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Class 438/69 - Including integrally formed optical element (e.g., reflective layer, luminescent layer, etc.)


Subclass of Class 438 - Semiconductor device manufacturing: process
Definition: Process for making a semiconductor device responsive to
No. of patents: 456
Last issue date: 05/21/2013


1                      
NumberTitleIssue Date
8445308Fabrication of phosphor dots and application of phosphor dots to arrays of lighting elements
In accordance with certain embodiments, arrays of phosphor dots are formed and associated with arrays of light-emitting elements to form lighting systems. ...
05/21/2013
8420434Solid-state imaging device and method of manufacturing solid-state imaging device
A solid state imaging device having a back-illuminated type structure in which a lens is formed on the back side of a silicon layer with a light-receiving sensor portion being formed thereon. Insulating layers are buried into the silicon layer around an image pickup...
04/16/2013
8415194Rear electrode structure for use in photovoltaic device such as CIGS/CIS photovoltaic device and method of making same
A photovoltaic device including a rear electrode which may also function as a rear reflector. In certain example embodiments of this invention, the rear electrode includes a metallic based reflective film that is oxidation graded, so as to be more oxided closer to a...
04/09/2013
8409905Method of forming display device that includes removing mask to form opening in insulating film
To improve the use efficiency of materials and provide a technique of fabricating a display device by a simple process. The method includes the steps of providing a mask on a conductive layer, forming an insulating film over the conductive layer provided with the ma...
04/02/2013
8389321Protective layer for large-scale production of thin-film solar cells
A solar cell includes a substrate, a protective layer located over a first surface of the substrate, a first electrode located over a second surface of the substrate, at least one p-type semiconductor absorber layer located over the first electrode, an n-type semico...
03/05/2013
8377732Method of manufacturing back side illuminated imaging device
In one embodiment, a method of manufacturing a back side illuminated imaging device includes forming a semiconductor detection device and a peripheral circuit device on a semiconductor substrate, and bonding the semiconductor substrate onto a holding substrate via t...
02/19/2013
8367455Image sensor and related fabricating method thereof
A fabricating method of an image sensor includes the steps of: providing a substrate; forming sensing elements on the substrate; forming microlenses on the sensing elements; filling a stuffed material on the microlenses, and air regions are formed in the stuffed mat...
02/05/2013
8329497Backside illuminated imaging sensor with improved infrared sensitivity
A backside illuminated imaging sensor includes a semiconductor layer and an infrared detecting layer. The semiconductor layer has a front surface and a back surface. An imaging pixel includes a photodiode region formed within the semiconductor layer. The infrared de...
12/11/2012
8324010Light pipe etch control for CMOS fabrication
In accordance with at least some embodiments of the present disclosure, a process for fabricating a light pipe (LP) is described. The process may be configured to construct a semiconductor structure having an etch-stop layer above a photodiode region and a first die...
12/04/2012
8318526Manufacturing method for light-sensing structure
A manufacturing method for manufacturing a light-sensing structure is provided. The manufacturing method includes the steps as follows. (a) A circuit layer is formed on an upper surface of a first substrate, wherein the first substrate includes at least one light-se...
11/27/2012
8304279Light emitting diode package having anodized insulation layer and fabrication method therefor
An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light...
11/06/2012
8293563Method for manufacturing semiconductor device
Disclosed herein is a method for making a semiconductor device including the steps of: forming a light-receiving portion for carrying out photoelectric conversion in a semiconductor substrate; forming an insulating film to cover a light-receiving side of the semicon...
10/23/2012
8288193Method of manufacturing selective emitter solar cell
The present disclosure uses ammonia plasma for nitrification and for further forming a barrier pattern on a substrate. Then, a selective emitter is fabricated by forming light doping and heavy doping at one time through diffusion into the substrate. Therein, a plura...
10/16/2012
8257996Method of fabricating a radiation detector
The present invention relates to a method of fabricating a radiation detector comprising a photosensitive sensor assembly (1, 4), a scintillator (6) that converts the radiation into radiation to which the photosensitive sensor assembly (1, 4) is...
09/04/2012
8236597Bulk metal species treatment of thin film photovoltaic cell and manufacturing method
A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate comprising a surface region. A first electrode layer is formed overlying the surface region. A copper layer is formed overlying the first electrode layer and ...
08/07/2012
8216872Method of integrating light-trapping layer to thin-film solar cell
A light-trapping layer is integrated into a thin-film solar cell. It is integrated as a light-inlet layer, an intermediate layer or a shaded layer with nano-particles embedded in a transparent or non-transparent conductive film. Thus, light stays longer in an absorp...
07/10/2012
8202755Photodiode module and apparatus including multiple photodiode modules
Various embodiments of the present invention are directed to a photodiode module including a structure configured to selectively couple light to a dielectric-surface mode of a photonic crystal of the photodiode module. In one embodiment of the present invention, a p...
06/19/2012
8198118Method for forming a robust mask with reduced light scattering
A mask and method for forming the same including carrying out a photolithographic patterning process the method including providing a substantially light transparent portion; forming a substantially light shielding layer disposed over the substantially light transpa...
06/12/2012
8198119Method for fabricating sensitive image sensor with non-uniform focal length
A method for fabricating an image sensor is described. A substrate is provided. Multiple photoresist patterns are formed over the substrate, and then a thermal reflow step is performed to convert the photoresist patterns into multiple microlenses arranged in an arra...
06/12/2012
8193025Photomask, image sensor, and method of manufacturing the image sensor
Provided are a photomask, an image sensor, and a method of manufacturing the image sensor. The image sensor can include photodiode structures, color filters, a planarization layer, and microlenses. The photodiode structures can be disposed on a semiconductor substra...
06/05/2012
8193026Image sensor and method for manufacturing the same
A backside illumination (BSI) image sensor having a light receiving part at the wafer or die backside, and a manufacturing method thereof, are disclosed. The method includes polishing the light receiving part so that a super via protrudes, forming a first insulating...
06/05/2012
8187908Light-blocking layer sequence having one or more metal layers for an integrated circuit and method for the production of the layer sequence
In an integrated circuit, a light sensitive area is protected against radiation by arranging a light blocking layer sequence (504) on top of the light sensitive area. The light blocking layer sequence comprises one or several metal layers (504a)...
05/29/2012
8178382Suspended germanium photodetector for silicon waveguide
A vertical stack of a first silicon germanium alloy layer, a second epitaxial silicon layer, a second silicon germanium layer, and a germanium layer are formed epitaxially on a top surface of a first epitaxial silicon layer. The second epitaxial silicon layer, the s...
05/15/2012
8143086Optically controlled electrical-switch device based upon carbon nanotubes and electrical-switch system using the switch device
Described herein is an optically controlled electrical-switch device which includes a first current-conduction terminal and a second current-conduction terminal, and a carbon nanotube connected between the first and the second current-conduction terminals, the carbo...
03/27/2012
8138011Radiation-detecting device and method of manufacturing same
A method of manufacturing a radiation-detecting device including spaced first columnar scintillators, second columnar scintillators which are located between the neighboring first columnar scintillators and which are spaced from the first columnar scintillators, and...
03/20/2012
8119436Image sensor having optical waveguide structure and method for manufacturing the same
An image sensor and a method for manufacturing the same are disclosed. The image sensor can include a semiconductor substrate that includes photodiodes arranged for each unit pixel; an interlayer dielectric layer and metal wirings disposed on the semiconductor subst...
02/21/2012
8067261Solid-state imaging device and manufacturing method thereof
A solid-state imaging device includes a photoelectric conversion unit, a transistor, and an element separation region separating the photoelectric conversion unit and the transistor. The photoelectric conversion unit and the transistor constitute a pixel. The elemen...
11/29/2011
8053269Method of forming display device that includes removing mask to form opening in insulating film
To improve the use efficiency of materials and provide a technique of fabricating a display device by a simple process. The method includes the steps of providing a mask on a conductive layer, forming an insulating film over the conductive layer provided with the ma...
11/08/2011
8048710Photoelectric conversion device and method for producing photoelectric conversion device
A photoelectric conversion device according to the present invention has a plurality of photoreceiving portions provided in a substrate, an interlayer film overlying the photoreceiving portion, a large refractive index region which is provided so as to correspond to...
11/01/2011
8003427Tunable cavity resonator and method for fabricating same
An example tunable cavity resonator for filtering radiation in the optical and IR wavelengths and an example method for fabricating same. The example resonator includes a pair of reflectors, one in fixed relationship to a substrate and the other formed upon a suspen...
08/23/2011
7977141Solid-state image pickup device and method of manufacturing the same
A method of manufacturing a solid-state image pickup device according to an embodiment includes forming first and second holes in a semiconductor substrate, forming insulating films on surfaces of the first and second holes, forming a contact and an alignment mark b...
07/12/2011
7964432Method of manufacturing lenses, in particular for an integrated imager
A method for manufacturing a micro-module for capturing images having an imager and at least one lens, includes manufacturing at least one imager on a first plate of a semiconductor material, producing at least one optical zone to form a lens in at least one second ...
06/21/2011
7947526Method of making backside illumination image sensor
An exemplary method for making a backside illumination image sensor includes the follow steps. A substrate having a top surface is firstly provided. Secondly, many recesses are formed in the top surface. Thirdly, a light pervious layer is applied on the top surface....
05/24/2011
7947525Manufacturing method for a liquid crystal display
A method for manufacturing a liquid crystal display includes the following steps. First, source/drain and a bottom electrode are formed over a color filter substrate with a color filter layer. The next step forms source/drain junction regions over the source/drain. ...
05/24/2011
7935559Method for producing a non-planar microelectronic component using a cavity
This method for producing a non-planar microelectronic component, especially a concave component, involves superposing a layer that contains an active flexible circuit above a cavity shaped according to the desired profile of said component, said cavity being formed...
05/03/2011
7919349Photonic integration scheme
Provided is an apparatus and method for manufacture thereof. The apparatus includes a passive optical waveguide structure and a photodiode detector structure. The structures are located on a substrate, and the photodiode detector is laterally proximate to the semico...
04/05/2011
7888159Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating
The invention involves the integration of curved micro-mirrors over a photodiode active area (collection area) in a CMOS image sensor (CIS) process. The curved micro-mirrors reflect light that has passed through the collection area back into the photo diode. The cur...
02/15/2011
7858429Packaged microelectronic imagers and methods of packaging microelectronic imagers
Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microe...
12/28/2010
7851250Method for manufacturing semiconductor device and method for manufacturing display device
An object is to provide a method for manufacturing a highly-reliable semiconductor device with an improved material use efficiency and with a simplified manufacturing process. The method includes the steps of forming a conductive layer over a substrate, forming a li...
12/14/2010
7846761Image sensor and method for manufacturing the same
Provided is an image sensor and method for manufacturing the same. In the image sensor, a first substrate has a lower metal line and a circuitry thereon. A crystalline semiconductor layer contacts the lower metal line and is bonded to the first substrate. A photodio...
12/07/2010
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