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| Number | Title | Issue Date |
| 8173552 | Method of fabricating an identification mark utilizing a liquid film assisted by a laser Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a liquid on a region of a die, and then forming an identification mark through the liquid on the die. ... | 05/08/2012 |
| 8168545 | Solar cell fabrication using extruded dopant-bearing materials Wafer-based solar cells are efficiently produced by extruding a dopant bearing material (dopant ink) onto one or more predetermined surface areas of a semiconductor wafer, and then thermally treating the wafer to cause diffusion of dopant from the dopant ink into th... | 05/01/2012 |
| 7985694 | Method for forming pattern, method for manufacturing semiconductor device and semiconductor device A method for forming a pattern includes the step of forming an electrically conductive film by applying a liquid composition onto a first plate. The liquid composition includes an organic solvent and conductive particles surface-modified with a fatty acid or an alip... | 07/26/2011 |
| 7928015 | Solar cell fabrication using extruded dopant-bearing materials Wafer-based solar cells are efficiently produced by extruding a dopant bearing material (dopant ink) onto one or more predetermined surface areas of a semiconductor wafer, and then thermally treating the wafer to cause diffusion of dopant from the dopant ink into th... | 04/19/2011 |
| 7871937 | Process and apparatus for treating wafers Methods and systems are provided for low pressure baking to remove impurities from a semiconductor surface prior to deposition. Advantageously, the short, low temperature processes consume only a small portion of the thermal budget, while still proving effective at ... | 01/18/2011 |
| 7638438 | Solar cell fabrication using extrusion mask Large-area ICs (e.g., silicon wafer-based solar cells) are produced by positioning a mask between an extrusion head and the IC wafer during extrusion of a dopant bearing material or metal gridline material. The mask includes first and second peripheral portions that... | 12/29/2009 |
| 7611996 | Multi-stage curing of low K nano-porous films Embodiments in accordance with the present invention relate to multi-stage curing processes for chemical vapor deposited low K materials. In certain embodiments, a combination of electron beam irradiation and thermal exposure steps may be employed to control selecti... | 11/03/2009 |
| 7569493 | Nitride-based compound semiconductor, method of cleaning a compound semiconductor, method of producing the same, and substrate There is provided a cleaning method and production method that suppresses the adhesion of foreign matters including impurity, fine particles and the like on a surface of a compound semiconductor. A method of cleaning a nitride-based compound semiconductor in accorda... | 08/04/2009 |
| 7435683 | Apparatus and method for selectively recessing spacers on multi-gate devices Embodiments of an apparatus and methods for fabricating a spacer on one part of a multi-gate transistor without forming a spacer on another part of the multi-gate transistor are generally described herein. Other embodiments may be described and claimed. ... | 10/14/2008 |
| 7432120 | Method for realizing a hosting structure of nanometric elements Method for manufacturing a hosting structure of nanometric elements comprising the steps of depositing on an upper surface of a substrate, of a first material, a block-seed having at least one side wall. Depositing on at least one portion of sad surface and on the b... | 10/07/2008 |
| 7410901 | Submicron device fabrication A method for fabricating substrate material to include trenches and unreleased beams with submicron dimensions includes etching a first oxide layer on the substrate to define a first set of voids in the first oxide layer to expose the substrate. A second oxide layer... | 08/12/2008 |
| 7407893 | Liquid precursors for the CVD deposition of amorphous carbon films Methods are provided for depositing amorphous carbon materials. In one aspect, the invention provides a method for processing a substrate including positioning the substrate in a processing chamber, introducing a processing gas into the processing chamber, wherein t... | 08/05/2008 |
| 7387971 | Fabricating method for flat panel display device A fabricating method for a flat panel display device having a thin film pattern over a substrate is disclosed. The fabricating method includes depositing a hydrophilic resin over a substrate and patterning the hydrophilic resin to form hydrophilic resin patterns ove... | 06/17/2008 |
| 7384816 | Apparatus and method for forming vias An apparatus and method for forming vias in one or more layers, comprising one or more beams located in alignment with the layers for forming one or more vias in one or more areas of the layers. A vacuum mechanism is provided for collecting ablated material caused b... | 06/10/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7341935 | Alternative interconnect structure for semiconductor devices A semiconductor interconnect structure includes an organic and/or photosensitive etch buffer layer disposed over a contact surface. The structure further provides an interlevel dielectric formed over the etch buffer layer. A method for forming an interconnect struct... | 03/11/2008 |
| 7341886 | Apparatus and method for forming vias A method and apparatus for forming vias in one or more layers, comprising providing a vacuum chamber, one or more beams in the vacuum chamber. The array of directed beams located in alignment with a layer for ablating one or more areas of the layer for forming vias.... | 03/11/2008 |
| RE40139 | Wafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the wafer A wafer having chamfered bent portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer such as an orientation flatness. The chipping of the wafer can be prevented, and in coating the wafer with a photoresist, forming an ep... | 03/04/2008 |
| 7335605 | Protective tape applying and separating method In a protective tape applying and separating method according to this invention, a protective tape applied by a tape applying mechanism to a surface of a wafer suction-supported by a chuck table is cut to a wafer configuration by a cutter unit. Subsequently, a prote... | 02/26/2008 |
| 7335319 | Semiconductor stress buffer coating edge bead removal compositions and method for their use An edge bead remover composition that includes at least one ketone selected from the group consisting of: wherein R1 and R2 are independently selected from the group consisting of: | 02/26/2008 |
| 7327041 | Semiconductor package and a method for producing the same A semiconductor package includes: a semiconductor chip having circuits formed on a surface, and having a thickness of 0.5 μm or more and 100 μm or less; and an adhesive resin layer provided so as to cover the surface of the semiconductor chip on which the circuits... | 02/05/2008 |
| 7318269 | Method of manufacturing coil component The invention relates to a method of manufacturing a coil component uses as a major part of a common mode choke coil or a transformer, and there is provided a method of manufacturing a compact and low height coil component in which deterioration of impedance charact... | 01/15/2008 |
| 7309515 | Method for fabricating an imprint mold structure The present invention is related to a method for fabricating an imprint mold which can be used in the field of nano-imprint lithography. Firstly, a diamond film and a photoresist film are successively formed onto a substrate; wherein the photoresist film is more cap... | 12/18/2007 |
| 7291541 | System and method for providing improved trench isolation of semiconductor devices A system and method is disclosed for providing improved trench isolation of semiconductor devices. An isolation trench of the present invention is manufactured as follows. A substrate of a semiconductor device is provided and a trench is etched in the substrate. The... | 11/06/2007 |
| 7273769 | Method and apparatus for removing encapsulating material from a packaged microelectronic device A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a microelectronic substrate by directing a source of laser radiation toward the en... | 09/25/2007 |
| 7273793 | Methods of filling gaps using high density plasma chemical vapor deposition The invention includes a method of filling gaps in a semiconductor substrate. A substrate and a gas mixture containing at least one heavy-hydrogen compound are provided within a reaction chamber. The gas mixture is reacted to form a layer of material over the substr... | 09/25/2007 |
| 7271460 | Solid-state image sensing device, manufacturing method and attachment method thereof, imaging apparatus and image read unit for imaging apparatus A solid-state image sensing device is provided which saves the effort of removing adhesives from a cover glass and is capable of reading an image without being affected by adhesive residuals. In a solid-state image sensing device, defacement of a cover glass upon th... | 09/18/2007 |
| 7262077 | Capillary underfill and mold encapsulation method and apparatus A method of packaging a die includes attaching the die to a substrate; underfilling the space between the die and the substrate with a first material, and placing a second material in contact with at least a portion of the die and the substrate after underfilling th... | 08/28/2007 |
| 7262136 | Modified facet etch to prevent blown gate oxide and increase etch chamber life A modified facet etch is disclosed to prevent blown gate oxide and increase etch chamber life. The modified facet etch is a two-stage process. The first stage is a plasma sputter etch to form a facet profile. The first stage etch is terminated prior to reaching the ... | 08/28/2007 |
| 7261920 | Process for forming a patterned thin film structure on a substrate A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be f... | 08/28/2007 |
| 7262488 | Substrate with enhanced properties for planarization A method and intermediate structure for improving the thinning and planarity of a wafer back side utilizing planarization material applied to the back side prior to at least one portion of the thinning operation and which is subsequently removed concurrently with th... | 08/28/2007 |
| 7259448 | Die-up ball grid array package with a heat spreader and method for making the same An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is received. A heat spreader has a first surface and a second... | 08/21/2007 |
| 7259075 | Method for manufacturing field effect transistor The manufacturing stability can be improved while effectively inhibiting the short-channel effect in the transistor according to the present invention. A halo impurity having a conductivity type opposite to a first conductivity type of a first impurity is ion-implan... | 08/21/2007 |
| 7247176 | Apparatus for removing fine particles during fabrication of a portable camera module An apparatus and a method adapted for shielding and removing fine particles for a portable camera module generated during a portable camera module fabricating process. The portable camera module includes an image sensor and an infrared ray filter. The apparatus incl... | 07/24/2007 |
| 7247510 | Magnetic recording medium and magnetic memory apparatus Disclosed is a magnetic memory apparatus which comprises a patterned magnetic recording medium in which multilayered films each having a first magnetic layer, a nonmagnetic metal layer or a nonmagnetic insulating layer and a second magnetic layer deposited discretel... | 07/24/2007 |
| 7238550 | Methods and apparatus for fabricating Chip-on-Board modules An improved method for fabricating Chip-on-Board memory modules using partially-defective memory chips or a combination of partially-defective and flawless memory parts, comprises mounting unpackaged (or a combination of packaged and unpackaged) memory parts to a pr... | 07/03/2007 |
| 7229914 | Wiring layer structure for ferroelectric capacitor Wiring layers through that come into direct contact with an electrode of a ferroelectric capacitor provide a wiring layer structure configured so that the characteristic of the ferroelectric substance is not degraded by production of a reducing agent. One of coating... | 06/12/2007 |
| 7229859 | Thin film device provided with coating film, liquid crystal panel and electronic device, and method for making the thin film device Any one of an insulating film forming a TFT, a silicon film and a conductive film is formed by applying a solution and annealing it. In a spin coater (102), a coating solution containing a thin film component which is supplied from a solution storage section ... | 06/12/2007 |
| 7223643 | Method of manufacturing a semiconductor device Formation of LDD structures and GOLD structures in a semiconductor device is conventionally performed in a self aligning manner with gate electrodes as masks, but there are many cases in which the gate electrodes have two layer structures, and film formation process... | 05/29/2007 |
| 7211143 | Sacrificial template method of fabricating a nanotube Methods of fabricating uniform nanotubes are described in which nanotubes were synthesized as sheaths over nanowire templates, such as using a chemical vapor deposition process. For example, single-crystalline zinc oxide (ZnO) nanowires are utilized as templates ove... | 05/01/2007 |
