Bizarre Patents
Mouse device with a built-in printer
A mouse device for use as an input device of a computer is provided that includes a housing in which recording paper is loadable, and a printer unit provided within the housing for printing on the recording paper print information received from the computer.
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| Number | Title | Issue Date |
| 8183079 | Semiconductor device and method of manufacturing the same A method of manufacturing a semiconductor device is disclosed. The method comprises: applying a sensing layer with variation in a secondary attribute according to heat, on a handle wafer; patterning the sensing layer, thus forming a cavity; forming a sensing part pa... | 05/22/2012 |
| 8173473 | Laser system for processing solar wafers in a carrier An apparatus and method for processing the solar cell substrates is provided. In one embodiment, a laser firing chamber for processing solar cell substrates placed in a carrier, comprising a laser module located at a side of the carrier, the laser module being adapt... | 05/08/2012 |
| 8030113 | Thermoelectric 3D cooling The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from ... | 10/04/2011 |
| 8021907 | Method and apparatus for thermally enhanced semiconductor package A semiconductor package includes a semiconductor die. Encapsulant is flowed around a portion of the semiconductor die. The encapsulant is etched and a conductive material is deposited into the etched portion of the encapsulant to form a thermally conductive structur... | 09/20/2011 |
| 8017424 | Dual-sided substrate measurement apparatus and methods An apparatus for measuring the relative positions of frontside and backside alignment marks located on opposite sides of a substrate is disclosed. The apparatus includes upper and lower optical systems that allow for simultaneous imaging of frontside and backside al... | 09/13/2011 |
| 7989249 | Method of manufacturing a micro-electrical-mechanical system with thermally isolated active elements A method of manufacturing a micro-electrical-mechanical system with thermally isolated active elements. Such a system may embody a bolometer, which is well suited for detecting electromagnetic radiation between 90 GHz and 30 THz while operating at room temperature. ... | 08/02/2011 |
| 7977138 | Optical device and method of manufacturing the same An optical device includes a semiconductor substrate (11) on which a light receiving part (12) (or a light emitting part) and electrodes (13) are formed, and a translucent plate (2) bonded on the light receiving part (12) with a tr... | 07/12/2011 |
| 7901971 | Method for manufacturing a sensor device with a stress relief layer A method for packaging a sensor device having a sensitive structure integrated on a semiconductor chip is provided. When molding the device package, an inward extending section of the mold maintains an access opening to the sensor. A buffer layer is arranged on the ... | 03/08/2011 |
| 7871848 | Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same Provided are a semiconductor power module package and a method of fabricating the same. The semiconductor power module package includes a substrate, semiconductor chips arranged on a top surface of the substrate, and a temperature sensor mounted on a top surface of ... | 01/18/2011 |
| 7871847 | System and method for high temperature compact thermoelectric generator (TEG) device construction A method for creating an array of thermoelectric elements includes applying a first coating of dielectric material to P-type wafers and N-type wafers to form coated P-type wafers and coated N-type wafers. A P/N-type ingot is formed from the coated P-type wafers and ... | 01/18/2011 |
| 7732242 | Composite board with semiconductor chips and plastic housing composition and method One aspect is a composite board including semiconductor chips in semiconductor device positions and a plastic housing composition partly embedding the semiconductor chips. A mould is provided for surrounding the semiconductor chips with plastic housing composition, ... | 06/08/2010 |
| 7585693 | Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method Method of forming a microelectronic package using control of die and substrate differential expansions. The method includes: providing a die-substrate combination including a substrate, a die disposed on the substrate, and plurality of solder paste disposed between ... | 09/08/2009 |
| 7563635 | Electronic device and method of manufacturing the same In the present invention, an etching hole 21 is formed in a polysilicon film 14 as a cavity-wall member. Through the etching hole 21, hydrofluoric acid is injected, so as to dissolve a silicon oxide film 13, thereby forming a cavity 22... | 07/21/2009 |
| 7537954 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive inter... | 05/26/2009 |
| 7439094 | Method of manufacturing a semiconductor package Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter... | 10/21/2008 |
| 7429497 | Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor A hybrid electronic circuit package (102, FIG. 1) includes non-insertable conductive features (110) and insertable conductive features (112) at a surface of the package. A hybrid receptacle (120), such as a socket, for example, inc... | 09/30/2008 |
| 7427532 | Method of manufacturing a device having a contacting structure According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component. ... | 09/23/2008 |
| 7427527 | Method for aligning devices A method is provided for aligning parts such as MEMS devices and photonics devices. One approach involves: providing between first and second parts a bonding material having fluid and solid states; applying a control field in the region of the bonding material, the ... | 09/23/2008 |
| 7417309 | Circuit device and portable device with symmetrical arrangement To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first bonding pad, and a second bonding pad; and a semiconductor element (TR) att... | 08/26/2008 |
| 7410820 | MEMS passivation with phosphonate surfactants Phosphonate surfactants are employed to passivate the surfaces of MEMS devices, such as digital micromirror devices. The surfactants are adsorbed from vapor or solution to form self-assembled monolayers at the device surface. The higher binding energy of the phospho... | 08/12/2008 |
| 7405103 | Process for fabricating chip embedded package structure A process for fabricating a chip embedded package structure is provided. A stiffener is disposed on a tape. A chip is disposed on the tape inside a chip opening of the stiffener such that an active surface of the chip faces the tape. Through holes are formed passing... | 07/29/2008 |
| 7393711 | Method of producing a digital fingerprint sensor and the corresponding sensor An embodiment of the present invention related to fingerprint sensors is described. The sensor comprises an integrated-circuit chip having a sensitive surface, a substrate provided with electrical connections and wire-bonding wires connecting the chip to the electri... | 07/01/2008 |
| 7384805 | Transfer mold semiconductor packaging processes In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of open... | 06/10/2008 |
| 7378294 | Wafer-level sealed microdevice having trench isolation and methods for making the same A microdevice (20) having a hermetically sealed cavity (22) to house a microstructure (26). The microdevice (20) comprises a substrate (30), a cap (40), an isolation layer (70), at least one conductive island (60 | 05/27/2008 |
| 7371606 | Manufacturing method of a semiconductor device The yield of a sealing process for a semiconductor device which adopts a flip-chip mounting method is to be improved. In a molding process wherein plural semiconductor chip ICs mounted on a parts mounting surface of a substrate matrix through bump electrodes are to ... | 05/13/2008 |
| 7355547 | Vehicle-mounted millimeter wave radar device, millimeter wave radar module, and manufacturing method thereof An object of the present invention is to provide a millimeter wave radar device and module that provides a hollow structure while assuring adequate moisture resistance. A multilayer substrate on which at least one millimeter wave MMIC is mounted and a cap for... | 04/08/2008 |
| 7351602 | Process for producing a thin film with MEMS probe circuits A process for producing a thin film with MEMS probe circuits by using semiconductor process technology comprises steps of providing a flatted process substrate; forming a separable interface on the flatted process substrate; forming a probe circuit thin film with el... | 04/01/2008 |
| 7348193 | Hermetic seals for micro-electromechanical system devices The invention is directed to a hermetically sealed device and a method for making such device. The device includes optical, micro-electromechanical, electronic and opto-electronic devices, having a substrate with one or a plurality of optical, opto-electronic, elect... | 03/25/2008 |
| 7329555 | Method of selectively forming MEMS-based semiconductor devices at the end of a common fabrication process Various semiconductor devices can be formed at the end of a common fabrication process, thereby significantly improving manufacturing flexibility, by selectively wiring bonding different CMOS circuits to different MEMS, which are formed on the same semiconductor die... | 02/12/2008 |
| RE39957 | Method of making semiconductor package with heat spreader A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least one chip on each of the chip carriers. A heat spreader module plate is... | 12/25/2007 |
| 7298027 | SMT three phase inverter package and lead frame A surface mounted package for semiconductor die has a lead frame with a first and elongated die pad which receives three MOSgated die spaced along its length; second, third and fourth die pads laterally spaced from the first die pad and in a row parallel to the firs... | 11/20/2007 |
| 7295421 | Multilayer ceramic electronic components and method for manufacturing the same A multilayer ceramic electronic component includes a skittered laminated body including internal electrodes that have a strength that is greater than that of ceramic layers provided therein. End portions of the internal electrodes protrude from end surfaces of the l... | 11/13/2007 |
| 7276393 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes providing a plurality of imaging dies on a microfeature workpiece. The individual ... | 10/02/2007 |
| 7276387 | Castellation wafer level packaging of integrated circuit chips Systems and methods for packaging integrated circuit chips in castellation wafer level packaging are provided. The active circuit areas of the chips are coupled to castellation blocks and, depending on the embodiment, input/output pads. The castellation blocks and i... | 10/02/2007 |
| 7268008 | Method for manufacturing pressure sensor A method for manufacturing a pressure sensor includes the steps of: preparing a semiconductor substrate; forming an insulation film on the substrate; forming a first metal film on the insulation film; forming a first protection film on the first metal film and the i... | 09/11/2007 |
| 7262079 | Consolidated flip chip BGA assembly process and apparatus A flip chip packaging technique and associated apparatus that consolidates many or all of the steps in a conventional flip chip packaging process results in substantially decreased packaging time, e.g., only one to two hours, complexity, e.g., requiring fewer pieces... | 08/28/2007 |
| 7261003 | Flowmeter and method for the making thereof A flowmeter is provided that comprises a leadframe assembly (140) and a body (144) disposed at least partially around the leadframe assembly (140). The body (144) has a flow passage therethrough that comprises a first channel (178)... | 08/28/2007 |
| 7262074 | Methods of fabricating underfilled, encapsulated semiconductor die assemblies An apparatus and method may be used for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective bond. The semiconductor die is attached to the carrier substrate with... | 08/28/2007 |
| 7259037 | Method of fabricating an X-ray detector array element A method of fabricating an X-ray detector array element. A gate and a gate insulation layer are formed on a substrate. A silicon island is formed on the insulation layer in a transistor area. A common line is formed on the insulation layer, simultaneously; source an... | 08/21/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
