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| Number | Title | Issue Date |
| 7607921 | Switch for peripheral I/O devices A switch for switching a set of peripheral devices between two computers comprises at least one chip. The at least one chip has a selected signal pin, a group of invariable pins and two groups of variable pins. Each invariable pin corresponds to two variable pins. T... | 10/27/2009 |
| 7534109 | Control board and control apparatus A control board has a pattern for a low-voltage circuit including a ground pattern connectable to a ground and a pattern for a high-voltage circuit including a ground pattern. The patterns for the low-voltage and high-voltage circuits each have one or more ground-co... | 05/19/2009 |
| 7479013 | Printed board and manufacturing method thereof A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A method for manufacturing such a printed board with high efficiency is... | 01/20/2009 |
| 7473099 | Printed circuit board and manufacturing method thereof A printed circuit board and manufacturing method thereof are disclosed. A printed circuit board composed of an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to... | 01/06/2009 |
| 7445455 | Electronic device An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing ... | 11/04/2008 |
| 7419381 | Hybrid circuit board and display device having the same A hybrid circuit board includes a first circuit board and a second circuit boards. The first circuit board includes a first body having a slot, and a first circuit pattern formed on the first body and extended to the slot. The second circuit board includes a second ... | 09/02/2008 |
| 7407386 | Wired circuit board and production method thereof A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, and an insulating cover layer formed on the insulating base layer for covering the conductive pattern. The conductive pattern includes terminal portion... | 08/05/2008 |
| 7387515 | Printed circuit board connection An improved printed circuit board connection for connecting a first printed circuit board to a second printed circuit board in a manner that permits physical engagement at a different position than the electrical engagement, and a method for making the improved prin... | 06/17/2008 |
| 7385665 | Display device A display device includes a display panel which includes an effective display section, a flexible board which supplies a driving signal to the effective display section, a connection part at which the display panel and the flexible board are connected, and a plurali... | 06/10/2008 |
| 7377806 | Circuit board having at least one auxiliary scribed line A circuit board including a board body, at least one first connector, and at least one second connector is provided. The board body has an edge and at least one auxiliary scribed line. The auxiliary scribed line is substantially parallel to the edge. The first conne... | 05/27/2008 |
| 7379021 | Circuit board A circuit board includes an antenna substrate and a main substrate. The antenna substrate has at least one first linking portion. The main substrate has at least one second linking portion. The first linking portion connects with the second portion so that the anten... | 05/27/2008 |
| 7368806 | Flip chip package with anti-floating structure A flip chip package with an anti-floating structure includes a leadframe, a flip chip, and a plurality of solders. The leadframe includes a plurality of leads and a fastening part. At least one locking hole is formed on an upper surface of the fastening part. The fl... | 05/06/2008 |
| 7365964 | Modular power distribution unit, module for the power distribution unit, and method of using the same A modular power distribution unit (PDU) for supplying electric power to attached equipment in environments such as data centers, computer rooms, and communication centers, where power requirements for attached equipment may vary. The power distribution unit includes... | 04/29/2008 |
| 7366321 | System and method for performing automated optical inspection of objects A system and method for performing optical inspection are provided. At least one “invariant feature” of an object design is determined, and such invariant feature is used in inspecting objects having the corresponding design. An “invariant feature” is a feat... | 04/29/2008 |
| 7361994 | System to control signal line capacitance A system may include a conductive plane defining a non-conductive antipad area and a second non-conductive area extending from the antipad area in at least a first direction, a dielectric plane coupled to the conductive plane, a conductive via passing through the di... | 04/22/2008 |
| 7355431 | Test arrangement including anisotropic conductive film for testing power module A testing apparatus and method for testing a semiconductor device, and more particularly a test arrangement for measuring a guaranteed power loss of a semiconductor module, not requiring the module to have on-board decoupling capacitors for the power loss test. The ... | 04/08/2008 |
| 7338290 | Printed wiring board with a plurality of pads and a plurality of conductive layers offset from the pads A design rule for a printed wiring board is provided. A conductive layer and a pad are separate from each other in a distance defined by the design rule, which sufficiently prevents the capacitance coupling between the conductive layer and the pad. ... | 03/04/2008 |
| 7335043 | Electrical power contacts and connectors comprising same Preferred embodiments of power contacts include two or more opposing contact beams of a first type that are spaced apart along at least a portion of the length thereof when the power contact is in an unmated state; and two or more opposing contact beams of a second ... | 02/26/2008 |
| 7331800 | Shieldless, high-speed electrical connectors An electrical connector that includes first and second linear arrays of electrical contacts is disclosed. The first linear array includes a first differential signal pair, a first ground contact lead adjacent to the first differential signal pair, and a second groun... | 02/19/2008 |
| 7326061 | Via providing multiple electrically conductive paths A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plati... | 02/05/2008 |
| 7314377 | Electrical power connector A pair of mating connectors includes a receptacle having an insulative housing and at least one conductive receptacle contact with a pair of spaced walls forming a plug contact receiving space. The plug connector has an insulative housing and at least one conductive... | 01/01/2008 |
| 7309242 | Power connector A pair of mating connectors includes a receptacle having an insulative housing and at least one conductive receptacle contact with a pair of spaced walls forming a plug contact receiving space. The plug connector has an insulative housing and at least one conductive... | 12/18/2007 |
| 7306466 | Electrical printed circuit board The invention relates to an electrical printed circuit board serving for electrical contact-connection of an integrated circuit. The printed circuit board has a dielectric forming the printed circuit board material; at least one ground inner layer connected to groun... | 12/11/2007 |
| 7304390 | Anisotropic conductive sheet and manufacture thereof An anisotropic conductive sheet manufactured through improved manufacturing steps and a method of manufacturing the same. Conductive portions are unevenly arranged in a nonconductive elastomer having fluidity and serving as a matrix, the conductive portions highly d... | 12/04/2007 |
| 7302757 | Micro-bumps to enhance LGA interconnections An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button connection and increase the physical contact surface area between the conta... | 12/04/2007 |
| 7300214 | Optical module interfacing device and ethernet system using the same Disclosed are an optical module interfacing device for connecting an RJ interface and an SFP type optical module to an SFP type optical module connector without additional processing, and an Ethernet system using the optical module interfacing device, thus supportin... | 11/27/2007 |
| 7294914 | Interconnect structure An interconnect structure including a substrate, an interconnect device formed on the substrate, and a test device formed on the substrate. ... | 11/13/2007 |
| 7279771 | Wiring board mounting a capacitor In a capacitor-mounted wiring board, a plurality of wiring layers each patterned in a required shape are stacked with insulating layers interposed therebetween and are connected to each other via conductors formed to pierce the insulating layers in the direction of ... | 10/09/2007 |
| 7274851 | Fiber optic module Various embodiments of a fiber optic module adapted for use in an electronic assembly and system are provided. Multiple embodiments of a method of interfacing an electronic assembly with an external circuit through use of the fiber optic module are also provided. In... | 09/25/2007 |
| 7273379 | Hybrid circuit board and display device having the same A hybrid circuit board includes a first circuit board and a second circuit boards. The first circuit board includes a first body having a slot, and a first circuit pattern formed on the first body and extended to the slot. The second circuit board includes a second ... | 09/25/2007 |
| 7255586 | Connector device A connector device includes a plug including a plurality of plug terminals and a socket including a plurality of socket terminals. Ground plug terminals each have a recess on the contact surface, and ground socket terminals each have a dimple on the contact surface ... | 08/14/2007 |
| 7252537 | Electromagnetic coupler registration and mating A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler eleme... | 08/07/2007 |
| 7243410 | Method for manufacturing a probe card A method for manufacturing a probe card includes a first contact formation step of forming a first contact on a first surface of a first sacrificial substrate, a second contact formation step of forming a second contact on a first surface of a second sacrificial sub... | 07/17/2007 |
| 7242588 | Multifunction modular electronic apparatus A multifunction modular electronic apparatus for performing information technology and telecommunications functions comprises a first module (101) for performing a plurality of first functions; a second module (102) having substantially the same physic... | 07/10/2007 |
| 7232331 | Plug-in connector for a connector-ended cable An electrical connector (10) having a contact element (50) retained in a hollow body (12). The body (12) has an internal socket structure (44) for receiving an end of the contact element (50) so that insulation displacement ... | 06/19/2007 |
| 7232315 | Connection structure for printed wiring board A connection structure for a printed wiring board which enables high density integration is provided. A FCP 2 includes an exposed conductor part 2A including an insulating substrate 22 and a reinforcing plate 24 stacked with this substrat... | 06/19/2007 |
| 7229297 | Method and system for making and using an electrical connection between a conductor and a circuit board A method and system for connecting and using a circuit board connected to a conductive element is disclosed. The circuit board includes a backstop and a plurality of conductive traces positioned on an edge. The conductive element includes a plurality of conductive l... | 06/12/2007 |
| 7230506 | Crosstalk reduction for a system of differential line pairs A technique is presented for minimizing crosstalk between adjacent differential signal pairs in communications. A backplane embodiment wherein the backplane includes a plurality of differential signal line pairs, is presented. A first differential signal line pair c... | 06/12/2007 |
| 7227240 | Semiconductor device with wire bond inductor and method A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L... | 06/05/2007 |
| 7219242 | Direct plane access power delivery According to one embodiment of the present invention, a method for low impedance power delivery is disclosed. The method includes: providing a module, the module having a plurality of layers including a top layer; removing the top layer of the module to expose a pow... | 05/15/2007 |