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| Number | Title | Issue Date |
| 7255632 | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angul... | 08/14/2007 |
| 7172496 | Method and apparatus for cleaning slurry depositions from a water carrier Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back s... | 02/06/2007 |
| 7131359 | Multiple-spindle lathe In order, in a multi-spindle lathe, comprising a lathe frame, a spindle drum, which is mounted on the lathe frame such that it can rotate about a spindle drum axis and has an end face facing a working space, a multiplicity of workpiece spindles, which are mounted in... | 11/07/2006 |
| 7044832 | Load cup for chemical mechanical polishing Embodiments of a load cup for transferring a substrate are provided. The load cup includes a pedestal assembly having a substrate support and a de-chucking nozzle. The de-chucking nozzle is positioned to flow a fluid between the polishing head and the back side of a... | 05/16/2006 |
| 7044833 | Apparatus for transporting and polishing wafers The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detectin... | 05/16/2006 |
| 6949177 | System and method for processing semiconductor wafers using different wafer processes A system and method for processing semiconductor wafers using different wafer processes utilizes multiple processing assemblies to efficiently perform these wafer processes. The wafer processes performed by the processing assemblies may vary with respect to operatin... | 09/27/2005 |
| 6932685 | Vertical type of double disc surface grinding machine for a brake disc A vertical type of double disc surface grinding machine of the present invention comprises a clamp device which can clamps and holds a work like a brake disc at a correct clamping position under a stable state even when a configuration of a work upper surface is com... | 08/23/2005 |
| 6878044 | Polishing apparatus A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishi... | 04/12/2005 |
| 6846224 | Surface planarization equipment for use in the manufacturing of semiconductor devices Surface planarization equipment of a semiconductor wafer safely transfers wafers to an unloading cassette. In addition to the unloading cassette, the surface planarization equipment includes a loading cassette configured to hold wafers awaiting surface planarization... | 01/25/2005 |
| 6821193 | Material positioning and shaping system apparatus An apparatus, system, and method thereof for material positioning and shaping. The apparatus includes a two-section positioning system which includes a guide and follower thereon for positioning along a path. ... | 11/23/2004 |
| 6716086 | Edge contact loadcup A semiconductor wafer processing apparatus, more specifically, an edge contact loadcup for locating a semiconductor workpiece or wafer into a chemical mechanical retaining ring utilizing a cone, wafer chuck and flexure. The cone aligns the wafer concentrically to th... | 04/06/2004 |
| 6689691 | Method of simultaneously polishing a plurality of objects of a similar type, in particular silicon wafers, on a polishing installation The method allows simultaneous polishing of a plurality of objects of a similar type, preferably silicon wafers. The polishing process is interrupted briefly at least once. During the polishing pause, the carriers on which the objects to be polished have ... | 02/10/2004 |
| 6685542 | Grinding machine A grinding machine includes at least a turntable, rotary chuck tables for holding workpieces to be machined, a first grinding device for grinding the workpiece held on the chuck table and a second grinding device for grinding the first-ground workpiece he... | 02/03/2004 |
| 6660637 | Process for chemical mechanical polishing A chemical mechanical polishing process rotates a wafer having an alignment mark at a wafer rotation rate and a polishing surface at an off-matched rotation rate. The wafer rotation rate and the off-matched rotation rate are not equal. The wafer rotating ... | 12/09/2003 |
| 6629883 | Polishing apparatus A multi-head type polishing apparatus includes a polishing table having a polishing surface, a plurality of top rings for holding workpieces and pressing the workpieces against the polishing surface, and a carousel for supporting the top rings and indexin... | 10/07/2003 |
| 6572459 | Machine for machining in particular superfinishing, cylindrical surfaces of circular cylindrical workpieces, using an abrasive belt moving tangentially Machine for machining using abrasive belts circular workpieces supported by at least one pair of parallel rollers. To pass the workpieces under the machining station(s) 6, the support rollers 16 driven in rotation are moved in translation parallel to their ... | 06/03/2003 |
| 6517418 | Method of transporting a semiconductor wafer in a wafer polishing system A system and method for planarizing a plurality of semiconductor wafers is provided. The method includes the steps of processing each wafer along the same process path using at least two polishing stations to each partially planarize the wafers. The syste... | 02/11/2003 |
| 6478658 | Apparatus for generating lens surfaces An apparatus for simultaneously machining a plurality of lens blanks to provide a lens surface on each blank corresponding to a selected lens prescription includes a tool support assembly and a lens blank assembly. The tool support assembly movably suppor... | 11/12/2002 |
| 6447382 | Apparatus for removing semiconductor wafers from within the runner disks of a double-sided polishing machine An apparatus for removing semiconductor wafers from within the runner disks in a double-sided polishing machine. The apparatus includes a suction head adapted to be connected to a vacuum, which has a plurality of suction ports such that all semiconductor ... | 09/10/2002 |
| 6375556 | Grinding apparatus for grinding workpieces The apparatus includes a frame and a holder rotatably secured to the frame for releasably holding a first workpiece of the workpieces. A mechanism is provided for rotating the holder from a loading station to a grinding station and a grinder is movably se... | 04/23/2002 |
| 6368183 | Wafer cleaning apparatus and associated wafer processing methods Apparatus and method for cleaning, rinsing and drying work pieces such as semiconductor wafers. The apparatus can be combined, in an integrated apparatus, with a CMP machine. The apparatus includes one or more brush boxes with water tracks to convey work ... | 04/09/2002 |
| 6358128 | Polishing apparatus A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against ... | 03/19/2002 |
| 6354926 | Parallel alignment method and apparatus for chemical mechanical polishing A parallel alignment device for chemical mechanical polishing using a plurality of carrier devices (123) rotatably coupled to a turret means. The apparatus (100) includes a turret and plurality of rotatable polishing surfaces (111) positioned around the t... | 03/12/2002 |
| 6336845 | Method and apparatus for polishing semiconductor wafers A system and method for planarizing a plurality of semiconductor wafers is provided. The method includes the steps of processing each wafer along the same process path using at least two polishing stations to each partially planarize the wafers. The syste... | 01/08/2002 |
| 6322428 | Working device and working method for magnet member A working apparatus of a magnet member comprises: a transfer path for guiding magnet members to be ground in one direction; transfer means for pushing the plurality of magnet members in a transfer direction to continuously send out the magnet members to t... | 11/27/2001 |
| 6165056 | Polishing machine for flattening substrate surface There is disclosed a polishing machine capable of flattening a wafer surface uniformly. The machine can modify the flatness of the surface during polishing. The machine has an index table and a polishing head 18. The table attracts the wafer to be polishe... | 12/26/2000 |
| 6126517 | System for chemical mechanical polishing having multiple polishing stations An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes a polishing surfaces, such as pads mounted on respective platens, located at multiple polishing stations. Multiple wafer heads, preferably at least o... | 10/03/2000 |
| 6080045 | Machining methods and apparatus A rotating fixture releasably carries work pieces in a circular path for parading the work pieces, one-by-one, through machining engagement with a grinding wheel for grinding a desired feature or surface onto each work piece. The fixture is adapted such t... | 06/27/2000 |
| 6074275 | Polishing system and method of control of same A polishing system and a method of control of the same enabling reliable transfer of the workpieces into and out of the system while maintaining the precision of polishing of the workpieces. Provision is made of a polishing apparatus 1, a first transfer a... | 06/13/2000 |
| 6048259 | Wafer loading and unloading mechanism for loading robot A wafer loading and unloading mechanism is arranged in such a way that polished wafers stored in the loading cassette in a loading robot are not subject to dust contamination. The mechanism for moving loading cassettes mounted in a loading robot upward an... | 04/11/2000 |
| 5791972 | Polishing/grinding method A method of working a workpiece with an apparatus comprising the steps of holding the workpiece by a holding means, rotating the held workpiece by a rotational means in a direction of a tool to match a rotational axis line of the workpiece with a rotation... | 08/11/1998 |
| 5738574 | Continuous processing system for chemical mechanical polishing An apparatus for polishing semiconductor wafers and other workpieces that includes polishing pads mounted on respective platens at multiple polishing stations. Multiple wafer heads, at least one greater in number than the number of polishing stations, can... | 04/14/1998 |
| 5718030 | Method of dry abrasive delabeling of plastic and glass bottles A dry abrasive delabeling apparatus for both plastic and glass bottles, sometimes called a label stripper, in which the bottles are fed by an in-feed starwheel to a circular starwheel which rotates the bottles slowly. Within the starwheel are wire bristle... | 02/17/1998 |
| 5569059 | System for driving a centerless grinder regulating wheel An electric servomotor drive system for controlling the regulating wheel of a centerless grinder is disclosed. The electric servomotor replaces the transmission normally used on centerless grinders and provides infinitely variable speed control of the reg... | 10/29/1996 |
| 5388374 | Apparatus and method for grinding points Point-grinding apparatus comprising frame means, workpiece transport means operably mounted on the frame means for transporting a plurality of elongated workpieces therealong, workpiece support means disposed adjacent the transport means for supporting th... | 02/14/1995 |
| 5174071 | Lathe and grinder apparatus with two or more side-by-side arranged manipulator-interfaced dual-spindle units The invention relates to a lathe and grinder apparatus for turning and/or grinding works and for any like machining thereof requiring spindles to be used, which comprises two dual-spindle units (T1, T2), that may be even more than two in number, arranged ... | 12/29/1992 |
| 5168657 | Bottle mouth top surface polishing apparatus A bottle mouth top surface polishing apparatus including rotating machine having a rotary shaft, a rotary plate means coupled at its center to the rotary shaft, a grinding plate fixed to the rotary plate and having a grinding face which is to be made in c... | 12/08/1992 |
| 5140774 | Apparatus for polishing hard disk substrates An apparatus capable of simultaneously polishing a plurality of hard disk substrates at the same time includes at least three substrate carriers which are rotatably disposed on an index table and which carry and transfer a plurality of hard disk substrate... | 08/25/1992 |
| 5113623 | Method and apparatus for grinding the work rolls of a planetary rolling mill The work rolls of a planetary rolling mill are subject to high wear and must, therefore, be frequently reground to assure precision of the material rolled. With a life of the work rolls of about six hours, the expenditure of about 12 hours of a mechanic s... | 05/19/1992 |
| 5094037 | Edge polisher Described herein is an edge polisher for polishing chamfered edge portions on the front and rear sides of work, including a first machining stage for polishing the front side of work and a second machining stage for polishing the rear side of work, along ... | 03/10/1992 |
