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"What, sir, would you make a ship sail against the wind and currents by lighting a bonfire under her deck? I pray you, excuse me, I have not the time to listen to such nonsense."
Napoleon Bonaparte ; When told of the Robert Fulton steamboat
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| Number | Title | Issue Date |
| 8048708 | Method and apparatus providing an imager module with a permanent carrier Method and apparatus providing a wafer level fabrication of imager modules in which a permanent carrier protects imager devices on an imager wafer and is used to support a lens wafer. ... | 11/01/2011 |
| 8034651 | Light receiving device and method of manufacturing light receiving device A light receiving device 1 includes a support substrate 12 provided thereon with a photodetector 11 including a photodetecting portion 111 and a base substrate 112 on which the photodetecting portion 111 is placed; and a tra... | 10/11/2011 |
| 7998780 | Thinned image sensor with trench-insulated contact terminals The invention relates to the fabrication of thinned substrate image sensors, and notably color image sensors. After the fabrication steps carried out from the front face of a silicon substrate the front face is transferred onto a substrate. The silicon is thinned, a... | 08/16/2011 |
| 7947524 | Humidity control and method for thin film photovoltaic materials A method for processing a thin film photovoltaic module. The method includes providing a plurality of substrates, each of the substrates having a first electrode layer and an overlying absorber layer composed of copper indium gallium selenide (CIGS) or copper indium... | 05/24/2011 |
| 7939360 | Semiconductor device and manufacturing method therefor A semiconductor device which includes a semiconductor chip formed with a light-reception area, a spacer, and a transparent substrate. The spacer is bonded to the semiconductor chip via a first adhesive and surrounding the light-reception area. The transparent substr... | 05/10/2011 |
| 7939361 | Semiconductor device and method for fabricating semiconductor device Gold bumps are located over electrode pads of a solid imaging device and an adhesive is formed over the gold bumps. A transparent plate is supported by the gold bumps and is made to adhere over the solid imaging device by the adhesive. The gold bumps and an electrod... | 05/10/2011 |
| 7932121 | Semiconductor device and manufacturing method of the same A semiconductor device includes a semiconductor element, a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, a sealing member sealing an edge surface of the transparent member and an edge part of... | 04/26/2011 |
| 7919348 | Methods for protecting imaging elements of photoimagers during back side processing Methods for processing photoimagers include forming one or more protective layers over the image sensing elements of a photoimager. Protective layers may facilitate thinning of the substrates of photoimagers, as well as prevent contamination of the image sensing ele... | 04/05/2011 |
| 7906362 | Assembling two substrates by molecular adhesion An assembly method to enable local electrical bonds between zones located on a face of a first substrate and corresponding zones located on a face of a second substrate, the faces being located facing each other, at least one of the substrates having a surface topog... | 03/15/2011 |
| 7901972 | Camera module and method of manufacturing the same Provided is a method of manufacturing a camera module, the camera module including a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted; a holder assembly that is coupled to a lower e... | 03/08/2011 |
| 7867807 | Method for manufacturing photoelectric converting device The present invention relates to a manufacturing method of obtaining a photoelectric converting device which can sufficiently maintain airtightness of a housing space for photocathode without degradation of the characteristics of the photocathode. In accordance with... | 01/11/2011 |
| 7867806 | Electronic component structure and method of making An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments th... | 01/11/2011 |
| 7858427 | Crystalline silicon solar cells on low purity substrate A method is provided for making a crystalline silicon solar cell on a low purity substrate by depositing p+-p-n+, or n+-n-p+ layers of amorphous silicon, depending on the type of wafer, on a crystalline silicon substrate, such as an upgraded metallurgical grade sili... | 12/28/2010 |
| 7776640 | Image sensing device and packaging method thereof An image sensing device and a packaging method thereof is disclosed. The packaging method includes the steps of providing an adhesive layer; placing a substrate, having an opening, on the adhesive layer; disposing an image sensor within the opening on the adhesive l... | 08/17/2010 |
| 7759155 | Optical data transceivers An optical data transceiver is manufactured by forming an integrated control circuit (101) on a suitable substrate, such as a silicon wafer, and then mounting said integrated circuit (101) onto the lead frame (102). Electrical connections may th... | 07/20/2010 |
| 7749797 | Semiconductor device having a sensor chip, and method for producing the same A semiconductor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening... | 07/06/2010 |
| 7723146 | Integrated circuit package system with image sensor system An integrated circuit package system is provided including providing a wafer including image sensor systems having interconnects connected thereto and encapsulating the image sensor systems and interconnects in a transparent encapsulant. The system includes removing... | 05/25/2010 |
| 7691662 | Optical module producing method and apparatus An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the s... | 04/06/2010 |
| 7674649 | Radio frequency identification (RFID) tag lamination process using liner A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set. ... | 03/09/2010 |
| 7670866 | Multi-die molded substrate integrated circuit device One embodiment includes a substrate having a plurality of dies and a support frame made of molding material which is molded between adjacent dies so as to join together and support adjacent dies. The embodiment further has a plurality of interconnects formed on sele... | 03/02/2010 |
| 7651881 | Solid-state imaging device and method for manufacturing the same A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the tra... | 01/26/2010 |
| 7651882 | RFID tag circuit die with shielding layer to control I/O bump flow The present description describes back-end processes, the use of which may help overcome these problems and limitations of the prior art. In one optional embodiment, the back-end process includes depositing a layer over a wafer. The wafer contains a plurality of cir... | 01/26/2010 |
| 7648851 | Method of fabricating backside illuminated image sensor A method for fabricating a back-side illuminated image sensor includes providing a semiconductor substrate having a front surface and back surface, providing a plurality of transistors, metal interconnects, and metal pads on front surface of the substrate, bonding a... | 01/19/2010 |
| 7635606 | Wafer level package with cavities for active devices According to one exemplary embodiment, a method for forming a wafer level package includes fabricating an active device on a substrate in a semiconductor wafer, forming polymer walls around the active device, and applying a blanket film over the semiconductor wafer ... | 12/22/2009 |
| 7615397 | Micro-element package and manufacturing method thereof A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package ar... | 11/10/2009 |
| 7572665 | Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial substrate. A seed layer of the metal can be deposited on or over the a... | 08/11/2009 |
| 7553688 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 06/30/2009 |
| 7547571 | Packaging method of a light-sensing semiconductor device and packaging structure thereof The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly ap... | 06/16/2009 |
| 7534645 | CMOS type image sensor module having transparent polymeric encapsulation material A CMOS type of image sensor module for use in a mobile camera or a PC camera includes an image sensoring semiconductor chip encapsulated in a transparent block of polymeric material on a substrate having a circuit to which the ship is connected. The image sensoring ... | 05/19/2009 |
| 7524696 | Sensor including lead frame and method of forming sensor including lead frame A sensor includes a plurality of leads that have bottom surfaces extending in a first plane, a stage that extends in a second plane that tilts from the first plane, a sensor chip that is supported on the stage, a modified connection lead structure that supports the ... | 04/28/2009 |
| 7521279 | Image projection at different image planes An image projection module within a housing is operative for causing selected pixels in a raster pattern to be illuminated to produce an image at different image planes of VGA quality. A movable component on the housing causes the image to be formed at a selected im... | 04/21/2009 |
| 7510902 | Image sensor chip package and method of fabricating the same The present invention relates to an image sensor chip package and a method for fabricating the same. In one embodiment of an image sensor chip package, chip pads on a first surface of an image sensor chip are attached to electrode pads of a glass substrate with cond... | 03/31/2009 |
| 7491570 | Die package having an adhesive flow restriction area A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a transparent element with an adhesive flow restriction area formed as a plurali... | 02/17/2009 |
| 7465603 | Wafer level package structure of optical-electronic device and method for making the same A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a substrate whose surfaces have several optical sensitive areas and div... | 12/16/2008 |
| 7425750 | Snap lid camera module An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the moldin... | 09/16/2008 |
| 7422929 | Wafer-level packaging of optoelectronic devices In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket... | 09/09/2008 |
| 7419854 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 09/02/2008 |
| 7416913 | Methods of manufacturing microelectronic imaging units with discrete standoffs Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sens... | 08/26/2008 |
| 7417309 | Circuit device and portable device with symmetrical arrangement To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first bonding pad, and a second bonding pad; and a semiconductor element (TR) att... | 08/26/2008 |
| 7414661 | CMOS image sensor using gradient index chip scale lenses A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A proce... | 08/19/2008 |
