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| Number | Title | Issue Date |
| 7878885 | Deflection device for a rope saw assembly A deflection device for a rope saw assembly, includes a deflection roller (12; 52; 92); a stationary protective cover (13; 53, 93) surrounding art least some regions of the deflection roller (12; 52; 92); and at least one cover member (23; 63... | 02/01/2011 |
| 7846011 | Belt sander A belt sander is disclosed that may include a sanding assembly having a first roller and a second roller, the sanding assembly being configured to receive a sanding belt around the first roller and the second roller to define a sanding surface therebetweeen. The bel... | 12/07/2010 |
| 7837537 | Belt sander A belt sander is disclosed that may include a sanding assembly having a first roller and a second roller, the sanding assembly being configured to receive a sanding belt around the first roller and the second roller to define a sanding surface therebetween. The belt... | 11/23/2010 |
| 7744446 | Sanding apparatus A sanding apparatus includes a plurality of posts each having an upper end and a lower end. The plurality of posts is four posts. A first horizontal support extends between two of the posts and a second horizontal support extends between another two of the posts. Th... | 06/29/2010 |
| 7704127 | Electrodeposited wire tool A plating layer 18 of Ni or the like is formed around the outer peripheral face 14 of a wire tool 10, and super abrasive grains 16 are electrodeposited so as to be embedded in the plating layer 18. A coating layer 20 is form... | 04/27/2010 |
| 7413504 | Blade sharpening device with blade contour copying device The present invention provides a blade sharpening device designed for sharpening a blade for a uniform sharpening of the edge thereof. The blade sharpening device contains a base having a guide slidably movable relative to the base. The guide includes a material tha... | 08/19/2008 |
| 7406905 | System for driving a wire loop cutting element This invention is directed toward a system for driving a wire loop cutting element. More particularly, the disclosed invention employs a frame and pulleys to drive a wire loop cutting element. ... | 08/05/2008 |
| 7381116 | Polishing media stabilizer A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support... | 06/03/2008 |
| 7371158 | Plating removing apparatus for two-piece wheel To provide a plating removing apparatus for 2-piece wheels, which can easily and beautifully remove plating at the welding planned portion on the rim inner circumferential surface and achieves 2-piece wheels with rims plated without requiring any troublesome operati... | 05/13/2008 |
| 7371159 | Devices with angularly adjustable sanding units The invention describes devices consisting of a combination of oblique to feed direction aligned belt sanding assemblies, with drives or devices for low sanding belt speeds and/or with conventional, or modified for sanding belt oblique operation, electronic segmente... | 05/13/2008 |
| 7367873 | Substrate processing apparatus A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and t... | 05/06/2008 |
| 7364498 | Double armed finishing tool for tubing materials A belt grinding finishing tool incorporates a pair of mounting arms projecting forwardly from a drive housing to support a single abrasive belt entrained around drive and idler pulleys. The first mounting arm is positionally fixed relative to the drive housing, but ... | 04/29/2008 |
| 7357694 | Jet singulation Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable... | 04/15/2008 |
| 7353818 | Apparatus and method for slicing an ingot A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly s... | 04/08/2008 |
| 7351131 | Method for manufacturing semiconductor device and polishing apparatus In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched around the periphery of the substrate so that a polishing face of the poli... | 04/01/2008 |
| 7347769 | Method of fabricating pliant workpieces, tools for performing the method and methods for making those tools An improved method of manufacturing automotive accessory drive belts or other workpieces of pliant material which have a grooved operative face, a tool having an abrasive ramp configuration for performing said improved method and a method of manufacturing said tool ... | 03/25/2008 |
| 7341502 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular... | 03/11/2008 |
| 7322878 | Belt grinder and attachment for grinding pipe ends A belt grinder includes a motor, a driving disc, a contact disc, a grinding belt, and a housing, where the motor and the driving disc are moveable with respect to the contact disc in order to vary the distance between the axis of the contact disc and the axis of the... | 01/29/2008 |
| 7303467 | Chemical mechanical polishing apparatus with rotating belt A chemical mechanical polishing apparatus has a movable platen, a drive mechanism and a chucking mechanism. The drive mechanism is attached to the platen, is configured to support a generally linear polishing sheet with a portion of the polishing sheet extending ove... | 12/04/2007 |
| 7303662 | Contacts for electrochemical processing Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact elem... | 12/04/2007 |
| 7294047 | Sander device A sander device includes a housing pivotally attached to a supporting base and rotatable between a horizontal position and a vertical position, a driven roller and an idle roller rotatably disposed in the housing, and an endless driving belt engaged over the driven ... | 11/13/2007 |
| 7278909 | Method for manufacturing semiconductor device and polishing apparatus In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched around the periphery of the substrate so that a polishing face of the poli... | 10/09/2007 |
| 7273410 | Guiding and pressing device for a belt sander A guiding and pressing device for a belt sander includes two triangular guiding blocks or sheet-like inclined guiding blocks, which are disposed at suitable positions on a front side frame of the sander and near to a circulating path of a sand belt. The two guiding ... | 09/25/2007 |
| 7261832 | Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the inventi... | 08/28/2007 |
| 7255336 | Workpiece clamp device and method A workpiece clamp device comprising a workpiece cradle for placing a workpiece, and endless belts for holding the workpiece down on the workpiece cradle. ... | 08/14/2007 |
| 7255632 | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angul... | 08/14/2007 |
| 7241205 | Method of processing a substrate A method of processing a substrate is disclosed, wherein a sidewall surface of a notch portion formed in a circumferential portion of a substrate to be processed is polished by using a cylindrical polishing head rotatable with an axis as a rotational center. ... | 07/10/2007 |
| 7238092 | Low-force electrochemical mechanical processing method and apparatus The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or ... | 07/03/2007 |
| 7229338 | Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Planarizing machines, planarizing pads, and methods for planarizing or endpointing mechanical and/or chemical-mechanical planarization of microelectronic substrates. One particular embodiment is a planarizing machine that controls the movement of a planarizing pad a... | 06/12/2007 |
| 7226346 | Sanding apparatus A belt sander (2) comprising a housing (4) and having a lower sanding surface (40) and an upper sanding surface (42) opposite the first sanding is disclosed. The sander has a larger rear roller (32) driven by a motor (22), a... | 06/05/2007 |
| 7223160 | System for replacement of sheet abrasive A system for rapid replacement of abrasive in machinery which uses the abrasive to finish the surfaces of workpieces that pass through the machinery on a belt, such as so-called widebelt sanders. One preferred embodiment of the system employs an abrasive material th... | 05/29/2007 |
| 7214124 | Equipment and method for polishing both sides of a rectangular substrate Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving mechanism configured to move the carrier, first and second polishing pads w... | 05/08/2007 |
| 7201647 | Subpad having robust, sealed edges Provided are encapsulated belts and encapsulated pads for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other workpieces. The encapsulated belts and pads are characterized by a ro... | 04/10/2007 |
| 7197805 | Embedment removal method Draft tube embedments of a hydroelectric turbine are removed for replacement and/or upgrading. Several shafts for saw wire access, forming a horizontal polygonal shape are drilled outside the draft ring and a circular slot cut below the bottom ring to meet the shaft... | 04/03/2007 |
| 7182668 | Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table... | 02/27/2007 |
| 7160182 | Support for sanding apparatus A support stand (2) for a sanding apparatus having a housing, a motor, and a sanding belt of abrasive material adapted to be driven around a plurality of rollers by means of the motor is disclosed. The support stand (2) comprises a body portion (6 | 01/09/2007 |
| 7156727 | Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelec... | 01/02/2007 |
| 7153182 | System and method for in situ characterization and maintenance of polishing pad smoothness in chemical mechanical polishing A system and method for in situ measurement and maintenance of preferred pad smoothness in a CMP process is disclosed. The system includes a linear polisher having one or more sensors for detecting fluid pressure, fluid flow or motor current at the linear polisher d... | 12/26/2006 |
| 7146678 | Ash and dust removal system A system for removing dust, dirt and like from the surface of a flexible paper substrate and accurately positioning same comprises a transport assembly for conveying the paper substrate along a path of travel. The transport assembly includes a rotating vacuum drum h... | 12/12/2006 |
| 7144304 | Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the mi... | 12/05/2006 |
