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Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
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| Number | Title | Issue Date |
| 8057284 | Tool for polishing and fine-grinding optically active surfaces in precision optics A tool for polishing and fine-grinding optically active surfaces in precision optics has a main body which can be attached in a rotationally fixed manner to a tool spindle of a machining machine. A guide element is arranged concentrically in the main body and is mou... | 11/15/2011 |
| 7255637 | Carrier head vibration damping A carrier head for chemical mechanical polishing that has a base having at least a portion formed of a polymer, a mounting assembly connected to the base having a surface for contacting a substrate, a retainer secured to the portion of the base to prevent the substr... | 08/14/2007 |
| 7254996 | Method and apparatus for testing rubber tires or solid rubber wheel laboratory samples A method and apparatus for testing rubber tires includes an abrader for rubbing against the surface of the tire and an eraser for removing particles of rubber left on the abrading surface by the tire. The eraser has the capability of absorbing oil or wax included in... | 08/14/2007 |
| 7241203 | Six headed carousel The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, ... | 07/10/2007 |
| 7238090 | Polishing apparatus having a trough Methods and apparatus for chemical mechanical polishing are described. In one embodiment, an apparatus includes a table top and a transfer station and multiple polishing stations are mounted on the table top. The apparatus further includes multiple washing stations,... | 07/03/2007 |
| 7238092 | Low-force electrochemical mechanical processing method and apparatus The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or ... | 07/03/2007 |
| 7226344 | Method of processing antifriction bearing unit for wheel A method of processing an antifriction bearing unit for a wheel, the antifriction bearing unit including an outer race, an inner race, a plurality of rolling elements and a flange portion for directly or indirectly mounting a brake disk provided to one of the outer ... | 06/05/2007 |
| 7217176 | Polishing tool with several pressure zones The invention refers to a polishing tool for optical lenses with at least one polishing pad adaptable at least partially to the shape of a lens surface of said lenses and drivable by means of a drive shaft, said polishing pad having a membrane, wherein said polishin... | 05/15/2007 |
| 7182668 | Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table... | 02/27/2007 |
| 7166016 | Six headed carousel The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, ... | 01/23/2007 |
| 7097544 | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations... | 08/29/2006 |
| 6960122 | Optical disc repairing device An optical disc repairing device is mounted on a repairing machine base to perform cleaning, maintenance and repair of the optical disc. The repairing device includes a movement transmitting element, a connecting element mounted on the movement transmitting element,... | 11/01/2005 |
| 6932684 | Reciprocal blade lapping machine A reciprocal blade lapping machine (20) is taught that is used for sharpening cutting and shearing blades. The lapping machine consists a convex lap plate (32) mounted on an enclosure (22) rotated by an electric motor (34) connected to a ... | 08/23/2005 |
| 6783446 | Chemical mechanical polishing apparatus and method of chemical mechanical polishing There is provided an apparatus for polishing a substrate, including (a) a polishing pad formed with a plurality of through-holes through which polishing material is supplied to a surface of the polishing pad, (b) a level block on which the polishing pad is mounted, ... | 08/31/2004 |
| 6705929 | Cloth cleaning device and polishing machine Cloth cleaning device of a polishing machine which is capable of fully cleaning a polishing cloth including a part in the vicinity of a center roller. The cloth cleaning device includes an arm movable in a plane parallel to the polishing cloth between a first positi... | 03/16/2004 |
| 6666756 | Wafer carrier head assembly A wafer carrier head assembly for holding a wafer in chemical mechanical planarization applications is dis;losed that includes a downwardly protruding wafer retaining ring that moves independent of the wafer carrier head and retains an edge of the wafer o... | 12/23/2003 |
| 6537135 | Curvilinear chemical mechanical planarization device and method The present invention relates to an apparatus and method for polishing substrate surfaces. The method can include the steps of holding a substrate against a polishing surface and depositing slurry on the polishing surface. The method can further include t... | 03/25/2003 |
| 6524176 | Polishing pad A polishing pad has a first layer, a second layer, a hole and a plug. The hole is formed in the polishing pad and has a first section in the first layer of the polishing pad and a second section in a second layer of the polishing pad. The plug is embedded... | 02/25/2003 |
| 6422918 | Chemical-mechanical polishing of photoresist layer The present invention relates to a system for controllably removing photoresist. A CMP system is employed for polishing the photoresist. A non-abrasive polishing liquid adapted to react with the photoresist to sufficiently modify bonding in the photoresis... | 07/23/2002 |
| 6416392 | Sound enhanced lapping process A method of lapping semiconductor wafers includes the step of transmitting sounds generated during the lapping process to a receiver, allowing the operator to use sound to more quickly detect problems associated with starting the lap process.... | 07/09/2002 |
| 6379216 | Rotary chemical-mechanical polishing apparatus employing multiple fluid-bearing platens for semiconductor fabrication A rotary chemical-mechanical polishing apparatus with multiple fluid-bearing platens for use in semiconductor fabrication is described together with a method for chemical-mechanical polishing of semiconductor substrates ("wafers"). A single polishing pad ... | 04/30/2002 |
| 6358117 | Processing method for a wafer A surface grinding method is provided by which grinding striations are produced so that the striations can fully be removed by a polish-off amount less than required in a conventional way in mirror polishing following surface grinding using an infeed type... | 03/19/2002 |
| 6354918 | Apparatus and method for polishing workpiece A polishing apparatus has a turntable with a polishing surface, a top ring for pressing a workpiece against the polishing surface under a given pressure to polish the workpiece, and a dresser for dressing the polishing surface. The polishing surface has a... | 03/12/2002 |
| 6341995 | Chemical mechanical polishing apparatus The present invention relates to improved chemical mechanical polishing apparatus, which reduce air sharp pressure on the polish head for preventing the breakage unpolished wafer. The improved chemical mechanical polishing apparatus of present invention i... | 01/29/2002 |
| 6322422 | Apparatus for accurately measuring local thickness of insulating layer on semiconductor wafer during polishing and polishing system using the same A polishing system has a polishing pad, a wafer retainer for pressing an insulating layer formed on a semiconductor wafer against polishing slurry spread over a polishing pad and a measuring apparatus for measuring the thickness of different portions of t... | 11/27/2001 |
| 6165056 | Polishing machine for flattening substrate surface There is disclosed a polishing machine capable of flattening a wafer surface uniformly. The machine can modify the flatness of the surface during polishing. The machine has an index table and a polishing head 18. The table attracts the wafer to be polishe... | 12/26/2000 |
| 6139406 | Combined slurry dispenser and rinse arm and method of operation The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces,... | 10/31/2000 |
| 6116987 | Method of polishing hard disc and polishing apparatus therefor A method and apparatus for polishing hard discs uniformly while minimizing frictional electricity between the discs and polishing materials as well as preventing from frictionally heated deformation. A turntable for placing a disc thereon is freely rotata... | 09/12/2000 |
| 6110013 | End-face polishing and cleaning apparatus An end-face polishing and cleaning apparatus comprises at least one jig plate for supporting ferrules each fixed to an end of a respective optical fiber. At least one set of a polishing machine and a cleaning machine is provided for polishing and cleaning... | 08/29/2000 |
| 6071180 | Method of surface grinding a flange surface of a wheel hub for an automotive vehicle A process for surface grinding of a flange surface of a wheel hub onto which a brake disk can be mounted for a motor vehicle includes the mounting of the wheel bearing on the wheel hub before the grinding operation. An outer bearing ring is then clamped o... | 06/06/2000 |
| 5893796 | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus The polishing pad for a chemical mechanical polishing apparatus and a method of making the same. The polishing pad has a covering lawyer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer wi... | 04/13/1999 |
| 5893755 | Method of polishing a semiconductor wafer A method of polishing semiconductor wafers is provided. The method will not impair the original (pre-polishing) contour of semiconductor wafers, and semiconductor wafers can be polished so as to have high flatness. In the method according to this inventio... | 04/13/1999 |
| 5820449 | Vertically stacked planarization machine A vertically stacked planarization machine includes two or more vertically stacked individual platens on which wafers are polished. The wafers are held by wafer holders which may rotate the wafers. The individual platens are orbited in order to polish the... | 10/13/1998 |
| 5785584 | Planarizing apparatus with deflectable polishing pad A planarizing system which significantly reduces the problems associated with non-uniform removal of surface material across the face of a semiconductor wafer or other comparable workpiece. The invention involves a planarizing apparatus that takes the lea... | 07/28/1998 |
| 5665656 | Method and apparatus for polishing a semiconductor substrate wafer A semiconductor wafer polishing apparatus includes a housing and a turntable mounted in the housing. The turntable has an axis of rotation and a surface for affixing a semiconductor wafer. The polishing apparatus also includes a motor mounted to the housi... | 09/09/1997 |
| 5655949 | Method of polishing waxers using a vertically stacked planarization machine A vertically stacked planarization machine includes two or more vertically stacked individual platens on which wafers are polished. The wafers are held by wafer holders which may rotate the wafers. The individual platens are also orbited in order to polis... | 08/12/1997 |
| 5645469 | Polishing pad with radially extending tapered channels A polishing pad having a polishing surface with radially extending tapered channels is disclosed. The polishing surface includes an inner radius within an outer radius, and the channels extend from the inner radius to the outer radius. Preferably, the out... | 07/08/1997 |
| 5554065 | Vertically stacked planarization machine A vertically stacked planarization machine includes two or more vertically stacked individual platens on which wafers are polished. The wafers are held by wafer holders which may rotate the wafers. The individual platens are also orbited in order to polis... | 09/10/1996 |
| 5547418 | Optical fiber end-surface polishing device An optical fiber end-surface polishing device has an improved ferrule fixing device allowing ferrules with optical fibers to be attached to or detached from a holder plate for polishing by a simple operation. The optical fiber end-surface polishing device... | 08/20/1996 |
| 5527209 | Wafer polisher head adapted for easy removal of wafers Device is described that reduces the forces needed to release a wafer from a wet polishing surface after polishing. Device comprises attachment adapted to be mounted to a polishing apparatus to permit attachment surface, configured to mate with two region... | 06/18/1996 |
