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William F. Semple, a dentist, was awarded the first US Patent on chewing gum in 1869. His recipe contained powdered chalk.
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| Number | Title | Issue Date |
| 7342765 | Current insulation device for fuel systems An electrical insulating device for a linear component forming part of a fuel system subjected to risks of possible external electrical discharges formed by a part (13) made of insulating material attached to two metal flanges (15, 17) that allow inser... | 03/11/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7264991 | Method of connecting a conductive trace to a semiconductor chip using conductive adhesive A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanical... | 09/04/2007 |
| 7262082 | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 08/28/2007 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7190080 | Semiconductor chip assembly with embedded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line... | 03/13/2007 |
| 7150642 | Irrigation control system An irrigation control system having a master control, a plurality of electrical components and at least two coupling devices for connecting one of the electrical components to the master control. The coupling device has a male connector housing and a female connecto... | 12/19/2006 |
| 7134889 | Separable insulated connector and method A separable insulated connector provides a current path for high-energy distribution between a power transmission or power distribution apparatus and an elbow connector. As gases and conductive particles exit the separable insulated connector during loadbreak switch... | 11/14/2006 |
| 7132741 | Semiconductor chip assembly with carved bumped terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint that electrically connects the routing line and the pad, and an enca... | 11/07/2006 |
| 7129113 | Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 10/31/2006 |
| 7129575 | Semiconductor chip assembly with bumped metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an enca... | 10/31/2006 |
| 7112521 | Method of making a semiconductor chip assembly with a bumped metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a bumped terminal, then mechanically attaching a semiconductor chip to the metal base, the routing line and the bumped terminal, then forming an encapsulant, and the... | 09/26/2006 |
| 7094676 | Semiconductor chip assembly with embedded metal pillar A method of making a semiconductor chip assembly includes forming a routing line on a metal base, etching the metal base wherein an unetched portion of the metal base forms a pillar, mechanically attaching a semiconductor chip to the routing line and the pillar wher... | 08/22/2006 |
| 7075186 | Semiconductor chip assembly with interlocked contact terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and a contact terminal, a connection joint that electrically connects the routing line and the pad, and an enc... | 07/11/2006 |
| 7071089 | Method of making a semiconductor chip assembly with a carved bumped terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a metal filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the metal filler, th... | 07/04/2006 |
| 7071573 | Semiconductor chip assembly with welded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 07/04/2006 |
| 7067911 | Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies. The first semiconductor chip assembly includes a first chip, a first conductive trace and a first encapsulant, and the first conductive trace includes a first ... | 06/27/2006 |
| 7015128 | Method of making a semiconductor chip assembly with an embedded metal particle A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip that includes a conductive pad to a routing line, mechanically attaching and electrically connecting a metal particle to the routing line, wherein the routing line ... | 03/21/2006 |
| 7009297 | Semiconductor chip assembly with embedded metal particle A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal particle, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The rout... | 03/07/2006 |
| 6949408 | Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps A method of making a semiconductor chip assembly includes providing a semiconductor chip, a metal base, an insulative base and a conductive trace, wherein the chip includes a conductive pad, the metal base is disposed on a side of the insulative base that faces away... | 09/27/2005 |
| 6908788 | Method of connecting a conductive trace to a semiconductor chip using a metal base A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a metal base, wherein the chip includes a conductive pad, and the conductive trace is disposed between the metal base and the chip, then... | 06/21/2005 |
| 5114357 | High voltage elbow A connector for connecting a high voltage electrical cable to a high voltage electrical terminal. A generally L-shaped elbow housing of a resilient insulating material with a central bore therethrough provides a cable receiving leg and a terminal receivin... | 05/19/1992 |
| 4891016 | 600-Amp hot stick-operable pin-and-socket assembled connector system An apparatus bushing is fixed to a support wall or the wall of the apparatus housing and is electrically coupled to the apparatus within. A high voltage cable is fixed to the single leg of a 600-Amp "T" connector and is supported only by a bracket extendi... | 01/02/1990 |
| 4799895 | 600-Amp hot stick operable screw-assembled connector system A high-voltage cable is fixed to the single leg of a 600-amp "T" connector, which in turn is coupled for non-removable engagement with an insulating bushing fixed to a wall of the apparatus housing it is to serve. A removable screw-applied link member sel... | 01/24/1989 |
| 4113339 | Load break bushing An electrical load break bushing having a movable tubular conductor therein, engageable with a contact pin of an electrical connector, is arranged to minimize the duration of arc during load-make and load-break operations. A locking member holds the tubul... | 09/12/1978 |
| 4029380 | Grounded surface distribution apparatus A grounded surface distribution apparatus and system is provided including elastomer encapsulated cable terminals, joints, taps, load-break switches, current limiting fuses and surge protectors, each enclosed completely within a metal sheath combined in v... | 06/14/1977 |
| 3957332 | Electric connector apparatus and method An electric terminal bushing having a hollow tubular contact engageable with the contact pin of an electric elbow type connector is arranged so as substantially to reduce the arcing time during a switch closing operation and includes means for slidably mo... | 05/18/1976 |
| 3945699 | Electric connector apparatus and method An electric terminal bushing having a hollow tubular contact engageable with the contact pin of an electric elbow type connector is arranged so as substantially to reduce the arcing time during a switch closing operation and includes means for slidably mo... | 03/23/1976 |
