Did You Know...
...that a workman who left the soap mixing machine on too long was responsible for making Ivory Soap? He was so embarrassed by his mistake that he threw the mess in a stream. Imagine his dismay when the evidence of his error floated to the surface! Result: Ivory soap, the soap that floats.
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| Number | Title | Issue Date |
| 8105859 | In via formed phase change memory cell with recessed pillar heater A method for fabricating a phase change memory device including a plurality of in via phase change memory cells includes forming pillar heaters formed of a conductive material along a contact surface of a substrate corresponding to each of an array of conductive con... | 01/31/2012 |
| 8101449 | Process for altering thermoelectric properties of a material A process for altering the thermoelectric properties of an electrically conductive material is provided. The process includes providing an electrically conducting material and a substrate. The electrically conducting material is brought into contact with the substra... | 01/24/2012 |
| 8067260 | Fabricating sub-lithographic contacts A small critical dimension element, such as a heater for an ovonic unified memory, may be formed within a pore by using successive sidewall spacers. The use of at least two successive spacers enables the limitations imposed by lithography and the limitations imposed... | 11/29/2011 |
| 8067259 | Method of producing high performance photovoltaic and thermoelectric nanostructured bulk and thin films Embodiments of the invention provide methods of forming photovoltaic or thermoelectric materials, including photovoltaic or thermoelectric films. In one embodiment, the invention provides a method of forming a photovoltaic material, the method comprising: depositing... | 11/29/2011 |
| 7888155 | Phase-change memory element and method for fabricating the same A phase-change memory element is provided. The phase-change memory element includes: a first electrode formed on a substrate; a first dielectric layer, with an opening, formed on the first electrode, wherein the opening exposes a top surface of the first electrode; ... | 02/15/2011 |
| 7867804 | Semiconductor device and method for fabricating the same A semiconductor device that includes a phase change material for protecting the device from failure caused by overheating. The semiconductor device is adapted to detect a rapid increase in current due to heat and also adapted to break a circuit in the detected rapid... | 01/11/2011 |
| 7833816 | Forming a thin film thermoelectric cooler and structures formed thereby Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a first plurality of openings through a first surface of a substrate, forming a p-type TFTEC material within the first plurality of openings, forming a second ... | 11/16/2010 |
| 7754517 | Method for manufacturing infrared detecting device A semiconductor layer is prepared in which a silicon substrate, a BOX layer and an SOI layer are laminated in this order. A silicon diode section used as an infrared detection portion is formed in the SOI layer. Further, an isolation portion is formed so as to exten... | 07/13/2010 |
| 7754516 | Fabricating sub-lithographic contacts A small critical dimension element, such as a heater for an ovonic unified memory, may be formed within a pore by using successive sidewall spacers. The use of at least two successive spacers enables the limitations imposed by lithography and the limitations imposed... | 07/13/2010 |
| 7749792 | Self-assembling MEMS devices having thermal actuation The present disclosure is broadly directed to a method for designing new MEMS micro-movers, particularly suited for, but not limited to, CMOS fabrication techniques, that are capable of large lateral displacement for tuning capacitors, fabricating capacitors, self-a... | 07/06/2010 |
| 7749793 | Method for fabricating lateral-moving micromachined thermal bimorph A method of making a Lateral-Moving Micromachined Thermal Bimorph which provides the capability of achieving in-plane thermally-induced motion on a microchip, as opposed to the much more common out-of-plane, or vertical, motion seen in many devices. The present inve... | 07/06/2010 |
| 7695994 | Material sidewall deposition method A method of forming a layer of material on a sidewall of a via with good thickness control. The method involves forming a layer of material with a conventional deposition process. The material formed on a field region surrounding the via is removed with a sputter et... | 04/13/2010 |
| 7585692 | Thin film layer, heating electrode, phase change memory including thin film layer and methods for forming the same A thin film layer, a heating electrode, a phase change memory including the thin film layer, and methods for forming the same. The method of forming the thin film layer by atomic layer deposition (ALD) may include injecting a titanium (Ti) source, a nitrogen (N) sou... | 09/08/2009 |
| 7572662 | Method of fabricating phase change RAM including a fullerene layer A method of fabricating a phase change RAM (PRAM) having a fullerene layer is provided. The method of fabricating the PRAM may include forming a bottom electrode, forming an interlayer dielectric film covering the bottom electrode, and forming a bottom electrode con... | 08/11/2009 |
| 7510895 | Inferential temperature control system A system manages the temperature of thermoplastic material by initiating a default heating cycle in response to a sensor failure. The system may thus continue to heat the thermoplastic material according to the default heating cycle until the sensor can be repaired ... | 03/31/2009 |
| 7432123 | Methods of manufacturing high temperature thermistors A method of manufacturing high temperature thermistors. A polycrystalline thermistor body is formed from a material selected from a list consisting of bulk polycrystalline Si with intrinsic conductivity and bulk polycrystalline Ge with intrinsic conductivity. At lea... | 10/07/2008 |
| 7425750 | Snap lid camera module An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the moldin... | 09/16/2008 |
| 7413920 | Double-sided etching method using embedded alignment mark A double-sided etching method using an embedded alignment mark includes: preparing a substrate having first and second alignment marks embedded in an intermediate portion thereof; etching an upper portion of the substrate so as to expose the first alignment mark fro... | 08/19/2008 |
| 7405457 | High temperature thermistors A high temperature NTC thermistor includes a polycrystalline thermistor body, selected from a list consisting of polycrystalline Si with intrinsic conductivity and polycrystalline Ge with intrinsic conductivity. At least one ohmic contact is disposed on at least one... | 07/29/2008 |
| 7399997 | Semiconductor laser device and fabrication method thereof A semiconductor laser device aimed to be reduced in size and that can maintain high position accuracy, and a fabrication method of such a semiconductor laser device are achieved. A semiconductor laser device includes a stem as a base member, and a cap member. The st... | 07/15/2008 |
| 7382034 | Optoelectronic component having a conductive contact structure The invention relates to an optoelectronic component for converting electromagnetic radiation into an intensity-dependent photoelectric current. The component includes one substrate which is formed especially according to CMOS technology. The substrate has an integr... | 06/03/2008 |
| 7376852 | Method for controlling power change for a semiconductor module The present invention provides a method for controlling power change for a semiconductor module. Specifically, under the present invention power is applied to, or removed from a semiconductor module between a lower power state such as a zero power, nap or sleep stat... | 05/20/2008 |
| 7362197 | Temperature compensation for silicon MEMS resonator Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion ... | 04/22/2008 |
| 7354786 | Sensor element with trenched cavity A micromechanical sensor element and a method for the production of a micromechanical sensor element that is suitable, for example in a micromechanical component, for detecting a physical quantity. Provision is made for the sensor element to include a substrate, an ... | 04/08/2008 |
| 7351602 | Process for producing a thin film with MEMS probe circuits A process for producing a thin film with MEMS probe circuits by using semiconductor process technology comprises steps of providing a flatted process substrate; forming a separable interface on the flatted process substrate; forming a probe circuit thin film with el... | 04/01/2008 |
| 7349762 | Systems and methods for thermal management Systems and methods for sensing temperatures of multiple functional blocks within a digital device and controlling the operation of these functional blocks in a manner that selectively reduces temperatures associated with some of the functional blocks, but not other... | 03/25/2008 |
| 7309830 | Nanostructured bulk thermoelectric material A thermoelectric material comprises two or more components, at least one of which is a thermoelectric material. The first component is nanostructured, for example as an electrically conducting nanostructured network, and can include nanowires, nanoparticles, or othe... | 12/18/2007 |
| 7306967 | Method of forming high temperature thermistors A method of manufacturing high temperature thermistors from an ingot. The high temperature thermistors can be comprised of germanium or silicon. The high temperature thermistors have at least one ohmic contact. ... | 12/11/2007 |
| 7303997 | Regionally thinned microstructures for microbolometers Microbolometers with regionally thinned microbridges are produced by depositing a thin film (0.6 μm) of silicon nitride on a silicon substrate, forming microbridges on the substrate, etching the thin film to define windows in a pixel area, thinning the windows, rel... | 12/04/2007 |
| 7294836 | Thermal electromagnetic radiation detector comprising an absorbent membrane fixed in suspension The absorbent membrane of the detector is fixed in suspension by at least one thermally insulating support part onto a front face of a substrate comprising at least two electric connection terminals electrically connected to the membrane, for example by means of con... | 11/13/2007 |
| 7282384 | Thermoelectric transducing material thin film, sensor device, and its manufacturing method The present invention provides an SiGe-based thin film, a method for manufacturing this thin film, and applications of this thin film. The present invention relates to a method for producing, by sputtering, an SiGe-based semiconductor thin film to serve as a member ... | 10/16/2007 |
| 7276277 | Micromechanical component, in particular a sensor element, having a stabilized membrane and a method of producing such a component A micromechanical component and a method of producing same are described; the component has a supporting body, in particular a silicon body, and a membrane which is connected to the supporting body and is unsupported at least in some areas. The membrane is also prov... | 10/02/2007 |
| 7268008 | Method for manufacturing pressure sensor A method for manufacturing a pressure sensor includes the steps of: preparing a semiconductor substrate; forming an insulation film on the substrate; forming a first metal film on the insulation film; forming a first protection film on the first metal film and the i... | 09/11/2007 |
| 7268350 | Bolometric detector with thermal isolation by constriction and device for detecting infrared radiation that uses such a bolometric detector A bolometric detector including an absorbing part intended to convert incident electromagnetic radiation into calories, an active part (2) including a sensitive area made of a bolometric material the resistivity of which varies, in a known manner, with temper... | 09/11/2007 |
| 7268646 | Temperature controlled MEMS resonator and method for controlling resonator frequency There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical reso... | 09/11/2007 |
| 7261461 | Measuring and trimming circuit components embedded in micro-platforms There is described a method and sub-circuit to measure temperature coefficients (coefficient of variation of a measurable parameter of the component), by using a thermally-isolated silicon micro-platform with a mass of mono-crystalline silicon suspended from it. The... | 08/28/2007 |
| 7239002 | Integrated circuit device In a temperature sensor section of a semiconductor integrated circuit device, first vias of tungsten are formed at the topmost layer of a multi-layer wiring layer and pads of titanium are provided on regions of the multi-layer wiring layer which covers the vias. An ... | 07/03/2007 |
| 7233000 | Low power silicon thermal sensors and microfluidic devices based on the use of porous sealed air cavity technology or microchannel technology This invention provides a miniaturized silicon thermal flow sensor with improved characteristics, based on the use of two series of integrated thermocouples (6, 7) on each side of a heater (4), all integrated on a porous silicon membrane (2) on ... | 06/19/2007 |
| 7229694 | Micromechanical component and method for producing an anti-adhesive layer on a micromechanical component A micromechanical component includes an anti-adhesive layer, formed from at least one fluorine-containing silane, applied to at least parts of its surface for reducing surface forces. To increase mechanical and thermal load capacity, the anti-adhesive layer is provi... | 06/12/2007 |
| 7205231 | Method for in-situ uniformity optimization in a rapid thermal processing system The present invention is directed to a method for thermally processing a substrate in a thermal processing system. The method provides an amount of heat to the substrate and obtains information associated with the substrate when the amount of heat is provided. For e... | 04/17/2007 |
