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Patent No. 5508049

Pizza Pie With Concentric Rings of Crust

A pizza mold for forming a plurality of concentric raised ridges of dough (i.e., crust) on the surface of a pizza pie.

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Class 438/741 - PN junction functions as etch stop


Subclass of Class 438 - Semiconductor device manufacturing: process
Definition: Processes wherein the etch stop layer is a component of
No. of patents: 17
Last issue date: 04/27/2010


NumberTitleIssue Date
7704892Semiconductor device having local interconnection layer and etch stopper pattern for preventing leakage of current
A semiconductor device having a local interconnection layer and a method for manufacturing the same are provided. A local interconnection layer is formed in an interlayer dielectric (ILD) layer on an isolation layer and a junction layer, for covering a semiconductor...
04/27/2010
7402529Method of applying cladding material on conductive lines of MRAM devices
A method of fabricating a cladding region for use in MRAM devices includes the formation of a conductive bit line proximate to a magnetoresistive memory device. The conductive bit line is immersed in a first bath containing dissolved ions of a first conductive mater...
07/22/2008
7250323Methods of making energy conversion devices with a substantially contiguous depletion regions
A method of making an energy conversion device includes forming a plurality of pores within a substrate and forming a junction region within each of the plurality of pores. Each of the junction regions has a depletion region and each of the plurality of pores define...
07/31/2007
7195965Premature breakdown in submicron device geometries
The concept of the present invention describes a semiconductor device with a junction 504 between a lightly doped region 501 and a heavily doped region 502, wherein the junction has an elongated portion 504a and curved portions ...
03/27/2007
6992342Magnetic memory device having a non-volatile magnetic section and manufacturing thereof
A magnetic memory device, in which a tunnel magneto resistance element that establishes a connection between a write word line (first interconnection) and a bit line (second interconnection) is provided within a region in which the write word line and the bit line c...
01/31/2006
6767835Method of making a shaped gate electrode structure, and device comprising same
In one illustrative embodiment, the method comprises forming a gate insulation layer above a substrate, forming a layer of polysilicon above the gate insulation layer, implanting a dopant material into the layer of polysilicon, forming an undoped layer of polysilico...
07/27/2004
6642148RELACS shrink method applied for single print resist mask for LDD or buried bitline implants using chemically amplified DUV type photoresist
The present invention generally relates to a method of forming a graded junction within a semiconductor substrate. A first masking pattern having a first opening characterized by a first lateral dimension is formed over the semiconductor substrate. The se...
11/04/2003
6642158Photo-thermal induced diffusion
Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor s...
11/04/2003
6211090Method of fabricating flux concentrating layer for use with magnetoresistive random access memories
A method of fabricating a flux concentrator for use in magnetic memory devices including the steps of providing at least one magnetic memory bit (10) and forming proximate thereto a material stack defining a copper (Cu) damascene bit line (56) including a...
04/03/2001
6127237Etching end point detecting method based on junction current measurement and etching apparatus
A pn junction is formed at a to-be-etched depth in an etching region of a semiconductor body and a reverse bias voltage is applied to the pn junction to form a depletion layer. Then, the semiconductor body is etched while monitoring the reverse bias curre...
10/03/2000
6107208Nitride etch using N2 /Ar/CHF3 chemistry
In one embodiment, the present invention relates to a method of etching silicon nitride disposed over a copper containing layer by etching at least a portion of the silicon nitride using a nitride etch gas mixture comprising from about 5 sccm to about 15 ...
08/22/2000
5858875Integrated circuits with borderless vias
A method of forming interconnecting layers in a semiconductor device whereby even if a via is misaligned with a metal line, a portion of the via not enclosed and capped by the metal is enclosed and capped by an etch stop spacer. The foundation layer inclu...
01/12/1999
5242533Method of structuring a semiconductor chip
Processes are proposed for structuring monocrystalline semiconductor substrates provided with a basic doping, in particular silicon substrates with a (100) or (110) crystal orientation. In this process, at least one main surface of the semiconductor subst...
09/07/1993
5129982Selective electrochemical etching
A method of selectively etching a body of a semiconductor material, such as single crystalline silicon, having regions of n-type and p-type conductivity to remove at least a portion of the n-type region. The body is placed in an etching solution of an etc...
07/14/1992
5129981Method of selectively etching silicon
The present invention relates to a method of forming thin bodies of a semiconductor material, such as single crystalline silicon, by selectively etching away a portion of the body until a body of the desired thicknes is obtained. The body includes a p-n j...
07/14/1992
5116457Semiconductor transducer or actuator utilizing corrugated supports
A semiconductor transducer or acutator is disclosed. The transducer and actuator each include a deflecting member with corrugations producing increased vertical travel which is a linear function of applied force. An accurate and easily controlled method t...
05/26/1992
4635343Method of manufacturing GaAs semiconductor device
A method of manufacturing a GaAs semiconductor device of an E/D construction having a GaAs/AlGaAs heterojunction and utilizing two-dimensional electron gas, which includes the steps of forming a heterojunction semiconductor substrate and etching a portion...
01/13/1987
 
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