Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 7381118 | Belt sander A belt sander is disclosed that may include a sanding assembly having a first roller and a second roller, the sanding assembly being configured to receive a sanding belt around the first roller and the second roller to define a sanding surface therebetweeen. The bel... | 06/03/2008 |
| 7357696 | Method and apparatus for reconditioning digital discs An automated method for reconditioning a plurality of digital discs within a reconditioning apparatus is disclosed. The method comprises holding the digital discs in a load area, and then transferring each of the digital discs from the load area to at least one work... | 04/15/2008 |
| 7186165 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 03/06/2007 |
| 7155767 | Scrub cleaning device, scrub cleaning method, and manufacturing method of information recording medium There is disclosed a scrub cleaning device which can reduce cleaning time and which requires no large-scaled device for transferring a substrate to the next cleaning process. The scrub cleaning device comprises: a scrub pad 10 provided with two annular plate ... | 01/02/2007 |
| 7144307 | Point superabrasive machining of nickel alloys A process for point superabrasive machining of a nickel based material comprising the steps of providing a tool having a grinding surface coated with a superabrasive material, orienting the tool relative to a surface of the nickel based material to be machined so th... | 12/05/2006 |
| 7118451 | CMP apparatus and process sequence method A CMP apparatus and process sequence. The CMP apparatus includes multiple polishing pads or belts and an in-line metrology tool which is interposed between adjacent polishing pads or belts in the apparatus. A material layer on each of multiple wafers is successively... | 10/10/2006 |
| 7104867 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 09/12/2006 |
| 7101259 | Polishing method and apparatus A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surf... | 09/05/2006 |
| 7022000 | Wafer processing machine A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck tab... | 04/04/2006 |
| 7004815 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 02/28/2006 |
| 7001248 | Fine tilting adjustment mechanism for grinding machine Provided is a grinding machine comprising a carrier adapted to raise or lower, the carrier including a V-shaped groove across its top and a forward pad at either side, a spindle unit including an inverted L-shaped mounting plate, and a fine tilting adjustment mechan... | 02/21/2006 |
| 6942069 | Braking system for a wheeled abrading machine An abrading machine braking system for use in braking a wheeled abrading machine having a rotating abrading tool used in abrading a surface. The abrading machine braking system uses two braking wheels that engage the surface of the wheels of the abrading machine and... | 09/13/2005 |
| 6942545 | Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wa... | 09/13/2005 |
| 6808444 | Polishing fixture for fiber optic connectors A polishing fixture is provided for polishing the optic ends of a fiber optic cable terminated in a fiber optic connector. A holding plate has a receptacle for receiving the fiber optic connector, with at least a portion of each of a first side and a second side of ... | 10/26/2004 |
| 6648765 | Supporting device for a plurality of adapter chucks A supporting device for a plurality of adapter chucks for the precision grinding or polishing of optical components comprises a spindle shaft having a central bore for supplying one of a gas and a vacuum, at least one arm adjustably supported by a head of... | 11/18/2003 |
| 6645049 | Polishing holder for silicon wafers and method of use thereof An method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof. Each cavity has notches cut in the walls ther... | 11/11/2003 |
| 6620257 | Scrub cleaning method for substrate and manufacturing method for information recording medium There is disclosed a scrub cleaning device which can reduce cleaning time and which requires no large-scaled device for transferring a substrate to the next cleaning process. The scrub cleaning device comprises: a scrub pad 10 provided with two annular pl... | 09/16/2003 |
| 6612905 | Silicon wafer polishing holder and method of use thereof A method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof and a backing plate positioned on a side of the... | 09/02/2003 |
| 6379230 | Automatic polishing apparatus capable of polishing a substrate with a high planarization An automatic polishing apparatus has an index table. A loading station, a primary polishing station, a secondary polishing station, and an unloading station are set along the circumference of an index table. The index table has a plurality of holders 2 ea... | 04/30/2002 |
| 6343980 | Flattening machine Three columns 10, 20, 30 are set up in an approximately triangle arrangement. A saddle 51, which fixes a main spindle 50 thereto, is held in contact with a side face of the column 10, 20 or 30 or a brace 40 which unitarily connects two or three of the col... | 02/05/2002 |
| 6241585 | Apparatus and method for chemical mechanical polishing A chemical mechanical polishing apparatus includes a rotatable carousel and multiple carrier head assemblies coupled to the carousel. Each carrier head assembly includes multiple carrier heads each of which can hold a single substrate. The apparatus inclu... | 06/05/2001 |
| 5792709 | High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers The present invention is a high-speed planarizing machine with a platform that holds the upward facing wafer stationary during planarization, and a carrier positioned opposite the platform. The carrier rotates about an eccentric axis and translates in a p... | 08/11/1998 |
| 5718619 | Abrasive machining assembly An abrasive machining assembly (10) wherein a worktable (14) is rotatably supported on a frame (12) for rotation about a table axis (A) and a plurality of platens (32) are supported on the worktable (14) with each of the platens (32) being adapted for sup... | 02/17/1998 |
| 5674116 | Disc with coolant passages for an abrasive machining assembly An abrasive machining assembly (10) wherein a worktable (14) is rotatably supported on a frame (12) for rotation about a table axis (A) and a plurality of platens (32) are supported on the worktable (14) with each of the platens (32) being adapted for sup... | 10/07/1997 |
| 5547415 | Method and apparatus for wafer chamfer polishing A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup u... | 08/20/1996 |
| 5525096 | Apparatus for grinding spherical surface An apparatus for grinding spherical surfaces of workpieces includes a grinding section having a grindstone rotating mechanism for rotating around an axis of a shaft thereof with a grindstone held at an end of the shaft, a feeding mechanism for feeding the... | 06/11/1996 |
| 5482495 | Apparatus for polishing a spherical surface An apparatus for polishing spherical surfaces of workpieces includes a polishing device rotating on a shaft thereof while holding a polishing tool at an end of the shaft. A pivoting device pivots the polishing device around a polishing position of the too... | 01/09/1996 |
| 5140774 | Apparatus for polishing hard disk substrates An apparatus capable of simultaneously polishing a plurality of hard disk substrates at the same time includes at least three substrate carriers which are rotatably disposed on an index table and which carry and transfer a plurality of hard disk substrate... | 08/25/1992 |
| 5080537 | Apparatus for machining bevel gear An apparatus for machining a bevel gear has an apparatus frame, a spindle head provided on the apparatus frame for rotatably supporting a spindle on which a machining tool is mounted, and an indexing unit provided for holding a workpiece such that the wor... | 01/14/1992 |
| 4914867 | Apparatus for processing end face optical fiber connector Apparatus for processing an end face of an optical fiber connector includes a rotatable index shaft mounted on a frame. A plurality of rotatable chucks are mounted on the index shaft so as to hold optical fiber connectors, respectively. In accordance with... | 04/10/1990 |
| 4829716 | Apparatus for automatically performing plural sequential spherical grinding operations on workpieces An apparatus for automatically performing plural sequential spherical grinding operations on workpieces such as optical lenses includes a machine base, an index table mounted on the machine base for rotation about an axis, a plurality of chuck units suppo... | 05/16/1989 |
| 4753045 | Adjustable double end grinding machine Arrangements of four-axis adjustable connecting rod grinding machines are disclosed having four separately driven and adjustable grinding wheels carried in opposed pairs on opposite sides of a moving work support to grind simultaneously the opposite sides... | 06/28/1988 |
| 4663890 | Method for machining workpieces of brittle hard material into wafers A method for machining a disk-shaped workpiece, for example having a thickness of between 350 and 1200 microns, formed of brittle crystalline material having a Vickers hardness greater than about 7,000 N/mm2 in the manufacture of a wafer having... | 05/12/1987 |
| 4603512 | Apparatus for lapping a facet on a tip of a workpiece An apparatus for lapping a facet at the tip of a stylus by softly setting the tip down adjacent a rotating scaife comprises a moveable carriage supported on a platform. The carriage is moved vertically along a second axis substantially orthogonal to the f... | 08/05/1986 |
| 4583325 | Grinding machine A grinding machine adapted for grinding surfaces of thin workpieces comprises a rotating table provided with at least a workpiece holder on which a workpiece to be ground is held, and a plurality of grinding wheels having different grain sizes ranging fro... | 04/22/1986 |
| 4481742 | Machine tool elevating and guiding apparatus A machine tool elevating and guiding apparatus comprising a tool mounting head which is movable vertically between a pair of guide columns. Guide surfaces on the guide columns are positioned closely adjacent to guided surfaces on the tool mounting head an... | 11/13/1984 |
| 4481738 | Grinding machine A grinding machine adapted for grinding surfaces of thin workpieces comprises a rotating table provided with at least a workpiece holder on which a workpiece to be ground is held, and a plurality of grinding wheels having different grain sizes ranging fro... | 11/13/1984 |
| 4343112 | Apparatus for grinding metallographic specimens A grinding machine for grinding and polishing metallographic specimens. A multiple-grinder, indexable, vertical grinder assembly is supported on a rigid frame enclosed within a housing. A rotating, vertically positionable specimen holder assembly is also ... | 08/10/1982 |
| 4318250 | Wafer grinder A rotatable grinding wheel bears against a rotatable wafer disk support wheel to grind the wafer disks to a predetermined thickness. The grinding wheel is translatable laterally to its axis of rotation, which translation repositions the grinding wheel wit... | 03/09/1982 |
| 4170091 | Apparatus for resharpening cutting blades for gear cutting machine An improved apparatus for sharpening and resharpening cutting blades provides for very accurate positioning of a plurality of cutting blades relative to a single grinding plane for a grinding wheel. The apparatus includes means for positioning the cutting... | 10/09/1979 |
