Quotables
"It is my heart-warmed and world-embracing Christmas hope and aspiration that all of us, the high, the low, the rich, the poor, the admired, the despised, the loved, the hated, the civilized, the savage (every man and brother of us all throughout the whole earth), may eventually be gathered together in a heaven of everlasting rest and peace and bliss, except the inventor of the telephone. "
Mark Twain ; Christmas greetings, 1890
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| Number | Title | Issue Date |
| 8349737 | Manufacturing method of array substrate using lift-off method A method of forming a pattern includes forming a photoresist pattern on a substrate, forming a first material layer on substantially an entire surface of the substrate including the photoresist pattern, heat-treating the substrate including the first material layer ... | 01/08/2013 |
| 8236689 | Method for applying a structure to a semiconductor element A method for applying a predetermined structure of a structural material to a semiconductor element. The method includes the following steps: A) partially covering a surface of the semiconductor element with a masking layer, B) applying a film of a structural materi... | 08/07/2012 |
| 8076238 | Electronic device and method for production An electronic device and method for production is disclosed. One embodiment provides an integrated component having a first layer which is composed of copper or a copper alloy or which contains copper or a copper alloy, and having an electrically conductive second l... | 12/13/2011 |
| 7700482 | Patterned material layer, method of forming the same, microdevice, and method of manufacturing the same A method of forming a patterned material layer, the method comprising: a resist layer forming step of forming a resist layer on a substrate, the resist layer including a first photosensitive resin layer, an intermediate resin layer, and a second photosensitive resin... | 04/20/2010 |
| 7700483 | Method for fabricating pixel structure A method for fabricating a pixel structure is provided. First, a substrate having an active device formed thereon is provided. The active device has a gate, a gate dielectric layer, and a semiconductor layer having a channel, a source, and a drain region. Then, a di... | 04/20/2010 |
| 7696088 | Manufacturing methods of metal wire, electrode and TFT array substrate A method of forming a gate line and gate electrode and a method of manufacturing a TFT array substrate. The metal gate line and gate electrode can be formed by: providing a substrate, forming a photoresist layer on the substrate, a photoresist pattern being formed c... | 04/13/2010 |
| 7566659 | Method of forming fine pattern of semiconductor device using SiGe layer as sacrificial layer, and method of forming self-aligned contacts using the same There are provided a method of forming a fine pattern of a semiconductor device using a silicon germanium sacrificial layer, and a method of forming a self-aligned contact using the same. The method of forming a self-aligned contact of a semiconductor device include... | 07/28/2009 |
| 7531454 | Method and apparatus of fabricating liquid crystal display device A method and an apparatus of fabricating a liquid crystal display device adapted to improve a lift-off efficiency are disclosed. The liquid crystal display device is also disclosed. The method includes forming a first thin film on a substrate; forming a photo-resist... | 05/12/2009 |
| 7319070 | Semiconductor device fabrication method In a conductive layer fabrication method, a lower resist layer (210) is formed on a semiconductor substrate. A water soluble resin layer (212) is formed over the lower resist layer. Heat treatment is performed so as to produce a cross-linking layer ( | 01/15/2008 |
| 7291446 | Method and system for treating a hard mask to improve etch characteristics During pattern transfer to a film stack, the hard mask layer, such as a tunable etch resistant antireflective coating (TERA), is consumed when etching the underling layer(s), leading to reduced etch performance and potential damage to the underlying layer(s), such a... | 11/06/2007 |
| 7273812 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 09/25/2007 |
| 7271038 | Methods of forming ruthenium film by changing process conditions during chemical vapor deposition and ruthenium films formed thereby A ruthenium (Ru) film is formed on a substrate as part of a two-stage methodology. During the first stage, the Ru film is formed on the substrate in a manner in which the Ru nucleation rate is greater than the Ru growth rate. During the second stage, the Ru film is ... | 09/18/2007 |
| 7253092 | Tungsten plug corrosion prevention method using water Disclosed herein is a method of making integrated circuits. In one embodiment the method includes forming tungsten plugs in the integrated circuit and forming electrically conductive interconnect lines in the integrated circuit after formation of the tungsten plugs.... | 08/07/2007 |
| 7241689 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 07/10/2007 |
| 7235884 | Local control of electrical and mechanical properties of copper interconnects to achieve stable and reliable via The present invention is a novel method whereby voids or solid opens at the bottom of via can be avoided without drastically altering the resistivity or parasitic capacitances of the whole metal interconnect system. The invention includes in one embodiment a process... | 06/26/2007 |
| 7220674 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same Formation of copper alloy interconnect lines on integrated circuits includes introducing dopant elements into a copper layer. Copper alloy interconnect lines may be formed by providing a doping layer over a copper layer, driving dopant material into the copper layer... | 05/22/2007 |
| 7220612 | Liquid crystal display device and fabricating method thereof A thin film transistor substrate and a fabricating method thereof for simplifying a process are disclosed. In a liquid crystal display device according to the present invention, a gate line is provided on a substrate. A data line crosses the gate line with having a ... | 05/22/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7214632 | Using selective deposition to form phase-change memory cells A phase-change memory cell may be formed by selectively depositing the lower electrode in the phase-change memory pore. Thereafter, an adhesion-promoting material may be selectively deposited on the selectively deposited lower electrode and the upper surface surroun... | 05/08/2007 |
| 7208411 | Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module A method of depositing a metal film on a substrate includes a supercritical preclean step, a supercritical desorb step, and a metal deposition step. Preferably, the preclean step comprises maintaining supercritical carbon dioxide and a chelating agent in contact wit... | 04/24/2007 |
| 7205228 | Selective metal encapsulation schemes A method and system of processing a semiconductor substrate includes, in one or more embodiments, depositing a protective layer on the substrate surface comprising a conductive element disposed in a dielectric material; processing the protective layer to expose the ... | 04/17/2007 |
| 7202156 | Process for manufacturing a wiring substrate A process for manufacturing a wiring substrate, comprising: a step of forming an insulating resin layer containing an inorganic filler over a wiring layer formed on at least one surface of an insulating substrate; a step of forming a thin copper film layer by roughe... | 04/10/2007 |
| 7172981 | Semiconductor integrated circuit device manufacturing method including static charge elimination A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container. An ionizer is used for static-charge-eliminating the semiconductor sub... | 02/06/2007 |
| 7140393 | Non-contact shuttle valve for flow diversion in high pressure systems A valve for redirecting flow in a supercritical fluid or other high pressure processing system is disclosed. In high pressure supercritical carbon dioxide (SCCO2) equipment for semiconductor wafer processing, a major hurtle in providing clean equipment and clean waf... | 11/28/2006 |
| 7138327 | Method of routing an electrical connection on a semiconductor device and structure therefor In one embodiment, conductors of a semiconductor device are routed to a contact platform of the semiconductor device by using electroless plating and screen-printing techniques. ... | 11/21/2006 |
| 7105384 | Circuit device manufacturing method including mounting circuit elements on a conductive foil, forming separation grooves in the foil, and etching the rear of the foil A circuit device manufacturing method is provided, wherein contaminants attached to the top surfaces of conductive patterns 21 are removed using plasma to thereby improve the adhesion of conductive patterns 21 to a sealing resin 28. By selective... | 09/12/2006 |
| 7105914 | Integrated circuit and seed layers Structures are provided which improve performance in integrated circuits. The structures include a diffusion barrier and a seed layer in an integrated circuit both formed using a low energy ion implantation followed by a selective deposition of metal lines for the i... | 09/12/2006 |
| 7092890 | Method for manufacturing thin GaAs die with copper-back metal structures A thin GaAs Substrate can be provided with a copper back-metal layer to allow the GaAs Substrate to be packaged using conventional plastic packaging technologies. By providing the GaAs Substrate with a copper back-metal layer, the GaAs Substrate can be made thinner ... | 08/15/2006 |
| 7087513 | Method to produce low strength temporary solder joints The present invention provides a method for producing a temporary chip carrier for semiconductor chip burn-in test and speed sorting. A multi-layered substrate or card, usually comprised of one of various materials is made by offsetting the conductor-filled vias or ... | 08/08/2006 |
| 7084001 | Method of forming film including a comb tooth patterning film Resist patterns (R11 and R12) are formed such that an opening between both the films is aligned to the position, where the source electrode (7) is formed, while the region on the N+-layer (5), where the drain electrode (8 | 08/01/2006 |
| 7067398 | Method of producing electronic circuit and electronic circuit According to an embodiment of the present invention, a method of producing an electronic circuit comprises printing first metal-containing resin particles which consist of at least a thermosetting resin and fine metal particles and second metal-containing resin part... | 06/27/2006 |
| 7056645 | Use of chromeless phase shift features to pattern large area line/space geometries Method for using chromeless phase shift lithography (CPL) masks to pattern large line/space geometries. The method comprises using light at a wavelength of one of 248 nm, 193 nm, or 157 nm to illumimate a CPL mask comprising a reticle having a plurality of phase-shi... | 06/06/2006 |
| 7056824 | Electronic device manufacture A method of manufacturing electronic devices containing one or more layers of materials that are sensitive to the strong chemicals used to remove cross-linked polymeric layers such as photoresists and antireflective coatings is provided. The cross-linked polymeric l... | 06/06/2006 |
| 7033936 | Process for making island arrays A method of fabricating electronic, optical or magnetic devices requiring an array of large numbers of small features in which regions defining individual features of the array are formed by the steps of: (a) depositing a very thin film of a highly soluble solid ont... | 04/25/2006 |
| 7005335 | Array of nanoscopic mosfet transistors and fabrication methods A nanoscopic transistor is made by forming an oxide layer on a semiconductor substrate, applying resist, patterning the resist using imprint lithography to form a pattern aligned along a first direction, applying a first ion-masking material over the pattern, select... | 02/28/2006 |
| 6989327 | Forming a contact in a thin-film device An aspect of the present invention is a method of forming a contact in a thin-film device. The method includes forming a liftoff stencil, depositing at least one material through the liftoff stencil, removing a portion of the liftoff stencil, forming a re-entrant pr... | 01/24/2006 |
| 6956098 | High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electro... | 10/18/2005 |
| 6946332 | Forming nanoscale patterned thin film metal layers The specification describes a contact printing technique for forming patterns of thin films with nanometer resolution over large areas. The procedure, termed here “nanotransfer printing (nTP)”, relies on tailored surface chemistries for transferring thin films, ... | 09/20/2005 |
| 6933232 | Method of reducing oxidation of metal structures by selectively implanting ions through a mask positioned above and not in contact with the substrate The present invention is generally directed to a method of reducing oxidation of metal structures using ion implantation, and a device constructed in accordance with the method. In one illustrative embodiment, the method comprises providing a semiconducting substrat... | 08/23/2005 |
| 6890853 | Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module A method of depositing a metal film on a substrate includes a supercritical preclean step, a supercritical desorb step, and a metal deposition step. Preferably, the preclean step includes maintaining supercritical carbon dioxide and a chelating agent in contact with... | 05/10/2005 |
