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| Number | Title | Issue Date |
| 8114701 | Camera modules and methods of fabricating the same Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first wafer including an array of lens units. Then, a second wafer including an... | 02/14/2012 |
| 8034653 | Method and apparatus for breaking semiconductor substrate, method for breaking solar cell and method for fabrication of solar cell module A method and apparatus for breaking a semiconductor substrate along a predetermined area over which a split groove is formed. The breaking apparatus includes a table for placing a portion of the semiconductor substrate inside the predetermined area and a breaking bl... | 10/11/2011 |
| 8003426 | Method for manufacturing package structure of optical device A package structure of optical devices has a chip, a sealant, a cover, a substrate, a plurality of bonding wires, and a transparent encapsulant. The chip has at least an optical device and a plurality of chip connection pads. The sealant is disposed around the optic... | 08/23/2011 |
| 7964431 | Method to make electrical contact to a bonded face of a photovoltaic cell A photovoltaic cell is formed by bonding a donor body to a receiver element and cleaving a thin lamina from the donor body. Electrical contact is made to the bonded surface of the lamina through vias formed in the lamina. In some embodiments the emitter exists only ... | 06/21/2011 |
| 7838325 | Method to optimize substrate thickness for image sensor device Provided is a method for fabricating an image sensor device that includes providing a substrate having a front side and a back side; patterning a photoresist on the front side of the substrate to define an opening having a first width, the photoresist having a first... | 11/23/2010 |
| 7781250 | Wafer level chip size package for MEMS devices and method for fabricating the same The present invention provides a wafer level chip size package having cavities within which micro-machined parts are free to move, allowing access to electrical contacts, and optimized for device performance. Also a method for fabricating a wafer level chip size pac... | 08/24/2010 |
| 7687303 | Method for determining via/contact pattern density effect in via/contact etch rate A method for determining an effect of via/contact pattern density in via/contact etch rate of a wafer includes determining a neutral etchant species number flux intersecting each via/contact mouth as a function of local layout characteristics and determining variati... | 03/30/2010 |
| 7682861 | Method for manufacturing a micromechanical motion sensor, and a micromechanical motion sensor The present invention relates to measuring devices used in measuring physical quantities, such as acceleration, angular acceleration, or angular velocity, and, more precisely, to micromechanical motion sensors. The area, in the wafer plane, of a motion sensor compon... | 03/23/2010 |
| 7625776 | Methods of fabricating intermediate semiconductor structures by selectively etching pockets of implanted silicon A method of forming at least one undercut structure in a semiconductor substrate. The method comprises providing a semiconductor substrate, forming at least one doped region in the semiconductor substrate, and removing the at least one doped region to form at least ... | 12/01/2009 |
| 7547572 | Method of protecting semiconductor chips from mechanical and ESD damage during handling A method and apparatus are provided for protecting a semiconductor device from damage. The method includes the steps of providing a active semiconductor device on a surface of the semiconductor substrate where the active device is surrounded by inactive semiconducto... | 06/16/2009 |
| 7439162 | Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniform The present invention grinds the rear surface side of a device area to form a recessed portion and an annular reinforcement part on the outer periphery of the recessed portion, removes the annular reinforcement part by grinding or cutting the rear surface of the ann... | 10/21/2008 |
| 7413965 | Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape A method of manufacturing a thin-film circuit substrate, containing: (a) gouging a surface of a circuit substrate in a depth at least approximately equal to a thickness of a final product of the substrate, to form a section to be formed a penetrating section;... | 08/19/2008 |
| 7405100 | Packaging of a semiconductor device with a non-opaque cover Packages of semiconductor devices with non-opaque covers and methods for making the packages. The invention allows an encapsulant to be used with a non-opaque cover. By ensuring the cover is attached to a die in such a way as to expose bonding pads while sealing in ... | 07/29/2008 |
| 7405138 | Manufacturing method of stack-type semiconductor device A semiconductor device capable mounting semiconductor elements having different functions without increasing the area of the semiconductor device, and its manufacturing method are presented. A part if wiring 104 is formed al so at the side surface of a semico... | 07/29/2008 |
| 7404248 | Producing method of producing a solid pickup device A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a ... | 07/29/2008 |
| 7396780 | Method for laser processing of wafer A method of carrying out the laser processing of a wafer with a laser beam processing machine comprising a chuck table for holding a wafer, a laser beam application means for applying a laser beam to the wafer held on the chuck table and a processing-feed means for ... | 07/08/2008 |
| 7393770 | Backside method for fabricating semiconductor components with conductive interconnects A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a substrate contact on the circuit side. The method also includes the steps of ... | 07/01/2008 |
| 7390688 | Semiconductor device and manufacturing method thereof A semiconductor device includes a semiconductor substrate which has an integrated circuit formed on a front surface thereof, and a rough surface with a height difference of 1 to 5 μm on a rear surface thereof. A protective film is provided on the rear surface of th... | 06/24/2008 |
| 7387951 | Method of dicing semiconductor wafer into chips, and apparatus using this method The invention relates to a semiconductor wafer dicing method of dicing a semiconductor wafer along parting lines into chips. The semiconductor wafer in which parting lines along which the semiconductor wafer is diced into chips are formed is held by an adhesive tape... | 06/17/2008 |
| 7387260 | MOS electronic article surveillance, RF and/or RF identification tag/device, and methods for making and using the same A RF MOS- or nonlinear device-based surveillance and/or identification tag, and methods for its manufacture and use. The tag generally includes (a) an inductor, (b) a first capacitor plate coupled to the inductor, (c) a dielectric film on the first capacitor plate, ... | 06/17/2008 |
| 7354801 | Method for manufacturing semiconductor device In the case where an integrated circuit formed of a thin film is formed over a substrate and peeled from the substrate, a fissure (also referred to as crack) is generated in the integrated circuit in some cases. The present invention is to restrain the generation of... | 04/08/2008 |
| 7354786 | Sensor element with trenched cavity A micromechanical sensor element and a method for the production of a micromechanical sensor element that is suitable, for example in a micromechanical component, for detecting a physical quantity. Provision is made for the sensor element to include a substrate, an ... | 04/08/2008 |
| 7354790 | Method and apparatus for avoiding dicing chip-outs in integrated circuit die A method and apparatus for avoiding dicing chip-outs in integrated circuit die comprises: (a) providing a wafer for forming a plurality of integrated circuit die thereon; (b) forming the plurality of integrated circuit die on the wafer; and (c) forming a saw street ... | 04/08/2008 |
| 7348193 | Hermetic seals for micro-electromechanical system devices The invention is directed to a hermetically sealed device and a method for making such device. The device includes optical, micro-electromechanical, electronic and opto-electronic devices, having a substrate with one or a plurality of optical, opto-electronic, elect... | 03/25/2008 |
| 7348199 | Wafer dividing method A wafer processing method of dividing a wafer having function elements formed in areas sectioned by dividing lines formed on the front surface in a lattice pattern, into individual chips along the dividing lines, which comprises a deteriorated layer forming step for... | 03/25/2008 |
| 7332415 | Silicon wafer dividing method and apparatus A method of dividing a silicon wafer along predetermined dividing lines, comprising a deteriorated layer forming step for forming deteriorated layers exposed to at least a surface to which a laser beam is applied, from the inside of the silicon wafer by applying a p... | 02/19/2008 |
| 7326590 | Method for manufacturing ball grid array package A method for manufacturing a ball grid array package includes the steps of providing a substrate strip having a plurality of sub-substrate strips wherein each has an upper surface and a lower surface, disposing a plurality of chips on the upper surfaces of the sub-s... | 02/05/2008 |
| 7303932 | Support body for semiconductor element, method for manufacturing the same and semiconductor device A semiconductor device comprises a semiconductor element and a support body made of a stack of ceramic layers having a recess in which electrical conductors are electrically connected with the semiconductor element, wherein at least a part of a top face of a recess ... | 12/04/2007 |
| 7294521 | Method of fabricating vertical devices using a metal support film A method of fabricating semiconductor devices, such as GaN LEDs, on insulating substrates, such as sapphire. Semiconductor layers are produced on the insulating substrate using normal techniques. Trenches that define the boundaries of the individual devices are form... | 11/13/2007 |
| 7288435 | Method for producing a cover, method for producing a packaged device In a method for producing a cover for a region of a substrate, first a frame structure is produced in the region of the substrate, and then a cap structure is attached to the frame structure so that the region under the cap structure is covered. Thus, sensitive devi... | 10/30/2007 |
| 7288757 | Microelectronic imaging devices and associated methods for attaching transmissive elements Microelectronic imaging devices and associated methods for attaching transmissive elements are disclosed. A manufacturing method in accordance with one embodiment of the invention includes providing an imager workpiece having multiple image sensor dies configured to... | 10/30/2007 |
| 7273765 | Solid-state imaging device and method for producing the same A solid-state imaging device includes: a planar substrate; an imaging element fixed onto the substrate; a rib provided on the substrate so as to surround the imaging element; a transparent plate fixed to a top face of the rib; a plurality of wirings for conducting e... | 09/25/2007 |
| 7265032 | Protective layer during scribing A method including forming a chemically soluble coating on a plurality exposed contacts on a surface of a circuit substrate; scribing the surface of the substrate along scribe areas; and after scribing, removing a portion of the coating. A method including forming a... | 09/04/2007 |
| 7259444 | Optoelectronic device with patterned ion implant subcollector In one embodiment, an optoelectronic device is provided having a pin photo diode including a semi-insulating substrate or layer, with a patterned implant region of a first dopant type. The pin photo diode includes an upper layer having semiconductor material with a ... | 08/21/2007 |
| 7256106 | Method of dividing a substrate into a plurality of individual chip parts The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing... | 08/14/2007 |
| 7250318 | System and method for providing automated sample preparation for plan view transmission electron microscopy A system and method is described for providing automated sample preparation for plan view transmission electron microscopy. A sample wafer is microcleaved from a semiconductor wafer and mounted on a first support stub. Then the sample wafer is cut with an automated ... | 07/31/2007 |
| 7250354 | Semiconductor device and method for fabricating the same A semiconductor device according to the present invention includes a semiconductor substrate, which comprises a first surface on which an electrode pad is formed, and a second surface arranged at an opposite side of the first surface; an external terminal formed on ... | 07/31/2007 |
| 7242069 | Thin wafer detectors with improved radiation damage and crosstalk characteristics The present invention provides for reduced radiation damage susceptibility, decreased affects of crosstalk, and increased flexibility in application. In one embodiment, the present invention includes a back side illuminated photodiode array with a back side etching ... | 07/10/2007 |
| 7235864 | Integrated circuit devices, edge seals therefor An edge seal for a chip with integrated circuits. A first metal line extends along a periphery of the chip, with a first inter-metal dielectric layer on the first metal line. A second metal line overlies the first inter-metal dielectric layer and extends along the p... | 06/26/2007 |
| 7217992 | Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Semiconductor devices,-semiconductor wafers, and semiconductor modules are provided: wherein the semiconductor device has a small warp; damages at chip edge and cracks in a dropping test are scarcely generated; and the semiconductor device is superior in mounting re... | 05/15/2007 |
