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| Number | Title | Issue Date |
| 7955092 | Connection base assembly for an IC testing apparatus A connection base assembly for an IC testing apparatus has a base, a top cap and a conductive assembly. The base has a bottom board and an outer frame provided with multiple grooves. The grooves are defined in the top of and extend to the bottom of the outer frame t... | 06/07/2011 |
| 7878821 | IC socket having improved latch device An IC socket for receiving an IC package comprises a socket body for carrying the IC package. A plurality of contacts are received in the socket body for electrical connection with the IC package. A driving member is mounted upon the socket body and able to operate ... | 02/01/2011 |
| 7722361 | Test socket An improved test socket for use in testing integrated circuits. The test socket includes a housing having one or more slots formed therein. Contacts can be received within respective slots and maintained therein with rear ends of the contacts in engagement with trac... | 05/25/2010 |
| 7686621 | Integrated circuit test socket having elastic contact support and methods for use therewith A socket can be used for testing an integrated circuit package having a plurality of rows of leads. The socket includes a base that is aligned with a circuit board having a plurality of contact pads. A plurality of rows of contact fingers are electrically coupled to... | 03/30/2010 |
| 7445465 | Test socket An improved test socket for use in testing integrated circuits. The test socket includes a housing having one or more slots formed therein. Contacts can be received within respective slots and maintained therein with rear ends of the contacts in engagement with trac... | 11/04/2008 |
| 7371072 | Spring interconnect structures An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second... | 05/13/2008 |
| 7371078 | Insert attachable to an insert magazine of a tray for holding an area array type electronic component to be tested To attain an object of providing an insert for holding wide-ranging kinds of area array type electronic components and realizing certain connection between external terminals of an area array type electronic component and connection terminals of a socket, and an ele... | 05/13/2008 |
| 7371095 | Connector easily adapted to miniaturization A connector includes a cover adapted to push a connection object toward a first contact. The first contact includes a first contact portion to be connected to a contact portion of the connection object. A second contact includes a second contact portion and a lockin... | 05/13/2008 |
| 7365280 | Switch and manufacturing method thereof A switch provided with a fixed contact and a movable contact coming into contact with each other and separating from each other. The surface of at least one of the fixed contact and the movable contact is provided with a plurality of recesses whose edges are overlap... | 04/29/2008 |
| 7364434 | Electrical connector with improved terminal An electrical connector (1) includes an isulative housing (10) defining therein a number of passageways (114) and a number of electrical terminals (20) retained in the passageways. Each electrical terminal includes a contact portion (2... | 04/29/2008 |
| 7332712 | Camera module fabrication method including the step of removing a lens mount and window from the mold An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window s... | 02/19/2008 |
| 7303929 | Reloading of die carriers without removal of die carriers from sockets on test boards A method of testing microelectronic dies is described. A respective set of dies is inserted into die carrier bodies releasably held within a set of sockets secured to a burn-in board. A set of die carrier covers is closed, each die carrier cover being secured to a r... | 12/04/2007 |
| 7294008 | Waterproof lead and method for making the same A waterproof lead includes an electric wire, a terminal, and a heat-shrink tube. The electric wire has an insulative cover and a plurality of exposed core wires. The terminal has a contact member, a core wire crimping section that crimps the plurality of exposed cor... | 11/13/2007 |
| 7281954 | Socket connector improved in adaptability to a terminal position of a connection object In a socket connector for connecting a first connection object to a second connection object, a housing has a receiving portion for receiving the first connection object in an inserting direction and holds a conductive contact and a conductive engaging member. The c... | 10/16/2007 |
| 7265562 | Cantilever microprobes for contacting electronic components and methods for making such probes Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments ... | 09/04/2007 |
| 7265565 | Cantilever microprobes for contacting electronic components and methods for making such probes Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments ... | 09/04/2007 |
| 7255576 | Kelvin contact module for a microcircuit test system A test assembly for testing electrical performance of microcircuits contained in leadless packages has Kelvin contacts. Slider contacts in a plurality of contact assemblies slide compliantly to accommodate lack of coplanarity in terminals on the package. A resilient... | 08/14/2007 |
| 7225531 | Index head in semicondcutor device test handler An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head as... | 06/05/2007 |
| 7214077 | Press-fit assembling device A press-fit assembling device is provided to assemble enclosures including a chassis and a housing. The press-fit assembling device includes a base and a driver. The base includes a platform defined with a locating channel to secure the chassis located thereon. The ... | 05/08/2007 |
| 7200934 | Electronic assemblies with high capacity heat sinks and methods of manufacture An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan a... | 04/10/2007 |
| 7199359 | Camera module fabrication method including singulating a substrate An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window s... | 04/03/2007 |
| 7186153 | Side entry terminal pin A terminal pin includes a substantially elongate pin body having a longitudinal axis and a terminal head, the terminal head having an opening for receiving a wire, the opening extending substantially transverse to the longitudinal axis. This results in a substantial... | 03/06/2007 |
| 7167167 | Write head for a display tag having a liquid crystal display Apparatus for changing the display state of a bistable liquid crystal display on a display tag having a plurality of electrical contact pads connected to a corresponding plurality of electrodes in the liquid crystal display includes a body defining a slot for receiv... | 01/23/2007 |
| 7161811 | Card holder for SIM card A card holder has a generally flat and rectangular plastic base fixed to a support, e.g. a printed-circuit board of a card reader, and formed centered on an axis with a pair of pivot pins. A generally rectangular and flat metal cover forming a slot dimensioned to ho... | 01/09/2007 |
| 7160127 | Variable latch Numerous embodiments of variable latch and a method of formation are disclosed. One or more embodiments of the claimed subject matter may comprise a latch with a plurality of contact points formed thereon, and method of fabrication. The plurality of contact points m... | 01/09/2007 |
| 7147482 | Two-point contact type socket A two-point contact type socket makes an electric contact with a terminal of an electronic component. A first contact piece is to be brought into contact with a first side of the terminal of the electronic component. A second contract piece is to be brought into con... | 12/12/2006 |
| 7144265 | Socket for electric component A socket for an electric component is provided with a socket main body having a part for accommodating an electric component and a plurality of first contact pins, and a socket covering vertically movably mounted to the socket main body. A second contact pin is atta... | 12/05/2006 |
| 7137840 | Fastening structure and an electrical connector using the fastening structure A fastening structure and an electrical connector using the fastening structure are provided. The fastening structure includes an upper rod and a lower rod. The rods individually include an axle center part, a pressing part, and an operating part. When the operating... | 11/21/2006 |
| 7134592 | Method and protection apparatus for installation of a temperature-sensitive electronic component Temperature-sensitive electrical and electronic components which are connected to a board by soldering during the installation process are protected from the heat during the soldering process in order to prevent permanent damage to the components. The solder connect... | 11/14/2006 |
| 7126217 | Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support In a semiconductor flip-chip package having a semiconductor die 104 as part of a substrate assembly, a lid 110 (or lid assembly) and substrate 102 are supported to prevent tilting and teetering of the lid. The lid and substrate do not adhere, so... | 10/24/2006 |
| 7126111 | Camera module having a threaded lens barrel and a ball grid array connecting device An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window s... | 10/24/2006 |
| 7125259 | IC socket An IC socket that is capable of obtaining stable, reliable electrical connections between an IC package and a socket housing, even in the case that the IC package is placed at a position shifted from a predetermined position on the socket housing then pressed, durin... | 10/24/2006 |
| 7121842 | Electrical connector An electrical connecting apparatus comprises: a plurality of plate-like probes, each of which electrically connects an electrode of a device under test and a conductive portion formed in a base plate, and each of which has a tip to be pressed against the electrode o... | 10/17/2006 |
| 7094081 | Electrical connector assembly The present invention provides an electrical connector assembly and a method of mating the same. The electrical connector assembly includes a panel sub-assembly which mates to at least one electrical connector body. Preferably two cam leveraging devices which rotate... | 08/22/2006 |
| 7094068 | Load board A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas, each of which is disposed corresponding to a lead of a packaged IC f... | 08/22/2006 |
| 7080989 | Memory metal springs for heatsink attachments An assembly for a computer system is mountable on a circuit board of a computer system. The assembly includes a base portion for engaging with an electronic component mounted on the circuit board. The assembly also includes a spring formed of memory metal. The sprin... | 07/25/2006 |
| 7077663 | Module connector A connector has an inner side face defining a chamber formed with an opening. A module body is inserted from the opening to be accommodated in the chamber. A first conductive member is provided on an outer periphery of the module body which is opposed to the inner s... | 07/18/2006 |
| 7077680 | Module connector The present invention provides a module connector including a housing having four sidewalls that define a chamber for receiving a module therein. Each sidewall defines a plurality of contact recesses. A plurality of contacts is accommodated in the contact recesses a... | 07/18/2006 |
| 7074049 | Kelvin contact module for a microcircuit test system A test assembly for testing electrical performance of microcircuits contained in leadless packages has Kelvin contacts. Slider contacts in a plurality of contact assemblies slide compliantly to accommodate lack of coplanarity in terminals on the package. A resilient... | 07/11/2006 |
| 7065868 | Methods for installing a circuit device A method is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is... | 06/27/2006 |
