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Class 438 - Semiconductor device manufacturing: process

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884 Subclasses


Subclasses list

Definition

A. This class provides for manufacturing a semiconductor containing a solid-state device by a combination of operations wherein:

(1) no other class provides for the overall combination, and

(2) the intent is to use the electrical properties of the semiconductor in the device for at least one of the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy.

B. This class provides for a species of Class 427 operations involving:

(1) coating a substrate with a semiconductive material, or

(2) coating a semiconductive substrate or substrate containing a semiconductive region;

wherein the intent is to use the electrical properties of the semiconductor in a solid-state device for at least one of the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy.

C. This class provides for a species of Class 216 operations involving etching a semiconductive substrate or etching a substrate containing a semiconductive region, wherein the intent is to use the electrical properties of the semiconductor in a solid-state device for at least one of the following purposes:

(1) conducting or modifying an electrical current,

(2) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or

(3) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy.

D. This class provides for packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor, when not elsewhere provided, wherein there are:

(1) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor, or support (e.g., mounting, housing, lead frame, discrete heat sink, etc.),

(2) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or

(3) a step of treating an already packaged semiconductor substrate (e.g., coating, etching, etc.); if the following conditions are also met: (a) there is significant semiconductor chip structure (e.g., such as recited semiconductor junction, etc.) or named semiconductor device (e.g., DRAM, CMOS, EPROM, etc.), or (b) there is no significant semiconductor structure if also combined with a coating operation of this class (see B above) or etching operation of this class (see C above), and (c) the intent is to use the electrical properties of the semiconductor in a solid-state device for at least one of the following purposes: (i) conducting or modifying an electrical current, (ii) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (iii) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy;

(1) Note. When Class 438 coating (see B above) or etching operations (see C above) are not included, Class 29, following historical precedence, provides for processes of mounting, packaging, molding, or encapsulating of semiconductors having no significant semiconductor chip structure (e.g., merely recited as semiconductor chip, per se, etc.) when not elsewhere provided. E. This is the generic class for operations not elsewhere provided for treating a semiconductive substrate or substrate containing a semiconductive region; wherein the intent is to use the semiconductor in a solid-state device for at least one of the following purposes: (1) conducting or modifying an electrical current, (2) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (3) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy. (1) Note. Lacking an indication that the semiconducting material is to be used for a purpose other than (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy; it will be assumed that the process meets the Class 438 definition. (2) Note. For this class certain materials will be considered to be semiconductors even if there is no other indication that semiconducting properties are present. Thus, if the criteria set forth under the (1) Note is met that there is no indication that the material is to be used for a purpose other than (a), (b), or (c), the following materials are to be considered semiconductive: silicon, germanium, selenium, tellurium, gallium nitride, gallium phosphide, gallium arsenide, aluminum phosphide, aluminum arsenide, and mercury cadmium telluride.

Lines with other classes and within this class

Several classes provide for plural step operations for manufacturing semiconductor solid-state devices or components therefor. Combined operations for manufacturing semiconductor electrical devices or semiconductor-based components therefor having plural steps not encompassed by another class are proper for Class 438.

For example, while plural steps acceptable to Class 264 (e.g., injection molding and subsequent removal of flash, etc.) remain in Class 264, combinations of molding and adhesive bonding are provided for in Class 156, even though this involves multiple steps, one of which (i.e., molding) would be considered a Class 264 unit operation even if semiconductor material is involved. However, combinations of molding, adhesive bonding, and a Class 438 unit operation acting on a semiconductor substrate which is used for at least one of the following purposes: (a) conducting or modifying an electrical current, (b) storing electrical energy for subsequent discharge within a microelectronic integrated circuit, or (c) converting electromagnetic wave energy to electrical energy or electrical energy to electromagnetic energy, are considered proper for Class 438.

A. UNIT COATING OPERATIONS, COMBINED OPERATIONS INVOLVING COATING, AND PARTICLE BOMBARDMENT

The following search notes are intended to clarify the lines and distinctions for determining when coating operations are provided for in Class 438. Throughout this class, the term "coating" is used in the generic sense to include both surface coating and impregnation.

The unit coating operations in Class 438 may be viewed as a specie of a Class 427 process which was removed intact from Class 427 and transferred to Class 438 for the convenience of the searcher. Thus, plural step operations that were acceptable in Class 427 are now acceptable in Class 438 if the criteria for the semiconductor material as set forth hereinabove is met. Coating operations which do not meet the Class 438 definition may be classified in the classes identified in References to Other Classes, below.

B. UNIT ETCHING OPERATIONS AND COMBINED ETCHING OPERATIONS IN CLASS 438

In References to Other Classes, below, are search notes are intended to clarify the lines and distinctions for determining when an etching unit operation is provided for in Class 438. Throughout this class, the term "etching" is used in the generic sense to include the removal of a surface by chemical reaction or solvent action regardless of the composition thereof.

The unit etching operations in Class 438 may be viewed as a specie of a Class 216 process which was removed intact from Class 216 and transferred to Class 438 for the convenience of the searcher. Thus, plural step operations that were acceptable in Class 216 are now acceptable in Class 438 if the criteria for the semiconductor material as set forth hereinabove is met. Etching operations which do not meet the Class 438 definition may be found in References with Other Classes, below.

C. PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR

Packaging is a semiconductor art manufacturing term for integration, assembly, or surrounding of a semiconductive substrate (e.g., chip, die, etc.) with a permanent encasement, housing, capsule, or support. This is distinguished from package making found in Class 53 which is directed to preparing a manufactured product for passage through the channels of trade in a safe, convenient, and attractive condition, usually wrapped in a cover or in a container which is intended to be removed when the manufactured product is used.

Class 438 takes the following packaging or packaging related operations, if not elsewhere provided: (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor, or support (e.g., mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already packaged semiconductor substrate (e.g., coating, etching, etc.).

However, other manufacturing classes have established historic lines with Class 438 that must be considered when determining proper placement. These lines with external classes revolve around such concepts as: whether there is significant semiconductor device structure, whether there is a unit operation or a so-called "multi-step" operation, etc. The search notes in References to Other Classes, below, are intended to clarify these established lines and to alert the searcher to other classes for related searches.

D. LINE NOTES TO OTHER MANUFACTURING OPERATIONS

See References to Other Classes, below for lines clarifying the relationship of other chemical classes to Class 438. For many of the chemical classes, inclusion of metal casting, working or deforming, or fusion bonding step is not acceptable if combined with an operation of the chemical class.

E. LOCATION OF SEMICONDUCTOR COMPOUND, COMPOSITION, OR STOCK

Class 438 does not provide for compound, composition, or stock material produced or utilized by a Class 438 process. A process of manufacture or use of a compound or composition is usually classified with the compound or composition. The process of manufacturing a semiconductor compound or composition and the formation of a semiconductor device or semiconductor junction takes combined operations to Class 438.

Also see References to Other Classes, below, identifying this section.

F. LINE TO HEATING CLASSES

This class (438), will take the process of (a) heating of semiconductor material to modify the microstructure or electrical properties thereof, (b) combined operations involving heating of semiconductor material to modify the semiconductor structure or electrical properties when not provided in another class, or (c) heating of semiconductor substrates that affects only the nonsemiconductor region of the substrate when combined with other operations acceptable to Class 438 or combined with the establishment of device structure (e.g., connects, insulating regions, electrodes, etc.).

See References to Other Classes, below, identified as heating classes.

G. LINE NOTES TO ELECTRICAL CLASSES

See References to Other Classes, below.
 
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