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| Number | Title | Issue Date |
| 7771252 | Apparatus for grinding and/or finishing a workpiece The invention relates to a device (2) for grinding and/or finishing a workpiece (8) mounted on and/or in a workpiece mounting (22, 28). The workpiece (8) and the workpiece mounting (22, 28) may be set in an oscillating movement ( | 08/10/2010 |
| 7335093 | Blade sharpening holder A sharpening holder for manually-sharpening a cutting edge to be honed over a honing surface includes a body, an adjustable clamping component, and a plurality of roller members. The body has a first end, a second end and a tool support surface between the first end... | 02/26/2008 |
| 7001250 | Synchronous tape head polishing device and method In the tape head polishing method of the present invention the tape head is moved orthogonally to the polishing medium (such as diamond polishing tape) direction of motion during polishing. The polishing medium motion is synchronized with the tape head motion, such ... | 02/21/2006 |
| 6942554 | Apparatus and process for polishing a substrate An apparatus for polishing a substrate with an optical surface. The apparatus contains a polishing pad and and a device for oscillating the polishing pad while simultaneously contacting it with at least 90 percent of said optical surface. ... | 09/13/2005 |
| 6783440 | Polishing apparatus A polishing apparatus has a top ring for holding a workpiece to be polished and a polishing table movable relative to the top ring. The polishing table has a polishing surface for polishing the workpiece held by the top ring. The polishing apparatus further has a po... | 08/31/2004 |
| 6739948 | Synchronous tape head polishing device and method In the tape head polishing method of the present invention the tape head is moved orthogonally to the polishing medium (such as diamond polishing tape) direction of motion during polishing. The polishing medium motion is synchronized with the tape head motion, such ... | 05/25/2004 |
| 6729937 | Barrel-polishing apparatus There is disclosed a barrel-polishing apparatus comprising a polishing medium bath with polishing mediums received therein, a base, an arm mounted on the base, and a workpiece attachment device mounted on a distal end portion of the arm and adapted to attach a workp... | 05/04/2004 |
| 6544110 | Abrasive polishing apparatus The present invention is based on the practice of abrasive machining with no sealed working chamber by the employment of a visco-elastic abrasive medium, behaving predominantly as an elastic solid at the applied strain of the orbital working motion, and a... | 04/08/2003 |
| 6315641 | Method and apparatus for chemical mechanical polishing Method and apparatus for chemically mechanically polishing semiconductor substrates with enhanced durability, reliability and polishing effectiveness. In the method of the present invention, the substrate and the pad respectively orbits to guarantee unifo... | 11/13/2001 |
| 6186874 | Blade sharpening apparatus A blade sharpening apparatus having a hollow housing with an internal drive motor for inducing back and forth movement on a pair of aligned elongated abrasive stones. The abrasive stones are retained by a stone holder and possess a cross section in the fo... | 02/13/2001 |
| 6139400 | Polishing system and method with polishing pad pressure adjustment Disclosed is a polishing system used for polishing a surface to be polished of an object to be polished by a polishing pad, which is capable of improving uniformity of the surface to be polished of the object to be polished by positively, accurately adjus... | 10/31/2000 |
| 6074281 | Fining and polishing machine and method for ophthalmic lenses A fining and polishing machine and method enable a work piece, suitably a spectacle lens, to be polished with a relative motion between the lens and a tool that is precisely matched to the specific lens prescription. The lens and tool are reciprocated alo... | 06/13/2000 |
| 5908530 | Apparatus for chemical mechanical polishing An apparatus for polishing wafers, preferably by chemical mechanical polishing. The apparatus includes a table defining a planar polishing surface adapted to contain a polishing medium and a wafer carrier assembly adapted to hold a wafer against the polis... | 06/01/1999 |
| 4105012 | Apparatus for cutting up hard and brittle material A gang saw is used for cutting up hard and brittle material, particularly semiconductor material, in which saw there is a reciprocating movement of workpiece with a large amplitude and low frequency and an additional vibrating motion of the sawblades in t... | 08/08/1978 |
