Did You Know...
...that one person who claimed to be the inventor of the television is Russian emigre Vladimir Zworykin? In 1929 David Sarnoff, founder of RCA, asked Zworykin what it would take to develop TV for commercial use. He said: a year and a half and $100,000. In reality, it took 20 years and $50 million! Before his death in 1982 at the age of 92, Zworykin said of his invention: "The technique is wonderful. It is beyond my expectations. But the programs! I would never let my children even come close to this thing."
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8173544 | Integrated circuit having interleaved gridded features, mask set and method for printing A method (300) for fabricating an integrated circuit includes the step of providing a substrate having a semiconductor surface (305). For at least one masking level (e.g. gate electrode, contact or via) of the integrated circuit, a mask pattern for the... | 05/08/2012 |
| 8168536 | Realization of self-positioned contacts by epitaxy Metal contacts are self-positioned on a wafer of semiconductor product. Respective placement areas for a metal contact are determined by a selective deposition of a growth material over a region of the substrate surface (for example, through epitaxial growth). The g... | 05/01/2012 |
| 8168537 | Semiconductor component and assumbly with projecting electrode A semiconductor component has a substrate and a projecting electrode on the substrate. The projecting electrode is configured suitably for electrically and mechanically connecting the semiconductor component to an external substrate. Furthermore, the projecting elec... | 05/01/2012 |
| 8158517 | Method for manufacturing wiring substrate, thin film transistor, display device and television device An object of the present invention is to provide a method for manufacturing a display device by improving the utilization efficiency of materials and simplifying manufacturing process. Another object of the invention is to provide a technique for forming a pattern s... | 04/17/2012 |
| 8119525 | Process for selective growth of films during ECP plating Methods of controlling deposition of metal on field regions of a substrate in an electroplating process are provided. In one aspect, a dielectric layer is deposited under plasma on the field region of a patterned substrate, leaving a conductive surface exposed in th... | 02/21/2012 |
| 8101520 | Method of forming patterns of semiconductor device A method of forming patterns of a semiconductor device comprises forming a number of first insulating patterns that define sidewalls by patterning a first insulating layer formed over a semiconductor substrate, forming second insulating patterns, each second insulat... | 01/24/2012 |
| 8053364 | Closed-loop sputtering controlled to enhance electrical characteristics in deposited layer This disclosure provides a method of fabricating a semiconductor device layer and an associated memory cell. Empirical data may be used to generate a hysteresis curve associated with metal oxide deposition for a metal-insulator-metal structure, with curve measuremen... | 11/08/2011 |
| 8003533 | Method for forming a laminated structure having a wettability-variable layer A disclosed laminated structure includes a wettability-variable layer containing a wettability-variable material whose surface energy changes when energy is applied thereto and including at least a high-surface-energy area having high surface energy and a low-surfac... | 08/23/2011 |
| 7989346 | Surface treatment of silicon A method of forming a resist pattern on a silicon semiconductor substrate having an anti-reflective layer thereon is described. The method includes the steps of a) modifying surface energy of the anti-reflective surface with a chemical treatment composition, b) appl... | 08/02/2011 |
| 7977240 | Metal inks for improved contact resistance Metal ink compositions, methods of forming such compositions, and methods of forming conductive layers are disclosed. The ink composition includes a bulk metal, a transition metal source, and an organic solvent. The transition metal source may be a transition metal ... | 07/12/2011 |
| 7968461 | Method for forming wiring, method for manufacturing thin film transistor and droplet discharging method It is required that a line width of a wiring is prevented from being wider to be miniaturized when the wiring or the like is formed by a dropping method typified by an ink-jetting method. Therefore, the invention provides a method for narrowing (miniaturizing) the l... | 06/28/2011 |
| 7951710 | Method for manufacturing thin film transistor and display device The present invention discloses a display device and a manufacturing method thereof by which a manufacturing process can be simplified. Further, the present invention discloses technique for manufacturing a pattern such as a wiring into a desired shape with good con... | 05/31/2011 |
| 7928010 | Method for producing portable memory devices Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with th... | 04/19/2011 |
| 7858521 | Fabrication for electroplating thick metal pads A method of electroplating includes forming a seed region to be electroplated on a first portion of a substrate, forming a ground plane on a second portion of a substrate, electrically isolating the ground plane from the seed region, electroplating the region, where... | 12/28/2010 |
| 7816263 | Method for manufacturing thin film transistor Disclosed is a method for manufacturing a thin film transistor having high resolution and high pattern accuracy with high production efficiency. Particularly disclosed is a method for manufacturing a thin film transistor wherein there is prevented deterioration of s... | 10/19/2010 |
| 7807570 | Local metallization and use thereof in semiconductor devices An embodiment of the invention provides a method of creating local metallization in a semiconductor structure, and the use of local metallization so created in semiconductor structures. In one respect, the method includes forming an insulating layer on top of a semi... | 10/05/2010 |
| 7799679 | Liquid phase molecular self-assembly for barrier deposition and structures formed thereby Methods and associated structures of forming a microelectronic structure are described. Those methods may comprise dissolving a metal precursor in a non-aqueous solvent in a bath; placing a substrate comprising an interconnect opening in the bath, wherein the metal ... | 09/21/2010 |
| 7776740 | Method for integrating selective low-temperature ruthenium deposition into copper metallization of a semiconductor device A method for integrating low-temperature selective Ru metal deposition into manufacturing of semiconductor devices to improve electromigration and stress migration in bulk Cu metal. The method includes providing a patterned substrate containing a recessed feature in... | 08/17/2010 |
| 7696089 | Passivated thin film and method of producing same A method of producing a passivated thin film material is disclosed wherein an insulating thin film layer (10), having pinholes (12) therein, is positioned upon an underlying electrically conductive substrate (11). The thin film layer is then ele... | 04/13/2010 |
| 7678697 | Substrate, device, method of manufacturing device, method of manufacturing active matrix substrate, electro-optical apparatus and electronic apparatus A substrate on which a pattern is formed by a discharged functional liquid, includes a coating region coated with the functional liquid, and banks formed to enclose the coating region, wherein a difference between a contact angle of the functional liquid with respec... | 03/16/2010 |
| 7622385 | Wiring pattern forming method, film pattern forming method, semiconductor device, electro-optical device, and electronic equipment A wiring pattern forming method which is a method of forming a wiring pattern by using a liquid droplet ejection method on a preset area on a substrate, includes: forming a bank on the preset area on the substrate; | 11/24/2009 |
| 7615488 | Method for forming pattern, thin film transistor, display device and method for manufacturing the same, and television device A method for forming a pattern according to the invention comprises the steps of: forming a mask over a substrate having light-transmitting properties; forming a first region having a substance including a light-absorbing material over the substrate and the mask; fo... | 11/10/2009 |
| 7615489 | Method for forming metal interconnects and reducing metal seed layer overhang A method for forming metal interconnects on a substrate is described. A substrate with a dielectric layer is positioned within a processing chamber. A first barrier layer is deposited on the dielectric layer and within a plurality of vias of the dielectric layer, wh... | 11/10/2009 |
| 7563713 | Semiconductor devices having plated contacts, and methods of manufacturing the same A mask layer is applied to a surface of a semiconductor structure or a seed layer deposited on the surface. The mask layer has a submicron width opening with a high aspect ratio that exposes a portion of the surface or seed layer. Conductive material is conformed to... | 07/21/2009 |
| 7425504 | Systems and methods for plasma etching Systems and methods are disclosed for processing a semiconductor substrate by depositing a conductive layer on the substrate; patterning a set of insulating structures on the substrate; selectively back-biasing the substrate; depositing a layer of material on the su... | 09/16/2008 |
| 7419903 | Thin films Thin films are formed by formed by atomic layer deposition, whereby the composition of the film can be varied from monolayer to monolayer during cycles including alternating pulses of self-limiting chemistries. In the illustrated embodiments, varying amounts of impu... | 09/02/2008 |
| 7405157 | Methods for the electrochemical deposition of copper onto a barrier layer of a work piece Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate d... | 07/29/2008 |
| 7405155 | Circuit package and method of plating the same A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate... | 07/29/2008 |
| 7404249 | Method of manufacturing an inductance A method for manufacturing an inductance in a monolithic circuit including a substrate of planar upper surface, including the steps of forming in the substrate a cavity substantially following the contour of the inductance to be formed, the cross-section of the cavi... | 07/29/2008 |
| 7402517 | Method and apparatus for selective deposition of materials to surfaces and substrates Methods are disclosed for depositing materials selectively and controllably from liquid, near-critical, and/or supercritical fluids to a substrate or surface controlling the location and/or thickness of material(s) deposited to the surface or substrate. In one exemp... | 07/22/2008 |
| 7400045 | Semiconductor device and method for fabricating the same In a method for fabricating a semiconductor device, first, a first metal interconnect is formed in an interconnect formation region, and a second metal interconnect is formed in a seal ring region. Subsequently, by chemical mechanical polishing or etching, the upper... | 07/15/2008 |
| 7399704 | Fabrication method of a semiconductor device using liquid repellent film In the case where a contact hole is formed by a conventional process of the semiconductor device fabrication, a resist is required to be formed almost entirely over a substrate in order to form the resist over the film where the contact hole is not formed. According... | 07/15/2008 |
| 7399705 | Method for producing a local coating and combinatory substrate having such coating A method for producing at least one local coating on a substrate is provided, as well as a combinatory substrate having such a local coating, a mask that is removable in a non-destructive manner being arranged on the substrate in a first step; the mask having at lea... | 07/15/2008 |
| 7396447 | Through-hole conductors for semiconductor substrates and system for making same A method, structure and system for forming a through-hole conductor in a semiconductor substrate includes forming a hole having an inner surface from a first side of the semiconductor substrate to a second side of the semiconductor substrate and plating the inner su... | 07/08/2008 |
| 7393781 | Capping of metal interconnects in integrated circuit electronic devices A multilayer metal cap over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device, and a method for forming the cap. ... | 07/01/2008 |
| 7375012 | Method of forming multilayer film This disclosure describes system(s) and/or method(s) enabling contacts for individual nanometer-scale-thickness layers of a multilayer film. ... | 05/20/2008 |
| 7371682 | Production method for electronic component and electronic component A method of manufacturing an electronic part in which on the upper surface of an insulating member covering lower layer wiring, a conductor portion connected from the lower layer wiring is exposed. In this method, electric power supplying film is formed on the upper... | 05/13/2008 |
| 7365008 | Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus A method of forming a predetermined pattern by disposing a functional liquid on a substrate, the method includes the steps of forming banks on the substrate, and disposing the functional liquid on a region divided by the banks, wherein a width of the region is parti... | 04/29/2008 |
| 7364935 | Common word line edge contact phase-change memory A method of fabricating a phase-change memory cell is described. The cross-sectional area of a contact with a phase-change memory element within the cell is controlled by a first dimension of a bottom electrode and a second dimension controlled by an etch process. T... | 04/29/2008 |
| 7358183 | Method for manufacturing wiring and method for manufacturing semiconductor device The present invention provides a method for manufacturing a wiring and a method for manufacturing a semiconductor device, which do not require a photolithography step in connecting a pattern of an upper layer and a pattern of a lower layer. According to the present ... | 04/15/2008 |
