mechanical polishing techniques is described. In certain embodiments of the present invention, this is accomplished by a method comprising formulating an abrasive slurry solution ... | 04/07/2009 |
| 7470169 | Method of polishing semiconductor wafers by using double-sided polisher During polishing of the semiconductor wafer by using a double-sided polisher, a larger difference as compared to the prior art is created between a frictional resistance acting on a front surface of a silicon wafer from an upper surface plate side and a frictional r... | 12/30/2008 |
| 7427227 | Method and apparatus for fluid polishing In a fluid polishing method for processing a fine aperture by slurry 7, the slurry is supplied from a cylinder 2a in a slurry flow rate target process until the flow rate increases to a target value of a slurry feed flow rate. When the flow rate... | 09/23/2008 |
| 7422512 | Method and apparatus for surface treatment of a long piece of material An inline-ready method of finishing the surface of a long material (W) capable of preventing any environmental problem from occurring and the mechanical properties of the long material from deteriorating, comprising the steps of holding the long material (W) by two ... | 09/09/2008 |
| 7419421 | Slider having rounded corners and edges, and method for producing the same A slider body characterized by rounded corners and edges and smooth surfaces, formed by polishing with a polymeric fiber and a free abrasive slurry of submicron particles. ... | 09/02/2008 |
| 7413832 | Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask In a method of producing a glass substrate for a mask blank, a surface of the glass substrate is polished by the use of a polishing liquid having a pH value between 7.0 and 7.6 that contains abrasive grains, and the abrasive grains include colloidal silica abrasive ... | 08/19/2008 |
| 7410409 | Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a metho... | 08/12/2008 |
| 7390423 | Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate A self-cleaning colloidal slurry and process for finishing a surface of a glass, ceramic, glass-ceramic, metal or alloy substrate for use in a data storage device, for example. The slurry comprises a carrying fluid, colloidal particles, etchant, and a surfactant ads... | 06/24/2008 |
| 7390241 | Linear motion apparatus and method for manufacturing thereof A linear motion apparatus has a guide shaft including a spiral-shaped or linear-shaped rolling element rolling groove, a movable body including a spiral-shaped or linear-shaped rolling element rolling groove opposed to the rolling element rolling groove of the guide... | 06/24/2008 |
| 7386935 | Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field The lapping of a slider is controlled based on an amplitude of a readback signal which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes at least one magnetic head having a read sensor. During the lapping, ... | 06/17/2008 |
| 7377836 | Versatile wafer refining Methods of refining using a plurality of refining elements are discussed. A refining apparatus having refining elements that can be smaller than the workpiece being refined are disclosed. New refining methods, refining apparatus, and refining elements disclosed. Met... | 05/27/2008 |
| 7374473 | Texturing slurry and texturing method by using same Texturing slurry for texturing a substrate for a magnetic hard disk is obtained by dispersing abrading particles of a specified kind in a specified kind of dispersant. The abrading particles include diamond clusters formed with artificial diamond particles with prim... | 05/20/2008 |
| 7371685 | Low stress barrier layer removal Apparatus and methods of fabricating an interconnect in a dielectric material, such as by a damascene or dual damascene processes. In specific, with the use of a barrier layer, such as to contain copper-containing materials used in the fabrication of the interconnec... | 05/13/2008 |
| 7367865 | Methods for making wafers with low-defect surfaces, wafers obtained thereby and electronic components made from the wafers The electronic semiconductor component has a crystalline wafer substrate with an active surface and a semiconductor layer coating the active surface. So that the semiconductor layer has a few surface defects the crystalline wafer substrate is a sapphire or silicon c... | 05/06/2008 |
| 7368017 | Method and apparatus for semiconductor wafer planarization Broadly speaking, the present invention provides a method and an apparatus for planarizing a semiconductor wafer (“wafer”). More specifically, the present invention provides for depositing a planarizing layer over the wafer, wherein the planarizing layer serves ... | 05/06/2008 |
| 7367870 | Polishing fluid and polishing method A polishing slurry including an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5. The metal oxide dissolver contains one or more compounds selected from one or more acids (A-group) selected from acids of which the negative va... | 05/06/2008 |
| 7368387 | Polishing composition and polishing method A polishing composition includes fumed alumina, alumina other than fumed alumina, colloidal silica, a first organic acid, a second organic acid, an oxidizing agent, and water. When the second organic acid is citric acid, the first organic acid is preferably malic ac... | 05/06/2008 |
| 7364495 | Wafer double-side polishing apparatus and double-side polishing method The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding ... | 04/29/2008 |
| 7357694 | Jet singulation Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable... | 04/15/2008 |
| 7354526 | Processing method for glass substrate, processed glass product and stress applying apparatus A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part having a different etching rate from that of other parts with respec... | 04/08/2008 |
