Bizarre Patents
Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8114685 | Method of manufacturing material to be etched A method is provided, of manufacturing a material to be etched that can more preferably prevent a region to be etched from remaining as an un-etched region and reduce deviation of etched/un-etched regions. Patterning (a method of manufacturing a material to be etche... | 02/14/2012 |
| 8105851 | Nitride film wet stripping Provided is a method of removing a nitride material from a semiconductor wafer. The method includes monitoring a silicon concentration level in a chemical solution. The chemical solution may include a phosphoric acid. The method includes adjusting the silicon concen... | 01/31/2012 |
| 7993936 | System and method for controlling an electrochemical etch process By evaluating a status signal on the basis of a fault detection classification mechanism in an electrochemical etch tool, a corresponding failure status of the tool may be obtained for each single substrate, thereby significantly reducing the risk of significant yie... | 08/09/2011 |
| 7972873 | Material removing processes in device formation and the devices formed thereby Devices having voids are producible by employing an electrochemical corrosion process. For example, an electrically conductive region is formed to have a surrounding chemically distinct region. Such formation is possible through conventional semiconductor processing... | 07/05/2011 |
| 7897416 | Composition control for photovoltaic thin film manufacturing The present invention relates to methods and apparatus for providing composition control to thin compound semiconductor films for radiation detector and photovoltaic applications. In one aspect of the invention, there is provided a method in which the molar ratio of... | 03/01/2011 |
| 7892860 | Semiconductor laser chip and method of formation thereof A method for forming a semiconductor laser chip is provided that can suppress layer discontinuity and simultaneously reduce fabrication variations in the light radiation angle in the horizontal direction. The method includes a step of forming, on an n-type GaAs subs... | 02/22/2011 |
| 7871829 | Metal wiring of semiconductor device and method of fabricating the same A metal wiring forming method in a semiconductor device can include forming an interlayer insulating film on a lower metal wiring, the first interlayer insulating film having a non-planar upper surface; forming a stop layer on the interlayer insulating film and over... | 01/18/2011 |
| 7736914 | Plasma control using dual cathode frequency mixing and controlling the level of polymer formation Methods for processing a substrate in a processing chamber using dual RF frequencies are provided herein. In some embodiments, a method of processing a substrate includes forming a plasma of a polymer forming chemistry to etch a feature into a substrate disposed on ... | 06/15/2010 |
| 7709277 | PAA-based etchant, methods of using same, and resultant structures A wet-etch composition may include: peracetic acid (PAA); and a fluorinated acid; a relative amount of the PAA in the composition being sufficient to ensure an etch rate of (P-doped-SiGe):(P-doped-Si) that is substantially the same as an etch rate of (N-doped-SiGe):... | 05/04/2010 |
| 7700377 | Method for reducing etch-induced process uniformities by omitting deposition of an endpoint detection layer during patterning of stressed overlayers in a semiconductor device During the patterning of respective contact etch stop layers having a different type of intrinsic stress, the deposition of an etch indicator layer between the first and the second contact etch stop layer may be omitted in order to avoid any undue effects of this la... | 04/20/2010 |
| 7632689 | Methods for controlling the profile of a trench of a semiconductor structure Methods for controlling the profile of a trench of a semiconductor structure comprise the step of depositing a photoresist within a via and overlying a second dielectric layer. An image layer is deposited overlying the photoresist and is patterned to form a first tr... | 12/15/2009 |
| 7618831 | Method of monitoring the manufacture of interferometric modulators Process control monitors are disclosed that are produced using at least some of the same process steps used to manufacture a MEMS device. Analysis of the process control monitors can provide information regarding properties of the MEMS device and components or sub-c... | 11/17/2009 |
| 7439068 | Plasma monitoring method, plasma processing method, method of manufacturing semiconductor device, and plasma processing system Disclosed is a plasma monitoring method for detecting the amount of atomic radicals generated by dissociation of a molecular raw material gas during a plasma processing conducted by introducing the molecular raw material gas and a rare gas into a process atmosphere,... | 10/21/2008 |
| 7438392 | Microfluidic substrates having improved fluidic channels A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface ... | 10/21/2008 |
| 7402510 | Etchant and method for forming bumps A method for forming bumps is disclosed. First, a substrate having an adhesive, a barrier, and a wetting layer thereon is provided. Next, a patterned photoresist is formed on the wetting layer, in which the patterned photoresist includes at least one opening for exp... | 07/22/2008 |
| 7399711 | Method for controlling a recess etch process A method of controlling a recess etch process for a multilayered substrate having a trench therein and a column of material deposited in the trench includes determining a first dimension from a surface of the substrate to a reference point in the substrate by obtain... | 07/15/2008 |
| 7393700 | Low temperature methods of etching semiconductor substrates Methods of etching a semiconductor substrate may include providing a first gas that is chemically reactive with respect to the semiconductor substrate, and while providing the first gas, providing a second gas different than the first gas. More particularly, a molec... | 07/01/2008 |
| 7387455 | Substrate processing device, substrate processing method, and developing device Rinsing nozzles 310a to 310e are moved on a wafer W while they are discharging rinsing solution 326. At that point, discharging openings 317a to 317e are contacted to developing solution 350 coate... | 06/17/2008 |
| 7368397 | Method for monitoring edge bead removal process of copper metal interconnection Disclosed is a method for monitoring an edge bead removal process for a copper metal interconnection. The method includes the steps of (a) forming a copper metal layer on a semiconductor wafer, (b) performing the edge bead removal (EBR) process of removing the coppe... | 05/06/2008 |
| 7354332 | Technique for process-qualifying a semiconductor manufacturing tool using metrology data A technique of the present invention utilizes qualification characteristics from a single wafer for qualifying a semiconductor manufacturing tool. Generally speaking, the technique commences with the processing of a wafer by the manufacturing tool. During processing... | 04/08/2008 |
| 7355711 | Method for detecting an end-point for polishing a material An optical surface analysis system for scanning the surface of a (silicon) wafer and detect if any residual material is still on the wafer surface in order to determine an appropriate end-point in a polishing process. An Optical Surface Analyzer (OSA), of the presen... | 04/08/2008 |
| 7353379 | Methods for configuring a plasma cluster tool A method for configuring a plasma cluster tool is disclosed. The method includes generating a key file from option specifications, the key file encapsulating configuration restrictions specifically imposed on the plasma cluster tool. The method also includes generat... | 04/01/2008 |
| 7340318 | Method and apparatus for assessing controller performance A method includes providing a process controller for controlling a process tool. The process tool is controlled in accordance with a process parameter. Measurements associated with the processing parameter for a plurality of runs of the process tool are accessed. A ... | 03/04/2008 |
| 7333876 | Systems and methods for providing electronic quality control in a process for applying a polyurethane to a substrate The present invention comprises systems and methods for providing electronic quality control in a process for applying a polyurethane to a substrate. One aspect of the present invention includes a computer-implemented method for providing electronic quality control ... | 02/19/2008 |
| 7319530 | System and method for measuring germanium concentration for manufacturing control of BiCMOS films A system and method is disclosed for measuring a germanium concentration in a semiconductor wafer for manufacturing control of BiCMOS films. Germanium is deposited over a silicon substrate layer to form a silicon germanium film. Then a rapid thermal oxidation (RTO) ... | 01/15/2008 |
| 7314766 | Semiconductor wafer treatment method, semiconductor wafer inspection method, semiconductor device development method and semiconductor wafer treatment apparatus A treatment method of a semiconductor wafer includes treating the semiconductor wafer in a first solution having at least one kind of an oxidative acid and an oxidizing agent and treating the semiconductor wafer in a second solution having at least one of HF and NH | 01/01/2008 |
| 7313454 | Method and apparatus for classifying manufacturing outputs A method for process monitoring involves acquiring data samples associated with a plurality of manufacturing related variables for a plurality of outputs of a manufacturing process. The distance of each data sample relative to every other data sample is then calcula... | 12/25/2007 |
| 7312161 | Advanced process control for low variation treatment in immersion processing The variability of immersion processes for treatment of semiconductor devices can be significantly lowered by initiating the termination of a treatment process according to a predetermined treatment termination protocol in a manner that takes into account the contri... | 12/25/2007 |
| 7305320 | Metrology tool recipe validator using best known methods A method of preparing recipes for operating a metrology tool, each recipe including a set of instructions for measuring dimensions in a microelectronic feature. A database includes a plurality of known instructions with best known methods for measuring different fea... | 12/04/2007 |
| 7296103 | Method and system for dynamically selecting wafer lots for metrology processing The present invention is generally directed to various methods and systems for dynamically controlling metrology work in progress. In one illustrative embodiment, the method comprises providing a metrology control unit that is adapted to control metrology work flow ... | 11/13/2007 |
| 7294535 | Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same There is provided a technique to form a single crystal semiconductor thin film or a substantially single crystal semiconductor thin film. A heat treatment is carried out for an amorphous semiconductor thin film, to thereby obtain a crystalline semiconductor thin fil... | 11/13/2007 |
| 7291538 | Semiconductor memory device and manufacturing method of the same In this semiconductor memory device, a potential clamping region having no insulation layer formed therein is provided in an insulation layer. More specifically, the potential clamping region is formed under a body portion at a position near a first impurity region,... | 11/06/2007 |
| 7292906 | Formula-based run-to-run control A processing method of processing a substrate is presented that includes: receiving pre-process data, wherein the pre-process data comprises a desired process result and actual measured data for the substrate; determining a required process result, wherein the requi... | 11/06/2007 |
| 7285781 | Characterizing resist line shrinkage due to CD-SEM inspection A CD-SEM (critical dimension-scanning electron microscope) system may utilize a technique for characterizing and reducing shrinkage carryover due to CD-SEM measurements. The system may identify the affects of CD-SEM measurements on the resist and adjust the operatin... | 10/23/2007 |
| 7282448 | Substrate and method of forming substrate for fluid ejection device A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced etch stops in the first side of the substrate, etching into the substrate from the second side toward the first side to the space... | 10/16/2007 |
| 7284230 | System for search and analysis of systematic defects in integrated circuits Disclosed is a method of locating systematic defects in integrated circuits. Extracting and index processing of a circuit design and feature searching are performed. During extracting and index processing, a window grid for the circuit design is established and basi... | 10/16/2007 |
| 7271106 | Critical dimension control for integrated circuits Methods of etching substrates with small critical dimensions and altering the critical dimensions are disclosed. In one embodiment, a sulfur oxide based plasma is used to etch an amorphous carbon hard mask layer. The features of a pattern can be shrunk using a plasm... | 09/18/2007 |
| 7262865 | Method and apparatus for controlling a calibration cycle or a metrology tool A method and apparatus for controlling when a calibration cycle is started for a metrology tool. The method and apparatus exploits a correlation between a drift of a first parameter (e.g., film thickness measurement drift) and a drift of a second parameter (e.g., CD... | 08/28/2007 |
| 7258838 | Solid state molecular probe device A solid state nanopore device including two or more materials and a method for fabricating the same. The device includes a solid state insulating membrane having an exposed surface, a conductive material disposed on at least a portion of the exposed surface of the s... | 08/21/2007 |
| 7257502 | Determining metrology sampling decisions based on fabrication simulation A method for determining metrology sampling rates for workpieces in a process flow includes determining a current status of the process flow. Future processing of the workpieces in the process flow is simulated based on the current status of the process flow over a ... | 08/14/2007 |
