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| Number | Title | Issue Date |
| 8187906 | Method for fabricating composite substances for thin film electro-optical devices A method is provided for producing an electro-optic device having at least one optically transparent conducting layer with low electrical resistance. The method includes providing a composite substrate that includes an optically transparent and electrically insulati... | 05/29/2012 |
| 8133753 | Solid-state image pickup device and method for manufacturing same In a solid-state image pick up device, a first conduction type semiconductor layer which has a first surface side. A second surface side which is located the opposite side of the first surface side and an image sensor area. A photo-conversion area which is configure... | 03/13/2012 |
| 8124439 | Method for making an optical device with integrated optoelectronic components A method for making an optical device with integrated optoelectronic components, including a) making a protective structure including a support in which at least one blind hole is made, an optical element being positioned in the blind hole, b) attaching the support ... | 02/28/2012 |
| 8119435 | Wafer level processing for backside illuminated image sensors A backside illuminated image sensor comprises a sensor layer having a plurality of photosensitive elements of a pixel array, an oxide layer adjacent a backside surface of the sensor layer, and at least one dielectric layer adjacent a frontside surface of the sensor ... | 02/21/2012 |
| 8105862 | Imager with tuned color filter An optimized color filter array is formed in, above or below one or more damascene layers. The color filter array includes filter regions which are configured to optimize the combined optical properties of the layers of the device to maximize the intensity of the pa... | 01/31/2012 |
| 8093091 | Photonic crystal-based lens elements for use in an image sensor The invention, in various exemplary embodiments, incorporates a photonic crystal lens element into an image sensor. The photonic crystal lens element comprises a substrate and a plurality of pillars forming a photonic crystal structure over the substrate. The pillar... | 01/10/2012 |
| 8003425 | Methods for forming anti-reflection structures for CMOS image sensors Protuberances, having vertical and lateral dimensions less than the wavelength range of lights detectable by a photodiode, are formed at an optical interface between two layers having different refractive indices. The protuberances may be formed by employing self-as... | 08/23/2011 |
| 7985613 | Method for manufacturing back side illumination image sensor A method of manufacturing a back side illumination image sensor is provided. The method can include forming an ion implantation layer in a front side of a first substrate, forming a photodetector and a readout circuit on the first substrate, forming an interlayer di... | 07/26/2011 |
| 7972889 | Methods of fabricating camera modules including aligning lenses on transparent substrates with image sensor chips Example embodiments may provide a camera module including a high-resolution lens member and/or an image sensor chip that may be integrally formed, and a method of fabricating a camera module. Example embodiment camera modules may include a semiconductor package incl... | 07/05/2011 |
| 7915068 | Method for making solar cells with sensitized quantum dots in the form of nanometer metal particles There is disclosed a method for making solar cells with sensitized quantum dots in the form of nanometer metal crystals. Firstly, a first substrate is provided. Then, a silicon-based film is grown on a side of the first substrate. A pattern mask process is executed ... | 03/29/2011 |
| 7910392 | Method and system for assembling a solar cell package Method and system for assembling a solar cell package. According to an embodiment, the present invention provides a method for fabricating solar cells for a solar panel. The method includes providing a first substrate member comprising a plurality of photovoltaic st... | 03/22/2011 |
| 7901973 | Solid state imaging device and manufacturing method thereof To a transparent substrate (20) on which a plurality of spacers (5) are formed, an infrared cut filter (IRCF) substrate (27) is attached. The IRCF substrate (27) has a coefficient of thermal expansion smaller than the transparent substrat... | 03/08/2011 |
| 7883924 | Method for producing a photovoltaic module using an IR laser For producing a photovoltaic module (1), the front electrode layer (3), the semi-conductor layer (4) and the back electrode layer (5) are patterned by separating lines (6, 7, 8) to form series-connected cells (C1, C... | 02/08/2011 |
| 7858428 | Method for forming a lens using sub-micron horizontal tip feature A method for creating graded or tapered dopant profiles in a semiconductor layer or layers. Preferably, a sub-micron horizontal tip feature is used to control the doping of the layer beneath the feature. ... | 12/28/2010 |
| 7829369 | Methods of forming openings Some embodiments include methods of forming openings in which a metal-containing structure is formed over a region of a semiconductor substrate. A patterned metal-containing material is formed over the metal-containing structure, with the metal-containing material h... | 11/09/2010 |
| 7795066 | Method for making camera modules and camera module made thereby A method for making lens modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens... | 09/14/2010 |
| 7767485 | Solid-state imaging device and method for manufacturing same An interconnect layer is formed on a lower face of a silicon wafer, a support substrate is adhered over a lower face of the interconnect layer, and a thickness reduction of the silicon wafer is performed from an upper face side. Next, a photodiode is formed in an up... | 08/03/2010 |
| 7723147 | Image sensor and method of manufacturing the same An image sensor and a method of manufacturing the same capable of improving image quality by preventing the generation of a lens bridge formed due to a mutual connection of neighboring microlenses. The image sensor can include a semiconductor substrate having a plur... | 05/25/2010 |
| 7678603 | Via wave guide with curved light concentrator for image sensing devices A CMOS image sensor (CIS) device includes an array of pixels, each pixel including a sensing element (e.g., a photodiode) and access circuitry. To facilitate the passage of light to the photodiode, each pixel includes a via wave guide (VWG) defined in the metallizat... | 03/16/2010 |
| 7659134 | Microelectronic imagers and methods for manufacturing such microelectronic imagers Microelectronic imagers and methods of manufacturing such microelectronic imagers are disclosed. In one embodiment, a method for manufacturing a microelectronic imager can include irradiating selected portions of an imager housing unit. The housing unit includes a b... | 02/09/2010 |
| 7638355 | Solid state image pickup device and method of producing solid state image pickup device Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for t... | 12/29/2009 |
| 7625775 | Multiple function thin-film resistor-capacitor array A multiple function thin-film resistor-capacitor array is used for an optical fiber receiving module. A dielectric thin film with desired pattern and thickness is form on surface of a silicon substrate by semiconductor manufacture process. Resistors of different res... | 12/01/2009 |
| 7615398 | Pyramidal photonic crystal light emitting device A light-emitting device (LED) is described which exhibits high extraction efficiency and an emission profile which is substantially more directional than from a Lambertian source. The device comprises a light generating layer disposed between first and second layers... | 11/10/2009 |
| 7608474 | Method for manufacturing optical element A method for manufacturing an optical element having a metal wire grid containing a plurality of metal wires on a substrate includes forming the metal wire grid using an electrolytic plating process. ... | 10/27/2009 |
| 7582503 | Solid state image pickup device and method of producing solid state image pickup device Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for t... | 09/01/2009 |
| 7575949 | Semiconductor photo-detector, semiconductor photo-detection device, and production method thereof In a semiconductor photo-detector of the present invention, a first semiconductor layer, a second semiconductor layer having, and a photo-absorption part composed of a photo-absorption layer sandwiched between these layers are disposed on a substrate, at least the p... | 08/18/2009 |
| 7531375 | Solid image-pickup device and method for manufacturing the solid image pickup device It is an object of the invention to provide an improved solid image-pickup device which is compact in size and low in production cost. The solid image-pickup device is so formed that its semiconductor substrate has on its surface an image-pickup area having a plural... | 05/12/2009 |
| 7528000 | Method of fabricating optical device caps A wafer having a plurality of through holes is provided, and a glass wafer is disposed on the wafer. A plate having a plurality of concave cavities is disposed on the glass wafer, wherein the concave cavities corresponding to the through holes of the wafer so that a... | 05/05/2009 |
| 7488616 | CMOS image sensor and method for manufacturing the same A CIS and a method for manufacturing the same are provided. The CIS includes an interlayer insulation layer formed on a substrate having a photodiode and a transistor formed thereon; a plurality of color filters formed on the interlayer insulation layer and spaced a... | 02/10/2009 |
| 7470559 | Semiconductor component comprising a buried mirror A method for forming a buried mirror in a semiconductor component includes the steps of forming a structure comprising a semiconductor layer laid on an insulating layer covering a substrate; forming one or several openings in the semiconductor layer emerging at the ... | 12/30/2008 |
| 7468289 | Solid-state imaging device and method for manufacturing the same A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can... | 12/23/2008 |
| 7456044 | Method for manufacturing image sensor A method of manufacturing an image sensor using a microlens mold is provided. The method includes: forming an interlayer dielectric layer on a semiconductor substrate having photodiodes; forming color filter layers on the interlayer dielectric layer; forming a plana... | 11/25/2008 |
| 7442975 | CMOS image sensor and method for fabricating the same A CMOS image sensor and a method for fabricating the same prevent a lifting effect of microlenses. Also, a diffused reflection of microlenses is prevented. The CMOS image sensor includes photodiodes, an interlayer insulating layer, metal lines formed in the interlay... | 10/28/2008 |
| 7427798 | Photonic crystal-based lens elements for use in an image sensor The invention, in various exemplary embodiments, incorporates a photonic crystal lens element into an image sensor. The photonic crystal lens element comprises a substrate and a plurality of pillars forming a photonic crystal structure over the substrate. The pillar... | 09/23/2008 |
| 7416912 | Method of fabricating CMOS image sensor A method of fabricating a CMOS image sensor is disclosed, by which image sensor characteristics are enhanced. In one aspect, the method includes forming a plurality of photodiodes in the photodiode region of a semiconductor substrate; stacking a first insulating lay... | 08/26/2008 |
| 7410816 | Method for forming a chamber in an electronic device and device formed thereby A method is disclosed for forming a chamber in an electronic device, including the steps of preparing an outer surface on a solidified core material, the solidified core material in a depression formed in a substrate. The method further includes establishing a layer... | 08/12/2008 |
| 7399997 | Semiconductor laser device and fabrication method thereof A semiconductor laser device aimed to be reduced in size and that can maintain high position accuracy, and a fabrication method of such a semiconductor laser device are achieved. A semiconductor laser device includes a stem as a base member, and a cap member. The st... | 07/15/2008 |
| 7390686 | CMOS image sensor and method for fabricating the same A CMOS image sensor and a method for fabricating the same are disclosed, in which light that transmits through a microlens is prevented from being beyond a photodiode region to minimize loss of incident light and to improve low illumination characteristics of the CM... | 06/24/2008 |
| 7391576 | Manufacturing of optical units for semiconductor packages with optical sensors An optical unit including a glass substrate supporting a diaphragm intended to receive a lens with a circular base, the surface of the diaphragm having one or several protruding elements for guiding the lens in horizontal positioning, and its manufacturing method. | 06/24/2008 |
| 7371614 | Image sensor device and methods thereof An image sensor device and methods thereof. In an example method, a protective layer may be formed over at least one microlens. An adhesive layer may be formed over the protective layer. The adhesive layer may be removed so as to expose the protective layer. The pro... | 05/13/2008 |
