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| Number | Title | Issue Date |
| 8187908 | Light-blocking layer sequence having one or more metal layers for an integrated circuit and method for the production of the layer sequence In an integrated circuit, a light sensitive area is protected against radiation by arranging a light blocking layer sequence (504) on top of the light sensitive area. The light blocking layer sequence comprises one or several metal layers (504a)... | 05/29/2012 |
| 8178382 | Suspended germanium photodetector for silicon waveguide A vertical stack of a first silicon germanium alloy layer, a second epitaxial silicon layer, a second silicon germanium layer, and a germanium layer are formed epitaxially on a top surface of a first epitaxial silicon layer. The second epitaxial silicon layer, the s... | 05/15/2012 |
| 8143086 | Optically controlled electrical-switch device based upon carbon nanotubes and electrical-switch system using the switch device Described herein is an optically controlled electrical-switch device which includes a first current-conduction terminal and a second current-conduction terminal, and a carbon nanotube connected between the first and the second current-conduction terminals, the carbo... | 03/27/2012 |
| 8138011 | Radiation-detecting device and method of manufacturing same A method of manufacturing a radiation-detecting device including spaced first columnar scintillators, second columnar scintillators which are located between the neighboring first columnar scintillators and which are spaced from the first columnar scintillators, and... | 03/20/2012 |
| 8119436 | Image sensor having optical waveguide structure and method for manufacturing the same An image sensor and a method for manufacturing the same are disclosed. The image sensor can include a semiconductor substrate that includes photodiodes arranged for each unit pixel; an interlayer dielectric layer and metal wirings disposed on the semiconductor subst... | 02/21/2012 |
| 8067261 | Solid-state imaging device and manufacturing method thereof A solid-state imaging device includes a photoelectric conversion unit, a transistor, and an element separation region separating the photoelectric conversion unit and the transistor. The photoelectric conversion unit and the transistor constitute a pixel. The elemen... | 11/29/2011 |
| 8053269 | Method of forming display device that includes removing mask to form opening in insulating film To improve the use efficiency of materials and provide a technique of fabricating a display device by a simple process. The method includes the steps of providing a mask on a conductive layer, forming an insulating film over the conductive layer provided with the ma... | 11/08/2011 |
| 8048710 | Photoelectric conversion device and method for producing photoelectric conversion device A photoelectric conversion device according to the present invention has a plurality of photoreceiving portions provided in a substrate, an interlayer film overlying the photoreceiving portion, a large refractive index region which is provided so as to correspond to... | 11/01/2011 |
| 8003427 | Tunable cavity resonator and method for fabricating same An example tunable cavity resonator for filtering radiation in the optical and IR wavelengths and an example method for fabricating same. The example resonator includes a pair of reflectors, one in fixed relationship to a substrate and the other formed upon a suspen... | 08/23/2011 |
| 7977141 | Solid-state image pickup device and method of manufacturing the same A method of manufacturing a solid-state image pickup device according to an embodiment includes forming first and second holes in a semiconductor substrate, forming insulating films on surfaces of the first and second holes, forming a contact and an alignment mark b... | 07/12/2011 |
| 7964432 | Method of manufacturing lenses, in particular for an integrated imager A method for manufacturing a micro-module for capturing images having an imager and at least one lens, includes manufacturing at least one imager on a first plate of a semiconductor material, producing at least one optical zone to form a lens in at least one second ... | 06/21/2011 |
| 7947526 | Method of making backside illumination image sensor An exemplary method for making a backside illumination image sensor includes the follow steps. A substrate having a top surface is firstly provided. Secondly, many recesses are formed in the top surface. Thirdly, a light pervious layer is applied on the top surface.... | 05/24/2011 |
| 7947525 | Manufacturing method for a liquid crystal display A method for manufacturing a liquid crystal display includes the following steps. First, source/drain and a bottom electrode are formed over a color filter substrate with a color filter layer. The next step forms source/drain junction regions over the source/drain. ... | 05/24/2011 |
| 7935559 | Method for producing a non-planar microelectronic component using a cavity This method for producing a non-planar microelectronic component, especially a concave component, involves superposing a layer that contains an active flexible circuit above a cavity shaped according to the desired profile of said component, said cavity being formed... | 05/03/2011 |
| 7919349 | Photonic integration scheme Provided is an apparatus and method for manufacture thereof. The apparatus includes a passive optical waveguide structure and a photodiode detector structure. The structures are located on a substrate, and the photodiode detector is laterally proximate to the semico... | 04/05/2011 |
| 7888159 | Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating The invention involves the integration of curved micro-mirrors over a photodiode active area (collection area) in a CMOS image sensor (CIS) process. The curved micro-mirrors reflect light that has passed through the collection area back into the photo diode. The cur... | 02/15/2011 |
| 7858429 | Packaged microelectronic imagers and methods of packaging microelectronic imagers Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microe... | 12/28/2010 |
| 7851250 | Method for manufacturing semiconductor device and method for manufacturing display device An object is to provide a method for manufacturing a highly-reliable semiconductor device with an improved material use efficiency and with a simplified manufacturing process. The method includes the steps of forming a conductive layer over a substrate, forming a li... | 12/14/2010 |
| 7846761 | Image sensor and method for manufacturing the same Provided is an image sensor and method for manufacturing the same. In the image sensor, a first substrate has a lower metal line and a circuitry thereon. A crystalline semiconductor layer contacts the lower metal line and is bonded to the first substrate. A photodio... | 12/07/2010 |
| 7842533 | Electromagnetic radiation sensor and method of manufacture A method of forming a semiconductor sensor in one embodiment includes providing a substrate, forming a reflective layer on the substrate, forming a sacrificial layer on the reflective layer, forming an absorber layer with a thickness of less than about 50 nm on the ... | 11/30/2010 |
| 7803652 | Semiconductor device for image sensor Embodiments relate to a semiconductor device for an image sensor method of fabricating a semiconductor device for an image sensor having a micro lens. According to embodiments, the method may include forming a lower insulating film having cavities on a substrate, fo... | 09/28/2010 |
| 7785916 | Image sensor and method for manufacturing the same Embodiments relate to an image sensor and a method for manufacturing the same. According to embodiments, a semiconductor substrate may include a pixel part and a peripheral part. A photo diode pattern may be formed over the pixel part having a height that is greater... | 08/31/2010 |
| 7736936 | Method of forming display device that includes removing mask to form opening in insulating film To improve the use efficiency of materials and provide a technique of fabricating a display device by a simple process. The method includes the steps of providing a mask on a conductive layer, forming an insulating film over the conductive layer provided with the ma... | 06/15/2010 |
| 7732244 | Method for forming light-transmitting regions A method for forming a light-transmitting region comprises providing a support feature. A sacrificial layer is formed over a portion of the support feature, wherein the sacrificial layer comprises an energy-induced swelling material. A light-blocking layer is confor... | 06/08/2010 |
| 7718462 | Method for manufacturing semiconductor device and method for manufacturing display device An object is to provide a method for manufacturing a highly-reliable semiconductor device with an improved material use efficiency and with a simplified manufacturing process. The method includes the steps of forming a conductive layer over a substrate, forming a li... | 05/18/2010 |
| 7713775 | CMOS image sensor Embodiments relate to a CMOS image sensor and to a method for manufacturing a CMOS image sensor that may disperse stray beam between microlenses. According to embodiments, the method for manufacturing the CMOS image may include forming an interlayer dielectric layer... | 05/11/2010 |
| 7704779 | Image sensing device having protection pattern on the microlens, camera module, and method of forming the same An image sensing device having a protection pattern formed on microlenses is provided. The device includes a plurality of photodiodes provided in a semiconductor substrate. An insulating layer having a substantially flat top surface is disposed on the photodiodes. A... | 04/27/2010 |
| 7704780 | Optical enhancement of integrated circuit photodetectors A semiconductor integrated circuit structure and method for fabricating. The semiconductor integrated circuit structure includes a light sensitive device integral with a semiconductor substrate, a cover dielectric layer disposed over the light sensitive device, and ... | 04/27/2010 |
| 7704778 | Microlens structure for image sensors A microlens structure and a method of fabrication thereof are provided. The method comprises forming a layer of microlens material over a substrate, which has photo-sensitive elements formed therein. The microlens material, which comprises a photo-resist material, i... | 04/27/2010 |
| 7687304 | Current-driven device using NiMn alloy and method of manufacture A material for forming a conductive structure for a micromechanical current-driven device is described, which is an alloy containing about 0.025% manganese and the remainder nickel. Data shows that the alloy possesses advantageous mechanical and electrical propertie... | 03/30/2010 |
| 7678604 | Method for manufacturing CMOS image sensor Disclosed is a CMOS image sensor and a method for manufacturing a CMOS image sensor. The method includes: (a) forming a resist film on a semiconductor substrate comprising a light sensing part, a protecting layer over the light sensing part, and an exposed bonding p... | 03/16/2010 |
| 7666705 | Image sensor and method of manufacturing the same Provided is an image sensor and method of manufacturing the same. The image sensor can include a semiconductor substrate, a metal interconnection layer, an inorganic layer, lens seed patterns, and microlenses. The semiconductor substrate can include unit pixels. The... | 02/23/2010 |
| 7666704 | Solid-state image pickup element, method for manufacturing such solid-state image pickup element and optical waveguide forming device A solid-state imaging device of the present invention includes a base 13, a plurality of photoelectric conversion portions 11 formed in a surface of the base 13, and an insulating film 18 formed above the base 13. Openings 18 | 02/23/2010 |
| 7642117 | CMOS image sensor Embodiments relate to a complementary metal oxide semiconductor (CMOS) image sensor. According to embodiments, the CMOS image sensor may include a semiconductor substrate, an interlayer insulating layer, a color filter layer, an overcoat layer, and a plurality of mi... | 01/05/2010 |
| 7642118 | Image sensor fabricating method A method of fabricating an image sensor includes forming a first SiO2 layer on a color filter layer, patterning a photosensitive layer on first SiO2 layer, patterning the first SiO2 layer through a first etching process, forming a se... | 01/05/2010 |
| 7642119 | Method for manufacturing image sensor A method for manufacturing an image sensor is provided. The method can include forming an oxide layer on a color filter layer, forming a first oxide layer microlens by etching the oxide layer, forming a second oxide layer microlens on the first oxide layer microlens... | 01/05/2010 |
| 7595215 | CMOS image sensor and method for manufacturing the same A CMOS image sensor and a method for manufacturing the same are provided. The CMOS image sensor enlarges an area of a real image and prevents interference between adjacent pixels by forming a plurality of microlenses on a convex surface and forming a light blocking ... | 09/29/2009 |
| 7547573 | Image sensor and method of manufacturing the same An image sensor and a method of manufacturing the same, in which, a planarized layer is formed on a semiconductor substrate including a pixel array region, an optical black region, and a logic region to cover a photo sensing unit array in the pixel array region, a p... | 06/16/2009 |
| 7531376 | Array substrate for transflective liquid crystal display device and a fabricating method thereof A fabricating method of an array substrate for a transflective liquid crystal display device includes forming a gate line on a substrate having a display portion and a surrounding portion, forming a gate insulating layer covering the gate line, forming a data line o... | 05/12/2009 |
| 7528001 | Method of manufacturing a CMOS image sensor A complementary metal oxide silicon (CMOS) image sensor includes a pad protection layer having a dual-layer structure including a plasma enhanced-tetra ethyl ortho silicate (PE-TEOS) layer as a lower layer and a thermo-setting resin layer as an upper layer. The ther... | 05/05/2009 |
