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| Number | Title | Issue Date |
| 7674649 | Radio frequency identification (RFID) tag lamination process using liner A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set. ... | 03/09/2010 |
| 7670866 | Multi-die molded substrate integrated circuit device One embodiment includes a substrate having a plurality of dies and a support frame made of molding material which is molded between adjacent dies so as to join together and support adjacent dies. The embodiment further has a plurality of interconnects formed on sele... | 03/02/2010 |
| 7651882 | RFID tag circuit die with shielding layer to control I/O bump flow The present description describes back-end processes, the use of which may help overcome these problems and limitations of the prior art. In one optional embodiment, the back-end process includes depositing a layer over a wafer. The wafer contains a plurality of cir... | 01/26/2010 |
| 7651881 | Solid-state imaging device and method for manufacturing the same A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the tra... | 01/26/2010 |
| 7648851 | Method of fabricating backside illuminated image sensor A method for fabricating a back-side illuminated image sensor includes providing a semiconductor substrate having a front surface and back surface, providing a plurality of transistors, metal interconnects, and metal pads on front surface of the substrate, bonding a... | 01/19/2010 |
| 7635606 | Wafer level package with cavities for active devices According to one exemplary embodiment, a method for forming a wafer level package includes fabricating an active device on a substrate in a semiconductor wafer, forming polymer walls around the active device, and applying a blanket film over the semiconductor wafer ... | 12/22/2009 |
| 7615397 | Micro-element package and manufacturing method thereof A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package ar... | 11/10/2009 |
| 7572665 | Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial substrate. A seed layer of the metal can be deposited on or over the a... | 08/11/2009 |
| 7553688 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 06/30/2009 |
| 7547571 | Packaging method of a light-sensing semiconductor device and packaging structure thereof The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly ap... | 06/16/2009 |
| 7534645 | CMOS type image sensor module having transparent polymeric encapsulation material A CMOS type of image sensor module for use in a mobile camera or a PC camera includes an image sensoring semiconductor chip encapsulated in a transparent block of polymeric material on a substrate having a circuit to which the ship is connected. The image sensoring ... | 05/19/2009 |
| 7524696 | Sensor including lead frame and method of forming sensor including lead frame A sensor includes a plurality of leads that have bottom surfaces extending in a first plane, a stage that extends in a second plane that tilts from the first plane, a sensor chip that is supported on the stage, a modified connection lead structure that supports the ... | 04/28/2009 |
| 7521279 | Image projection at different image planes An image projection module within a housing is operative for causing selected pixels in a raster pattern to be illuminated to produce an image at different image planes of VGA quality. A movable component on the housing causes the image to be formed at a selected im... | 04/21/2009 |
| 7510902 | Image sensor chip package and method of fabricating the same The present invention relates to an image sensor chip package and a method for fabricating the same. In one embodiment of an image sensor chip package, chip pads on a first surface of an image sensor chip are attached to electrode pads of a glass substrate with cond... | 03/31/2009 |
| 7491570 | Die package having an adhesive flow restriction area A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a transparent element with an adhesive flow restriction area formed as a plurali... | 02/17/2009 |
| 7465603 | Wafer level package structure of optical-electronic device and method for making the same A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a substrate whose surfaces have several optical sensitive areas and div... | 12/16/2008 |
| 7425750 | Snap lid camera module An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the moldin... | 09/16/2008 |
| 7422929 | Wafer-level packaging of optoelectronic devices In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket... | 09/09/2008 |
| 7419854 | Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a ... | 09/02/2008 |
| 7416913 | Methods of manufacturing microelectronic imaging units with discrete standoffs Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sens... | 08/26/2008 |
| 7417309 | Circuit device and portable device with symmetrical arrangement To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first bonding pad, and a second bonding pad; and a semiconductor element (TR) att... | 08/26/2008 |
| 7414661 | CMOS image sensor using gradient index chip scale lenses A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A proce... | 08/19/2008 |
| 7410820 | MEMS passivation with phosphonate surfactants Phosphonate surfactants are employed to passivate the surfaces of MEMS devices, such as digital micromirror devices. The surfactants are adsorbed from vapor or solution to form self-assembled monolayers at the device surface. The higher binding energy of the phospho... | 08/12/2008 |
| 7402453 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individua... | 07/22/2008 |
| 7402454 | Molded integrated circuit package with exposed active area An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may co... | 07/22/2008 |
| 7399997 | Semiconductor laser device and fabrication method thereof A semiconductor laser device aimed to be reduced in size and that can maintain high position accuracy, and a fabrication method of such a semiconductor laser device are achieved. A semiconductor laser device includes a stem as a base member, and a cap member. The st... | 07/15/2008 |
| 7390687 | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex an... | 06/24/2008 |
| 7384805 | Transfer mold semiconductor packaging processes In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of open... | 06/10/2008 |
| 7371603 | Method of fabricating light emitting diode package The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate ... | 05/13/2008 |
| 7371652 | Alignment using fiducial features The present invention relates to positioning components of an assembly using fiducial features. A first fiducial feature on a first piece of the assembly can be located. A first component can be positioned on the first piece of the assembly based on the location of ... | 05/13/2008 |
| 7371606 | Manufacturing method of a semiconductor device The yield of a sealing process for a semiconductor device which adopts a flip-chip mounting method is to be improved. In a molding process wherein plural semiconductor chip ICs mounted on a parts mounting surface of a substrate matrix through bump electrodes are to ... | 05/13/2008 |
| 7371602 | Semiconductor package structure and method for manufacturing the same A semiconductor package structure comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an optical component and a plurality of pads disposed on its active surface; pad extension ... | 05/13/2008 |
| 7368322 | Method for mounting a chip on a base and arrangement produced by this method An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnect... | 05/06/2008 |
| 7368758 | Method for hermetically housing optical components, and optical components produced according to said method A method is provided for producing a housing body for optoelectronic components that are reliable and inexpensive. The method creates a hermetic joint between a metal sleeve and a glass pane by joining together a housing element and a preferably metallic housing arr... | 05/06/2008 |
| 7368795 | Image sensor module with passive component An image sensor module includes a flexible printed circuit board having an upper surface, which is formed with electric circuits and a lower surface. A passive component is arranged on the upper surface of the circuit board. A substrate has a first surface, a second... | 05/06/2008 |
| 7365266 | Method and system for mounting photovoltaic material The present invention discloses a system and method for mounting a flexible material, such as a web of photovoltaic material, onto a surface, such as a roof. The system and method comprises providing a first and a second elongated web of flexible material and dispos... | 04/29/2008 |
| 7365442 | Encapsulation of thin-film electronic devices One embodiment of this invention pertains to multiple encapsulated thin-film electronic devices. These encapsulated devices include a substrate and multiple thin-film electronic devices are on this substrate. Each of the multiple thin-film electronic devices has an ... | 04/29/2008 |
| 7364684 | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are ... | 04/29/2008 |
| 7361525 | Semiconductor integrated device having solid-state image sensor packaged within and production method for same A semiconductor integrated device comprises: a light-shielding film which shields at least some part of a transfer section of the semiconductor integrated device from light; a first wiring formed in the same layer as the light-shielding film, with one end connected ... | 04/22/2008 |
| 7361983 | Semiconductor device and semiconductor assembly module with a gap-controlling lead structure In a semiconductor device (1), semiconductor elements (2) and (3) are mounted on a lead frame (5) having leads (4). The semiconductor elements (2) and (3) are connected with the leads (4) by metallic wires (... | 04/22/2008 |