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Definition
A. This class provides for manufacturing a semiconductor containing
a solid-state device by a combination of operations wherein: (1) no other class provides for the overall combination, and (2) the intent is to use the electrical properties of the semiconductor
in the device for at least one of the following purposes: (a) conducting
or modifying an electrical current, (b) storing electrical energy
for subsequent discharge within a microelectronic integrated circuit,
or (c) converting electromagnetic wave energy to electrical energy
or electrical energy to electromagnetic energy. B. This class provides for a species of Class 427 operations
involving: (1) coating a substrate with a semiconductive material, or (2) coating a semiconductive substrate or substrate containing
a semiconductive region; wherein the intent is to use the electrical properties of the
semiconductor in a solid-state device for at least one of the following
purposes: (a) conducting or modifying an electrical current, (b)
storing electrical energy for subsequent discharge within a microelectronic
integrated circuit, or (c) converting electromagnetic wave energy
to electrical energy or electrical energy to electromagnetic energy. C. This class provides for a species of Class 216 operations
involving etching a semiconductive substrate or etching a substrate
containing a semiconductive region, wherein the intent is to use
the electrical properties of the semiconductor in a solid-state
device for at least one of the following purposes: (1) conducting or modifying an electrical current, (2) storing electrical energy for subsequent discharge within
a microelectronic integrated circuit, or (3) converting electromagnetic wave energy to electrical energy
or electrical energy to electromagnetic energy. D. This class provides for packaging (e.g., with mounting,
encapsulating, etc.) or treatment of packaged semiconductor, when not elsewhere provided, wherein there are: (1) multiple operations having a step of permanently attaching
or securing a semiconductive substrate to a terminal, elongated
conductor, or support (e.g., mounting, housing, lead frame, discrete
heat sink, etc.), (2) multiple operations having a step of shaping flowable
plastic or flowable insulative material about a semiconductive substrate,
or (3) a step of treating an already packaged semiconductor substrate
(e.g., coating, etching, etc.); if the following conditions are
also met: (a) there is significant semiconductor
chip structure (e.g., such as recited semiconductor junction, etc.)
or named semiconductor device (e.g., DRAM, CMOS, EPROM, etc.), or
(b) there is no significant semiconductor structure if also combined
with a coating operation of this class (see B above) or etching operation
of this class (see C above), and (c) the intent is to use the electrical
properties of the semiconductor in a solid-state device for at least
one of the following purposes: (i) conducting or modifying an electrical
current, (ii) storing electrical energy for subsequent discharge within
a microelectronic integrated circuit, or (iii) converting electromagnetic
wave energy to electrical energy or electrical energy to electromagnetic
energy; (1)
Note. When Class 438 coating (see B above) or etching operations
(see C above) are not included,
Class 29, following historical precedence, provides for processes
of mounting, packaging, molding, or encapsulating of semiconductors
having no significant semiconductor chip structure (e.g., merely
recited as semiconductor chip, per se, etc.) when not elsewhere
provided.
E. This is the generic class for operations not elsewhere
provided for treating a semiconductive substrate or substrate containing a
semiconductive region; wherein the intent is to use the semiconductor
in a solid-state device for at least one of the following purposes:
(1) conducting or modifying an electrical current,
(2) storing electrical energy for subsequent discharge within
a microelectronic integrated circuit, or
(3) converting electromagnetic wave energy to electrical energy
or electrical energy to electromagnetic energy.
(1)
Note. Lacking an indication that the semiconducting material
is to be used for a purpose other than (a) conducting or modifying
an electrical current, (b) storing electrical energy for subsequent
discharge within a microelectronic integrated circuit, or (c) converting
electromagnetic wave energy to electrical energy or electrical energy
to electromagnetic energy; it will be assumed that the process meets
the Class 438 definition.
(2)
Note. For this class certain materials will be considered
to be semiconductors even if there is no other indication that semiconducting
properties are present. Thus, if the criteria set forth under the
(1) Note is met that there is no indication that the material is
to be used for a purpose other than (a), (b), or (c), the following
materials are to be considered semiconductive: silicon, germanium,
selenium, tellurium, gallium nitride, gallium phosphide, gallium
arsenide, aluminum phosphide, aluminum arsenide, and mercury cadmium
telluride.
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Lines with other classes and within this class
Several classes provide for plural step operations for manufacturing
semiconductor solid-state devices or components therefor. Combined
operations for manufacturing semiconductor electrical devices or
semiconductor-based components therefor having plural steps not encompassed by another class are proper
for Class 438. For example, while plural steps acceptable to Class 264 (e.g.,
injection molding and subsequent removal of flash, etc.) remain
in Class 264, combinations of molding and adhesive bonding are provided
for in Class 156, even though this involves multiple steps, one
of which (i.e., molding) would be considered a Class 264 unit operation
even if semiconductor material is involved. However, combinations
of molding, adhesive bonding, and a Class 438 unit operation acting
on a semiconductor substrate which is used for at least one of the
following purposes: (a) conducting or modifying an electrical current,
(b) storing electrical energy for subsequent discharge within a
microelectronic integrated circuit, or (c) converting electromagnetic
wave energy to electrical energy or electrical energy to electromagnetic
energy, are considered proper for Class 438. A. UNIT COATING OPERATIONS, COMBINED OPERATIONS INVOLVING
COATING, AND PARTICLE BOMBARDMENT The following search notes are intended to clarify the lines
and distinctions for determining when coating operations are provided
for in Class 438. Throughout this class, the term "coating" is
used in the generic sense to include both surface coating and impregnation. The unit coating operations in Class 438 may be viewed as
a specie of a Class 427 process which was removed intact from Class
427 and transferred to Class 438 for the convenience of the searcher.
Thus, plural step operations that were acceptable in Class 427 are
now acceptable in Class 438 if the criteria for the semiconductor material
as set forth hereinabove is met. Coating operations which do not
meet the Class 438 definition may be classified in the classes identified
in References to Other Classes, below. B. UNIT ETCHING OPERATIONS AND COMBINED ETCHING OPERATIONS
IN CLASS 438 In References to Other Classes, below, are search notes are
intended to clarify the lines and distinctions for determining when
an etching unit operation is provided for in Class 438. Throughout
this class, the term "etching" is used in the
generic sense to include the removal of a surface by chemical reaction
or solvent action regardless of the composition thereof. The unit etching operations in Class 438 may be viewed as
a specie of a Class 216 process which was removed intact from Class
216 and transferred to Class 438 for the convenience of the searcher.
Thus, plural step operations that were acceptable in Class 216 are
now acceptable in Class 438 if the criteria for the semiconductor material
as set forth hereinabove is met. Etching operations which do not
meet the Class 438 definition may be found in References with Other
Classes, below. C. PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR
TREATMENT OF PACKAGED SEMICONDUCTOR Packaging is a semiconductor art manufacturing term for integration,
assembly, or surrounding of a semiconductive substrate (e.g., chip,
die, etc.) with a permanent encasement, housing, capsule, or support.
This is distinguished from package making found in Class 53 which is
directed to preparing a manufactured product for passage through
the channels of trade in a safe, convenient, and attractive condition,
usually wrapped in a cover or in a container which is intended to
be removed when the manufactured product is used. Class 438 takes the following packaging or packaging related
operations, if not elsewhere provided: (a) multiple operations having
a step of permanently attaching or securing a semiconductive substrate
to a terminal, elongated conductor, or support (e.g., mounting,
housing, lead frame, discrete heat sink, etc.), (b) multiple operations
having a step of shaping flowable plastic or flowable insulative
material about a semiconductive substrate, or (c) a step of treating
an already packaged semiconductor substrate (e.g., coating, etching,
etc.). However, other manufacturing classes have established historic
lines with Class 438 that must be considered when determining proper
placement. These lines with external classes revolve around such
concepts as: whether there is significant semiconductor device
structure, whether there is a unit operation or a so-called "multi-step" operation,
etc. The search notes in References to Other Classes, below, are
intended to clarify these established lines and to alert the searcher
to other classes for related searches. D. LINE NOTES TO OTHER MANUFACTURING OPERATIONS See References to Other Classes, below for lines clarifying
the relationship of other chemical classes to Class 438. For many
of the chemical classes, inclusion of metal casting, working or
deforming, or fusion bonding step is not acceptable
if combined with an operation of the chemical class. E. LOCATION OF SEMICONDUCTOR COMPOUND, COMPOSITION, OR STOCK Class 438 does not provide for compound, composition, or stock
material produced or utilized by a Class 438 process. A process
of manufacture or use of a compound or composition is usually classified
with the compound or composition. The process of manufacturing a
semiconductor compound or composition and the formation of a semiconductor
device or semiconductor junction takes combined operations to Class
438. Also see References to Other Classes, below, identifying this
section. F. LINE TO HEATING CLASSES This class (438), will take the process of (a) heating of semiconductor
material to modify the microstructure or electrical properties thereof,
(b) combined operations involving heating of semiconductor material
to modify the semiconductor structure or electrical properties when not provided in another class, or (c)
heating of semiconductor substrates that affects only the nonsemiconductor
region of the substrate when combined with other operations acceptable
to Class 438 or combined with the establishment of device structure
(e.g., connects, insulating regions, electrodes, etc.). See References to Other Classes, below, identified as heating
classes. G. LINE NOTES TO ELECTRICAL CLASSES See References to Other Classes, below. |
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