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| Number | Title | Issue Date |
| 8168464 | Microelectronic assembly with an embedded waveguide adapter and method for forming the same A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate (22) is provided. The semiconductor substrate (22) has first and second opposing sides (24, 26) and first and second portions ... | 05/01/2012 |
| 8084288 | Method of construction of CTE matching structure with wafer processing and resulting structure A method includes bonding a first side of a metal shim to a silicon shim, removing metal from the metal shim to form a plurality of cleared metal lanes in accordance with a pattern, bonding a readout integrated circuit having a plurality of saw lanes in accordance w... | 12/27/2011 |
| 7981718 | Method of manufacturing solid-state image pickup element, and solid-state image pickup element Disclosed herein is a method of manufacturing a solid-state image pickup element, the method including the steps of forming a plurality of photoelectric conversion elements within a semiconductor substrate; forming a wiring layer via an insulating film on a surface ... | 07/19/2011 |
| 7968366 | Image sensor and method for manufacturing the same An image sensor and method of manufacturing the same are provided. According to an embodiment, the image sensor comprises: a circuit including an interconnection on a substrate; a lower electrode on the interconnection; a separated intrinsic layer on the lower elect... | 06/28/2011 |
| 7803651 | Method of manufacturing solar cell module and method of manufacturing solar cell A method of manufacturing the solar cell module 100 according to the embodiment of the present invention includes: a step of forming the plurality of thin line-shaped electrodes and the connecting electrode connected to one end portion of each of the pluralit... | 09/28/2010 |
| 7785915 | Wafer level method of locating focal plane of imager devices A method is disclosed which includes providing an imager substrate comprised of at least one imager device, providing a transparent substrate, forming a plurality of standoff structures on one of the imager substrate and the transparent substrate, the standoff struc... | 08/31/2010 |
| 7759156 | Image sensor and method for manufacturing the same An image sensor can include a first substrate, an insulating layer, a photodiode, and a via plug. A circuitry including an interconnection can be formed on the first substrate. The insulating layer is formed over the first substrate so that the insulating layer cove... | 07/20/2010 |
| 7727793 | Physical quantity sensor and manufacturing method therefor A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a thickness direction by an angle ranging from 0° to 5° and are formed in... | 06/01/2010 |
| 7695996 | Photodetecting device A method of manufacturing a photodetecting device, by providing a first wafer that includes a photosensitive layer made of a semiconductor material and a second wafer that includes a circuit layer of electronic components, with one of the photosensitive layer or the... | 04/13/2010 |
| 7592197 | Image sensor chip package fabrication method An image sensor package method includes the steps of: first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an ... | 09/22/2009 |
| 7452745 | Photodetecting device A method of manufacturing a photodetecting device, by providing a first wafer that includes a photosensitive layer made of a semiconductor material and a second wafer that includes a circuit layer of electronic components, with one of the photosensitive layer or the... | 11/18/2008 |
| 7405487 | Method and apparatus for removing encapsulating material from a packaged microelectronic device A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a microelectronic substrate by directing a source of laser radiation toward the en... | 07/29/2008 |
| 7374962 | Method of fabricating reflective spatial light modulator having high contrast ratio The contrast offered by a spatial light modulator device may be enhanced by positioning nonreflective elements such as supporting posts and moveable hinges, behind the reflecting surface of the pixel. In accordance with one embodiment, the reflecting surface is susp... | 05/20/2008 |
| 7365442 | Encapsulation of thin-film electronic devices One embodiment of this invention pertains to multiple encapsulated thin-film electronic devices. These encapsulated devices include a substrate and multiple thin-film electronic devices are on this substrate. Each of the multiple thin-film electronic devices has an ... | 04/29/2008 |
| 7358109 | Surface emitting laser package having integrated optical element and alignment post A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches ca... | 04/15/2008 |
| 7341923 | Substrate, manufacturing method therefor, and semiconductor device A step of forming the first substrate which has a separation layer and a Ge layer on the separation layer, and a step of forming a bonded substrate stack by bonding the first substrate to the second substrate through an insulating layer, and a step of dividing the b... | 03/11/2008 |
| 7338884 | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device An interconnecting substrate for carrying a semiconductor device, comprising: an insulating layer; an interconnection set on an obverse surface of the insulating layer; an electrode which is set on a reverse surface side of the insulating layer and formed in such a ... | 03/04/2008 |
| 7335573 | Vehicle, display device and manufacturing method for a semiconductor device To provide a semiconductor device in which a layer to be peeled is attached to a base having a curved surface, and a method of manufacturing the same, and more particularly, a display having a curved surface, and more specifically a light-emitting device having a li... | 02/26/2008 |
| 7326590 | Method for manufacturing ball grid array package A method for manufacturing a ball grid array package includes the steps of providing a substrate strip having a plurality of sub-substrate strips wherein each has an upper surface and a lower surface, disposing a plurality of chips on the upper surfaces of the sub-s... | 02/05/2008 |
| 7303976 | Wafer bonding method One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sea... | 12/04/2007 |
| 7288428 | Solid state image pickup device and manufacturing method thereof and semiconductor integrated circuit device and manufacturing method thereof A method of manufacturing a solid-state image pickup device comprises a process for forming a plurality of photoelectric conversion elements PD within a semiconductor substrate 4, a process for forming an interconnection portion, having an interconnection lay... | 10/30/2007 |
| 7285434 | Semiconductor package and method for manufacturing the same A semiconductor package comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an active surface, a back surface opposite to the active surface, an optical component disposed on th... | 10/23/2007 |
| 7285439 | Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method A shielding case bank has shielding cases that arranged at a pitch twice as large as a pitch of molded articles in a molded article bank. Two shielding case banks are stacked one on the other with displacement from each other by half the pitch so that the shielding ... | 10/23/2007 |
| 7282190 | Silicon layer production method and solar cell production method A solar cell is produced by dipping a multicrystalline silicon substrate 28 in a solution 24 containing silicon, growing a silicon layer on the substrate 28 while decreasing with time the temperature drop rate of the solution during the dipping ... | 10/16/2007 |
| 7238583 | Back-illuminated imaging device and method of fabricating same A method for fabricating a back-illuminated semiconductor imaging device on a thin semiconductor-on-insulator substrate, and resulting imaging device. Resulting device has a monotonically varying doping profile which provides a desired electric field and eliminates ... | 07/03/2007 |
| 7238878 | Photovoltaic module with light reflecting backskin A photovoltaic module comprises electrically interconnected and mutually spaced photovoltaic cells that are encapsulated by a light-transmitting encapsulant between a light-transparent front cover and a back cover, with the back cover sheet being an ionomer/nylon al... | 07/03/2007 |
| 7235885 | Semiconductor device and method of manufacturing the same, circuit board and electronic device A semiconductor device includes a wiring board having a wiring pattern, a semiconductor chip that has an integrated circuit and is mounted on a first surface of the wiring board to electrically connect with the wiring pattern, a spacer that is disposed on a second s... | 06/26/2007 |
| 7223634 | Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus Exemplary embodiments of the present invention include a semiconductor device, a method for manufacturing the same, a circuit board and an electronic apparatus with increased productivity and reliability. An exemplary method for manufacturing a semiconductor device ... | 05/29/2007 |
| 7214116 | Light-emitting diode and method for its production A light-emitting diode with no fluctuations in optical properties and good sealing properties, and a simple production method for producing this light-emitting diode. The light-emitting diode has a base comprising a cup part on which the light-emitting diode is plac... | 05/08/2007 |
| 7195948 | Method for fabricating semiconductor device A method for fabricating a semiconductor device, comprising the steps of: forming an element on a silicon substrate; packaging the element; and annealing the packaged element before its transportation or long-term storage. ... | 03/27/2007 |
| 7187100 | Dimensions for a MEMS scanning mirror with ribs and tapered comb teeth A micro-electro-mechanical system (MEMS) mirror device includes an mirror, bonding pads, springs, and beams connected to the mirror. The mirror has a width greater than 1000 and less than 1200 microns, a length greater than 4000 and less than 5500 microns, and a thi... | 03/06/2007 |
| 7173232 | Light detection device and mounting method thereof A light detection device which can be stably surface-mounted on, for example, a circuit board or the like, and a mounting method thereof are provided. A light-receiving element includes, a transparent conductive electrode (first electrode), a semiconductor layer, an... | 02/06/2007 |
| 7163826 | Method of fabricating multi layer devices on buried oxide layer substrates A method for fabricating multi layer devices on a substrate with a buried oxide layer is disclosed. Multi layer microelectromechanical, microfluidic, and integrated circuit devices are fabricated on a substrate with layers of predetermined weak and strong bond regio... | 01/16/2007 |
| 7163864 | Method of fabricating semiconductor side wall fin A double gated silicon-on-insulator (SOI) MOSFET is fabricated by forming epitaxially grown channels, followed by a damascene gate. The double gated MOSFET features narrow channels, which increases current drive per layout width and provides low out conductance.... | 01/16/2007 |
| 7164183 | Semiconductor substrate, semiconductor device, and method of manufacturing the same A semiconductor device includes a porous layer, a structure which is formed on the porous layer and has a semiconductor region whose height of the sectional shape is larger than the width, and a strain inducing region which strains the structure by applying stress t... | 01/16/2007 |
| 7153720 | CMOS image sensor Light sensing devices are monolithically integrates with CMOS devices on Thin-Film Silicon-On-insulator (TF-SOI) or Thin-Film Germanium-On-Insulator (TF-GeOI) substrates. Photo-diode active layers are epitaxially grown on the front-side of the substrate and after fu... | 12/26/2006 |
| 7145219 | Vertical integrated circuits A method for fabricating a vertical integrated circuit is disclosed. Integrated circuits are fabricated on a substrate with layers of predetermined weak and strong bond regions where deconstructed layers of integrated circuits are fabricated at or on the weak bond r... | 12/05/2006 |
| 7138289 | Technique for fabricating multilayer color sensing photodetectors A multilayer color-sensing photodetector is fabricated in a semiconductor wafer having a single crystal structure to form a first, second and third layer of single crystal semiconductor material. A dielectric layer is formed that completely surrounds each single cry... | 11/21/2006 |
| 7129109 | Method for structuring an oxide layer applied to a substrate material The invention relates to a method for structuring an oxide layer applied to a substrate material. The aim of he invention is to provide an inexpensive method for structuring such an oxide layer. To this end, a squeegee paste that contains an oxide-etching component ... | 10/31/2006 |
| 7127793 | Method of producing solid state pickup device A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a ... | 10/31/2006 |
