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"I hate what they've done to my child...I would never let my own children watch it. "
Vladimir Zworykin, television pioneer ; Talking about an invention in which he played a critical role.
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| Number | Title | Issue Date |
| 7604485 | Chip socket for basic input/output system A chip socket includes first and second bottom plates attached together, four first sidewalls and second sidewalls, and a number of first and second conductive. Each of the first sidewalls vertically extends upward from a side of the first bottom plate. The first co... | 10/20/2009 |
| 7455532 | Electronic component pin connectors An electronic component pin connector comprising a non-conductive housing with a substrate end and an electronic component connection end, the housing comprising one or more electrical contacts, the or each electrical contact exten... | 11/25/2008 |
| 7371609 | Stacked module systems and methods The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a form standard associated with one or more CSPs provides a physical f... | 05/13/2008 |
| 7371076 | Chip socket structure An improved structure of a chip socket is composed of a chip socket which is a square fixing seat, and a center of the fixing seat is provided with a cavity for holding a chip. Inner sides of the cavity are arranged with insertion slots for terminals, the cavity of ... | 05/13/2008 |
| 7369334 | Optical device with alignment compensation An optical device is provided which includes a plurality of optical modules and an alignment compensation module. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to... | 05/06/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7364435 | Electrical connector housing having stylized guide box An electrical connector includes an insulative housing (10) adapted to engage conductive terminals, and having an IC package mating surface (101) and an opposite substrate mounting surface (103). A rigid strip (12), in a substantially wav... | 04/29/2008 |
| 7360376 | Function transform sub-base Methods, devices and systems for coupling an HVAC controller to an HVAC system are provided. In several embodiments, a sub-base is provided allowing an HVAC controller to be coupled to a printed wire board to allow, in some cases, modification of the HVAC controller... | 04/22/2008 |
| 7335046 | Electrical connector An electrical connector is disclosed with a multipurpose clamping part, comprising an insulating body; a plurality of electrical terminals received in the insulating body; and a clamping part to clamp a chip module. The clamping part comprises a clamping portion con... | 02/26/2008 |
| 7335974 | Multi stack packaging chip and method of manufacturing the same A multi stack packaging chip and a method of manufacturing the chip are provided. The method includes forming at least one second circuit element on a first wafer; forming a second wafer having a cavity and a one third circuit element formed opposite to the cavity; ... | 02/26/2008 |
| 7320604 | Electronic circuit module and method for fabrication thereof Provided is an electronic circuit module using a board having no cavity and a method for efficiently fabricating it. Electronic components are mounted on the front face of a module board 1, and an LSI chip 5 is die-bonded on the bottom face thereof in ... | 01/22/2008 |
| 7315000 | Electronic module with dual connectivity An electronic module includes electronic circuitry and first and second connection mechanisms, both operationally connected to the electronic circuitry, for mounting the module in a larger electronic device by different respective methods. Preferably, the first conn... | 01/01/2008 |
| 7310458 | Stacked module systems and methods The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be em... | 12/18/2007 |
| 7295448 | Interleaved power converter A power converter architecture interleaves full bridge converters to alleviate thermal management problems in high current applications, and may, for example, double the output power capability while reducing parts count and costs. For example, one phase of a three ... | 11/13/2007 |
| 7290331 | Component mounting apparatus and component mounting method In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting s... | 11/06/2007 |
| 7289329 | Integration of planar transformer and/or planar inductor with power switches in power converter A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled... | 10/30/2007 |
| 7285918 | Organic light emitting diode display and fabrication method thereof Organic light emitting diode (OLED) displays and fabrication methods thereof are provided. The OLED display comprises a substrate having a display area and a peripheral area. An array of pixels is disposed in the display area. Column and row control circuits are dis... | 10/23/2007 |
| 7281322 | Component mounting method In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting s... | 10/16/2007 |
| 7278855 | High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised ... | 10/09/2007 |
| 7273812 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 09/25/2007 |
| 7271481 | Microelectronic component and assembly having leads with offset portions A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a ... | 09/18/2007 |
| 7267556 | Electrical junction box An electrical junction box includes at least three printed boards that constitute an internal circuit. Conductors on the printed boards can be easily connected to one another through a relay connector. The printed boards are contained in a casing assembly so that th... | 09/11/2007 |
| 7263770 | Electrical connector Provided is an electrical connector having first and second surfaces and configured to establish electrical communication between two or more electrical devices. The electrical connector includes an insulative housing and a resilient, conductive contact retained in ... | 09/04/2007 |
| 7259452 | Leaded package integrated circuit stacking A system and method for electrically and thermally coupling adjacent IC packages to one another in a stacked configuration is provided. A flex circuit is inserted in part between ICs to be stacked and provides a connective field that provides plural contact areas th... | 08/21/2007 |
| 7258552 | Socket for holding a circuit board module A socket is for use in an electronic system to hold a circuit board module that has spaced electrical pads proximate to two opposite edges thereof. The socket includes a base and electrical conductors. The base has rectangularly arranged peripheral portions and is f... | 08/21/2007 |
| 7248481 | Circuit board and system with a multi-portion socket Circuit board and system with multi-portion sockets, and signal methods practiced thereon are described herein. ... | 07/24/2007 |
| 7223125 | Electrical connector with retaining shell An electrical connector (100) adapted for receiving a module body (4) comprises an insulative housing defining a cavity (10) for receiving the module body therein, a plurality of contacts (2) received in the insulative housing and a shiel... | 05/29/2007 |
| 7207845 | Multi-function electrical connector An electrical connector (100) includes a first housing piece (2), a second housing piece (3) interrelated with the first housing piece, and a number of contacts (4) assembled to the first and second housing pieces. The first housing piece... | 04/24/2007 |
| 7184276 | Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument A semiconductor device includes a plurality of semiconductor chips; and a plurality of substrates, each of the substrates having one of the semiconductor chips mounted thereon. The substrates are stacked each other. The upper and lower ones of the semiconductor chip... | 02/27/2007 |
| 7180165 | Stackable electronic assembly On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked arch... | 02/20/2007 |
| 7180763 | Power converter A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge ter... | 02/20/2007 |
| 7173803 | Low impedance inter-digital capacitor and method of using An inter-digital capacitor may be used in a power socket for a microelectronic device. In one embodiment an integrated, low-resistance power and ground terminal configuration is disclosed. The capacitor plates are alternatively coupled to the power and ground termin... | 02/06/2007 |
| 7165975 | Electrical connecting apparatus An electrical connecting apparatus is characterized by inserting a first pin having a flange portion into a through hole of an elastic body via a seat, by disposing a second pin in the through hole so as to adjoin in the axial direction of the through hole relative ... | 01/23/2007 |
| 7156705 | Electrical connector An electrical connector for use between two devices having conductive regions between which an electrical connection is to be formed, the electrical connection comprising, a housing including a passage therethrough, a conductive element of an elongate conductive mat... | 01/02/2007 |
| 7147514 | Connector providing capacitive coupling A connector provides capacitive coupling between circuit devices such as printed circuitboards and integrated circuits. The connector includes at least a first contact that contacts a conductor of the first circuit device, a second contact that contacts a conductor ... | 12/12/2006 |
| 7147487 | Power connector for a printed circuit A power connector for a printed circuit, the connector comprising: an insulating socket (14) provided with a bearing face (15) bearing on the printed circuit, and with a housing (16) associated with an opening ... | 12/12/2006 |
| 7128607 | Socket connector with reliable shielding member A socket connector adapted for receiving an electronic element therein includes an insulative housing defining an upper opening for receiving an electronic element therein, a plurality of terminals received in the housing, and a first and a second shell member for e... | 10/31/2006 |
| 7108559 | Router with field replaceable motherboard A router includes WIC and Network Module slots that be reconfigured to hold cards and network modules having different form factors. A motherboard/midplane arrangement provides for a field replaceable motherboard that can be replaced without removing the router from... | 09/19/2006 |
| 7088074 | System level device for battery and integrated circuit integration A system level device for battery and integrated circuit chip integration comprises at least one battery; at least one integrated circuit chip powered by the at least one battery; and a package connected to any of the at least one battery and the at least one integr... | 08/08/2006 |
| 7087442 | Process for the formation of a spatial chip arrangement and spatial chip arrangement Process for the formation of a spatial chip arrangement having several chips (32, 36, 37, 38, 39) arranged in several planes and electrically connected to one another, in which the chips are connected via their peripheral connection surfaces (33) to as... | 08/08/2006 |
