Did You Know...
...that a workman who left the soap mixing machine on too long was responsible for making Ivory Soap? He was so embarrassed by his mistake that he threw the mess in a stream. Imagine his dismay when the evidence of his error floated to the surface! Result: Ivory soap, the soap that floats.
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| Number | Title | Issue Date |
| 7682225 | Polishing apparatus and substrate processing apparatus The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a poli... | 03/23/2010 |
| 7438628 | Device and control unit for belt sanding systems A belt sanding system comprising a segmented sanding block including a plurality of individually controllable segments and one or more sanding belt deflecting rollers, a plurality of sensing elements corresponding to the plurality of segments, and a device for inter... | 10/21/2008 |
| 7431634 | Platen assembly, apparatus having the platen assembly and method of polishing a wafer using the platen assembly In a platen assembly for a polishing apparatus, a platen supports a polishing belt that makes contact with an object during a polishing process, so that the platen provides a pressure on the polishing belt during the polishing process. A plurality of first bladders ... | 10/07/2008 |
| 7413498 | Lapping apparatus and lapping method A film feeder (FF1) feeds a film (1), a first drive (20) rotates a work (W), a second drive (30) moves the work (W) relative to the film (1), a shoe set handler (40) handles the shoe set (2) to press the film (1 | 08/19/2008 |
| 7371159 | Devices with angularly adjustable sanding units The invention describes devices consisting of a combination of oblique to feed direction aligned belt sanding assemblies, with drives or devices for low sanding belt speeds and/or with conventional, or modified for sanding belt oblique operation, electronic segmente... | 05/13/2008 |
| 7367873 | Substrate processing apparatus A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and t... | 05/06/2008 |
| 7241207 | Grinding machine and method for grinding a workpiece Disclosed is a grinding machine comprising oscillating driving means (3, 4) for setting grinding means (1) into an oscillating grinding motion and an actuation device (7) that is provided with a plurality of actuation areas (8) which can ... | 07/10/2007 |
| 7235002 | Method and system for making glass sheets including grinding lateral edge(s) thereof A method and system for making glass sheets is provided. At least one grinding wheel is provided for grinding a lateral edge of a glass sheet. An airbag and corresponding air pressure regulator are provided for biasing the grinding wheel against the lateral edge of ... | 06/26/2007 |
| 7189145 | Method of and apparatus for producing roll A belt grinding is integrated with an electroerosion machine for contouring the working surface of a mill roll and providing a texture thereon. The belt grinder can superfinish the roll and remove peaks in the surface without significantly affecting the mean surface... | 03/13/2007 |
| 7179154 | Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette An apparatus for cleaning a semiconductor wafer edge is provided. The apparatus includes a film with an abrasive layer configured to contact the edge surface of a semiconductor substrate coated with a contaminant residue layer. A first reel having the film wound the... | 02/20/2007 |
| 7160173 | Abrasive articles and methods for the manufacture and use of same The invention provides an abrasive article, and methods for the use and the manufacture of the article. The abrasive article comprises an abrasive surface; and a performance index associated with the abrasive article, the index indicating an aspect of the abrasive p... | 01/09/2007 |
| 7160178 | In situ activation of a three-dimensional fixed abrasive article An apparatus including a fixed abrasive article interposed between a substrate and a support assembly. The support assembly creates regions of high and low erosion force at the interface between the substrate and the fixed abrasive article. The high erosion force is... | 01/09/2007 |
| 7153182 | System and method for in situ characterization and maintenance of polishing pad smoothness in chemical mechanical polishing A system and method for in situ measurement and maintenance of preferred pad smoothness in a CMP process is disclosed. The system includes a linear polisher having one or more sensors for detecting fluid pressure, fluid flow or motor current at the linear polisher d... | 12/26/2006 |
| 7124753 | Brazed diamond tools and methods for making the same Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as ... | 10/24/2006 |
| 7115023 | Process tape for cleaning or processing the edge of a semiconductor wafer A wafer bevel processing apparatus comprises a plurality of rollers for rotatably supporting a wafer, first process roller, a second process roller, and a process tape extending between the first process roller and the second process roller. The first and second pro... | 10/03/2006 |
| 7108587 | Backup shoe for microfinishing and methods A shoe for supporting an abrasive tape having an abrasive face and an opposed back face, wherein the shoe comprises a support surface including a frictional engagement material for frictionally engaging the back face of the abrasive tape. The frictional engagement m... | 09/19/2006 |
| 7108592 | Substrate holding apparatus and polishing apparatus The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus includes a vertically movable top ring body fo... | 09/19/2006 |
| 7097547 | Handheld skate sharpener The invention provides for a powered hand held apparatus for sharpening ice skate blades having an elongated frame with a drive pulley located at one and, and a driven pulley located at the other end. An abrasive grinding belt loops over the pulleys and passes over ... | 08/29/2006 |
| 7090605 | Apparatus for processing a prosthetic component An idler or tensioning assembly for an electronically controlled sanding/polishing machine is provided, the sanding/polishing machine utilizing a plurality of exchangeable polishing wheel assemblies of which the idler assembly is one. Each polishing wheel assembly i... | 08/15/2006 |
| 7090560 | System and method for detecting abrasive article orientation Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abr... | 08/15/2006 |
| 7077733 | Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for non-adhesively securing the subpad thereto. The subpad support... | 07/18/2006 |
| 7066787 | Substrate processing apparatus A substrate processing apparatus is used for removing surface irregularities occurring on a peripheral portion (a bevel portion, an edge portion, and a notch) of a substrate, such as a semiconductor wafer, and films deposited as a contaminant on the peripheral porti... | 06/27/2006 |
| 7052380 | Sanding station for a belt sanding machine A sanding station for a belt sanding machine includes at least an endless sanding belt guided over deflection rollers and a pressure segment belt circulating within the sanding belt for pressing the sanding belt against the workpiece. The running direction of the pr... | 05/30/2006 |
| 7048615 | Pad backer and CMP process using the same A pad backer is described, comprising a backing plate, an elastomer layer and a pad backing ring. The elastomer layer has a bottom surface bonded to the backing plate and an upper surface with a protrudent part at the edge portion thereof. The pad backing ring has a... | 05/23/2006 |
| 7033250 | Method for chemical mechanical planarization An invention is provided for a chemical mechanical planarization apparatus. The apparatus includes a cylindrical frame, a polishing membrane attached to an end of the cylindrical frame, and a pad support disposed within the cylindrical frame and below the polishing ... | 04/25/2006 |
| 7033245 | Lapping apparatus and lapping method A lapping apparatus lapping a work having a pre-machined surface comprises a lapping film which includes a thin substrate having a surface provided with abrasive grains, a shoe disposed at a back surface side of the lapping film, a shoe driving unit which drives the... | 04/25/2006 |
| 7025660 | Assembly and method for generating a hydrodynamic air bearing A method and assembly for generating a hydrodynamic air bearing is described, wherein at least one rotor is rotated to force air through channels defined in a platen located adjacent to a linear belt and the forced air is directed to the linear belt. The method incl... | 04/11/2006 |
| 7018273 | Platen with diaphragm and method for optimizing wafer polishing A platen is provided for use in a chemical mechanical planarization (CMP) system. The platen is provided with diaphragms that overcome a fluid-conservation problem experienced in prior air-bearing platens. The diaphragms enable a removal profile to be manipulated by... | 03/28/2006 |
| 7018276 | Air platen for leading edge and trailing edge control An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to... | 03/28/2006 |
| 7014529 | Substrate processing method and substrate processing apparatus A substrate processing apparatus polishes a to-be-polished portion of a semiconductor substrate with a polishing tape. Part of the polishing tape is heated in advance. Part of the polishing tape is deformed conforming to a shape of the to-be-polished portion. Part o... | 03/21/2006 |
| 7008303 | Web lift system for chemical mechanical planarization Generally, a method and system for lifting a web of polishing material is provided. In one embodiment, the system includes a platen that has a first lift member disposed adjacent to a first side and a second lift member disposed adjacent to a second side. The platen... | 03/07/2006 |
| 6988934 | Method and apparatus of a variable height and controlled fluid flow platen in a chemical mechanical polishing system An apparatus for use in a chemical mechanical planarization (CMP) system is provided. The apparatus includes a platen capable of introducing fluid beneath a polishing pad and a platen support cover configured to surround the platen. The platen is disposed at a first... | 01/24/2006 |
| 6976906 | Apparatus for reducing compressed dry air usage during chemical mechanical planarization A chemical mechanical planarization (CMP) system is provided. The system includes a polishing surface and a platen disposed along an underside of the polishing surface. A retaining ring surrounds the platen. The retaining ring includes a lower annular sleeve and an ... | 12/20/2005 |
| 6955588 | Method of and platen for controlling removal rate characteristics in chemical mechanical planarization Methods and a platen control parameters of a removal rate characteristic in chemical mechanical planarization, while allowing a low-cost polishing pad to be used especially in fast edge operations, and while reducing the amount of fluid used to support the polishing... | 10/18/2005 |
| 6951511 | Platen with peripheral frame for supporting a web of polishing material in a chemical mechanical planarization system Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure all... | 10/04/2005 |
| 6939212 | Porous material air bearing platen for chemical mechanical planarization A platen for use in chemical mechanical planarization (CMP) systems includes a platen plate that has at least one recess defined therein. The at least one recess has an input port formed therein. A porous material is disposed in the at least one recess. The porous m... | 09/06/2005 |
| 6939203 | Fluid bearing slide assembly for workpiece polishing A fluid bearing polishing apparatus for carrying a polishing member for chemical mechanical polishing includes a fluid supply and a fluid dispensing structure to support the polishing member. A method of polishing a workpiece includes supporting a polishing member o... | 09/06/2005 |
| 6935936 | Abrading mechanisms Hand held abrading tools are disclosed. The abrading tools include clamping mechanisms to quickly and reliably secure sanding paper, bristled sheets, polishing cloths, and the like, to the tool, while at the same time providing the operator with increased agility an... | 08/30/2005 |
| 6926589 | Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing. ... | 08/09/2005 |
| 6921324 | Pad backer A pad backer is described, comprising a backing plate, an elastomer layer and a pad backing ring. The elastomer layer has a bottom surface bonded to the backing plate and an upper surface with a protrudent part at the edge portion thereof. The pad backing ring has a... | 07/26/2005 |
