Celebrity Inventors
Comic actor Danny Kaye received patent D166,807 for the co-design of "Blowout Toy or the Like". It's similar to one of those toys that unravels when you blow into at a birthday party except Kaye's has three blowouts going in different directions, not just one.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8298043 | Pad conditioner dresser Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing... | 10/30/2012 |
| 7927186 | Method for producing glass substrate for magnetic disk In the production of a glass substrate for magnetic disk, the present invention provides a method for producing a glass substrate for magnetic disk including a step of polishing a main surface of a circular glass substrate using a polishing pad made of a foamed resi... | 04/19/2011 |
| 7473162 | Pad conditioner dresser with varying pressure Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. Generally, the method may include dressing the chemical mechanica... | 01/06/2009 |
| 7413986 | Feedforward and feedback control for conditioning of chemical mechanical polishing pad A method, apparatus and medium of conditioning a planarizing surface includes installing a wafer to be polished in a chemical mechanical polishing (CMP) apparatus having a polishing pad and a conditioning disk, polishing the wafer under a first set of pad conditioni... | 08/19/2008 |
| 7407433 | Pad characterization tool Tools and methods for in-situ characterizing of a surface of a polishing pad are described. A characterization tool is integrated with polishing tool so that the polishing pad can be monitored in-situ. The characterization tool and the polishing pad can be rotated o... | 08/05/2008 |
| 7404754 | CNC tungsten steel cutting machine A CNC tungsten steel cutting machine suitably used to cut a metal material, such as tungsten carbide steel, includes an operational platform, a cutting mechanism, a feeding mechanism, a delivering mechanism, and a control panel. When a metal material to be cut is re... | 07/29/2008 |
| 7366575 | Wafer polishing control Methods of controlling polishing of wafers are disclosed. In one aspect, a method may include measuring one or more pre-polish thicknesses of one or more layers of a wafer. The one or more layers may then be polished. Then a post-polish thickness of a layer of the w... | 04/29/2008 |
| 7357695 | Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or a polishing pad relative to the other to rub the microfeature workpi... | 04/15/2008 |
| 7359069 | Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, CMP polisher, and method of manufacturing semiconductor device The main sensor 15 measures the distance Lm to the surface of the pad 2a, and the sub-sensor 16 measures the distance Ls to the surface of the reference block 12. What is actually taken as the measured value is the value of (Lm+Ls)... | 04/15/2008 |
| 7354333 | Detection of diamond contamination in polishing pad Methods for reconditioning a polishing pad and detecting diamond contamination of the polishing pad, are disclosed. In particular, the methods include the step of exposing the reconditioned polishing pad to an energy source to induce the diamond contamination to flu... | 04/08/2008 |
| 7341501 | Gear grinding machine, method for dressing threaded grinding wheel and method for grinding work A gear grinding machine, a method for dressing a threaded grinding wheel, and a method for grinding a work are disclosed. A dressing tool is rotated in a vertical plane, with its position being fixed. The position of a threaded grinding wheel is NC-controlled, where... | 03/11/2008 |
| 7335091 | Methods and apparatus for machining a coupling A method facilitates fabricating a coupling including a first annular coupling member and a second annular coupling member. The method comprises coupling the first coupling member to a machine assembly that includes a plurality of grinding wheels coupled to a tool s... | 02/26/2008 |
| 7326103 | Vertically adjustable chemical mechanical polishing head and method for use thereof The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof. ... | 02/05/2008 |
| 7306506 | In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging Chemical-mechanical planarization (CMP) apparatus and methods for detecting polishing pad properties using ultrasonic imaging is presented. An ultrasonic probe assembly transmits ultrasonic signals onto the surface of a polishing pad during a CMP process. Reflected ... | 12/11/2007 |
| 7300342 | Scratch removal device and method A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a c... | 11/27/2007 |
| 7294045 | Apparatus and method for edge processing of a glass sheet An apparatus for edge processing of a glass sheet, the apparatus including a shroud, a finishing member and a wiping device. The finishing member is substantially enclosed by the shroud. The apparatus uses pressurized air emitted by at least one slot in the wiping d... | 11/13/2007 |
| 7288165 | Pad conditioning head for CMP process In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between... | 10/30/2007 |
| 7289865 | Optimization algorithm to optimize within substrate uniformities A method to optimize semiconductor processing equipment (hardware settings and process conditions) to minimize non-uniformities within a wafer based on linescan measurements and a calculation of or prediction for a polar map. Measurements of a metrology value are ta... | 10/30/2007 |
| 7278901 | Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided. In a preferred method, for example, a first displacement of a semicon... | 10/09/2007 |
| 7269472 | Many-headed grinding machine and grinding method using many-headed grinding machine A control device 40 controls the grinding processing at a processing portion of a work W so as to shift to the last precision grinding step from a rough grinding step through a middle grinding step and a finishing grinding step. When the grinding in each step... | 09/11/2007 |
| 7258596 | Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of a polishing pad includes applying ultrasonic energy to the polishing... | 08/21/2007 |
| 7229336 | Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the pla... | 06/12/2007 |
| 7226340 | Grinding machine The grinding machine (10) according to the invention serves in particular for the machining or production of tools. It comprises a machine bed 11 and a workpiece spindle (14) arranged thereon, which receives the workpiece (13) to be machi... | 06/05/2007 |
| 7220163 | Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided. In a preferred method, for example, a first displacement of a semicon... | 05/22/2007 |
| 7210981 | Smart conditioner rinse station A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioni... | 05/01/2007 |
| 7204320 | Active rotational balancing system for orbital sanders A system for active dynamic balancing of a rotating tool driven by a motor having a shaft supported by a first and second bearing on opposing sides of the motor includes an acceleration sensing assembly configured to sense radial accelerations on the shaft producing... | 04/17/2007 |
| 7205504 | Interlayer composite for a laminated transparency An interlayer composite includes a plastic sheet having a predetermined outer shape and a major surface; a pair of bus bars, and an adhesive layer securing the bus bars directly on the major surface of the plastic sheet in a fixed relationship to one another. ... | 04/17/2007 |
| 7201632 | In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging Chemical-mechanical planarization (CMP) apparatus and methods for detecting polishing pad properties using ultrasonic imaging is presented. An ultrasonic probe assembly transmits ultrasonic signals onto the surface of a polishing pad during a CMP process. Reflected ... | 04/10/2007 |
| 7198542 | Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor In a system and a method according to the present invention, a seismic signal from a seismic sensor coupled to a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables in a CMP system. ... | 04/03/2007 |
| 7198543 | Gear grinding machine A gear grinding machine comprises: a moving mechanism rotatably mounted with a threaded grinding wheel, and arranged to move the threaded grinding wheel along directions of X, Z, and Y, and to turn the threaded grinding wheel in a Y-Z plane; an NC device for control... | 04/03/2007 |
| 7198546 | Method to monitor pad wear in CMP processing A pad groove analyzer and associated method configured to assess the grooves on the pad and determine how worn the pad is. The pad groove analyzer may be configured to monitor the grooves via a contact or no-contact process. In a contact process, the pad groove anal... | 04/03/2007 |
| 7195543 | Machine tool with 5 machining axes with a continuous grinding tool profilling system A machine tool for machining a part by on-head and continuous grinding tool profiling includes a part holder support driven into rotation by first driving means around a first axis in a vertical plane, a machining system provided with a grinding tool for machining t... | 03/27/2007 |
| 7189145 | Method of and apparatus for producing roll A belt grinding is integrated with an electroerosion machine for contouring the working surface of a mill roll and providing a texture thereon. The belt grinder can superfinish the roll and remove peaks in the surface without significantly affecting the mean surface... | 03/13/2007 |
| 7189149 | Method of truing chamfering grindstone and chamfering device A truing method for a chamfering grindstone for performing chamfering work on a peripheral edge of a plate-shaped object, comprising the steps of: performing chamfering work on a truing grindstone with a master grindstone having a desired groove shape and forming a ... | 03/13/2007 |
| 7186651 | Chemical mechanical polishing method and apparatus A method for removing material from the surface of a semiconductor wafer with a chemical mechanical polishing process is described. The method uses a polishing pad on which a line-pattern of grooves is formed. The pattern comprises orderly spaced grooved-area and ar... | 03/06/2007 |
| 7175510 | Method and apparatus for conditioning a polishing pad A method and apparatus for polishing a thin film on a semiconductor substrate is described. A polishing pad is rotated and a wafer to be polished is placed on the rotating polishing pad. The polishing pad has grooves that channels slurry between the wafer and polish... | 02/13/2007 |
| 7172495 | Method and apparatus using a sensor for finish-machining teeth Teeth of a workpiece of a workpiece are finish-machined by first gauging shapes of the workpiece teeth and generating actual-value signals corresponding thereto. These actual-value signals are compared to set points representing desired tooth shapes, and the teeth o... | 02/06/2007 |
| 7172491 | Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the pla... | 02/06/2007 |
| 7156717 | situ finishing aid control A method of using finishing aids for advanced finishing control is described. A finishing surface is used generally to induce frictional wear. The finishing aids with preferred in situ control can improve control of the coefficient of friction, the tangential force ... | 01/02/2007 |
| 7150675 | Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner In a system and a method according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables in a CMP system. ... | 12/19/2006 |
