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A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 8173472 | Semiconductor sensor and manufacturing method of sensor body for semiconductor sensor A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L1 of a weight portion 5 and an additional weight portion 3 as measured in an exte... | 05/08/2012 |
| 8173471 | Method for fabricating micro-electro-mechanical system (MEMS) device A method for fabricating MEMS device includes providing a substrate having a first side and a second side. Then, a structural dielectric layer is formed over the substrate at the first side, wherein a structural conductive layer is embedded in the structural dielect... | 05/08/2012 |
| 8163586 | Method of producing a suspended membrane device A method for producing a device with at least one suspended membrane, including the following steps: Producing a trench through a first sacrificial layer and a second layer deposited on the first sacrificial layer, the trench completely surrounding at least a portio... | 04/24/2012 |
| 8114700 | Method of fabricating an ultra-small condenser microphone In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed... | 02/14/2012 |
| 8093088 | Manufacturing method of micro-electro-mechanical device A method of forming a microstructure body and a semiconductor element for controlling the microstructure body over the same substrate to reduce manufacturing cost, for mass-production of micromachines having a microstructure. In manufacturing a micromachine, a sacri... | 01/10/2012 |
| 8053267 | Three-dimensional force input control device and fabrication The present invention provides three-dimensional force input control devices for use in sensing vector forces and converting them into electronic signals for processing, and methods of fabricating three-dimensional force input control devices for sensing vector forc... | 11/08/2011 |
| 8026121 | Method for producing electronic components and pressure sensor A method produces electronic components in particular electronic sensors for pressure and differential pressure measurement. Firstly, the semiconductor structure of the electronic components is produced on a wafer. An insulating oxide layer is then applied. A protec... | 09/27/2011 |
| 8003422 | Micro-electro-mechanical system device and method for making same According to the present invention, a micro-electro-mechanical system (MEMS) device comprises: a thin film structure including at least a metal layer and a protection layer deposited in any order; and a protrusion connected under the thin film structure. A preferred... | 08/23/2011 |
| 7998777 | Method for fabricating a sensor A method for fabricating a sensor is disclosed that in one embodiment bonds a first device wafer to an etched second device wafer to create a suspended structure, the flexure of which is determined by an embedded sensing element that is in electrical communication w... | 08/16/2011 |
| 7998776 | Methods for manufacturing MEMS sensor and thin film thereof with improved etching process A method for manufacturing a MEMS sensor and a thin film thereof includes steps of etching a top surface of a single-crystal silicon wafer in combination of a deposition process, an isotropic DRIE process, a wet etching process and a back etching process in order to... | 08/16/2011 |
| 7977137 | Latching zip-mode actuated mono wafer MEMS switch method A process for making a latching zip-mode actuated mono wafer MEMS switch especially suited to capacitance coupled signal switching of microwave radio frequency signals is disclosed. The single wafer fabrication process used for the switch employs sacrificial layers ... | 07/12/2011 |
| 7951636 | Method for fabricating micro-electro-mechanical system (MEMS) device A micro-electro-mechanical system (MEMS) device includes a substrate, having a first side and second side, the second side has a cavity and a plurality of venting holes in the substrate at the second side with connection to the cavity. However, the cavity is include... | 05/31/2011 |
| 7943413 | Vibration sensor and method for manufacturing the vibration sensor A method for manufacturing a vibration sensor including forming a sacrifice layer at one part of a front surface of a semiconductor substrate of monocrystalline silicon with a material isotropically etched by an etchant for etching the semiconductor substrate, formi... | 05/17/2011 |
| 7932118 | Method of producing mechanical components of MEMS or NEMS structures made of monocrystalline silicon A mechanical component production method of a MEMS/NEMS structure from a monocrystalline silicon substrate includes forming anchoring zones in one face of the substrate. A lower protective layer, non-silicon, obtained by epitaxy from the face of the substrate is for... | 04/26/2011 |
| 7932117 | Pressure sensor and manufacturing method therefor A pressure sensor (e.g., a condenser microphone) includes a plate having a fixed electrode, a diaphragm having a moving electrode positioned opposite to the fixed electrode, and a support, wherein the diaphragm is subjected to displacement due to pressure variations... | 04/26/2011 |
| 7883919 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a shee... | 02/08/2011 |
| 7875485 | Methods of fabricating MEMS devices having overlying support structures Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in th... | 01/25/2011 |
| 7863071 | Combined micro-electro-mechanical systems device and integrated circuit on a silicon-on-insulator wafer The present invention includes a fabrication method to construct a combined MEMS device and IC on a silicon-on-insulator (SOI) wafer (MEMS-IC) using standard foundry IC processing techniques. The invention also includes the resulting MEMS-IC. Deposition layers are a... | 01/04/2011 |
| 7863072 | Micromechanical diaphragm sensor having a double diaphragm A method for producing a micromechanical diaphragm sensor, and a micromechanical diaphragm sensor produced with the method. The micromechanical diaphragm sensor has at least one first diaphragm as well as a second diaphragm, which is disposed essentially on top of t... | 01/04/2011 |
| 7858424 | Method for manufacturing a sensor array including a monolithically integrated circuit A method for producing a sensor array including a monolithically integrated circuit is described as well as a sensor array. This sensor array has a micromechanical sensor structure, in which a first partial structure which is associated with the sensor structure is ... | 12/28/2010 |
| 7855095 | Method of fabricating an ultra-small condenser microphone In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed... | 12/21/2010 |
| 7851247 | Method of fabricating micro-electromechanical system microphone structure A method of fabricating a micro-electromechanical system microphone structure is disclosed. First, a substrate defining a MEMS region and a logic region is provided, and a surface of the substrate has a dielectric layer thereon. Next, at least one metal interconnect... | 12/14/2010 |
| 7851248 | Method for producing a micromechanical component having a thin-layer capping A capping technology is provided in which, despite the fact that structures which are surrounded by a silicon-germanium filling layer are exposed using ClF3 etching through micropores in the silicon cap, an etching attack on the silicon cap is prevented, ... | 12/14/2010 |
| 7838321 | Multiple stage MEMS release for isolation of similar materials This describes a starting structure and method for forming a micro-mechanical device. These devices have several uses in both government and commercial applications. The starting structure can be sold or supplied to others who will then make a final product, or it c... | 11/23/2010 |
| 7838323 | Method for fabricating semiconductor device A method for fabricating a semiconductor device includes: the step (a) of forming a vibrating film on a predetermined region of each of a plurality of chips included in a semiconductor wafer; the step (b) of forming, on the semiconductor wafer, an intermediate film ... | 11/23/2010 |
| 7838322 | Method of enhancing an etch system Systems and techniques for enhanced etch processes. For example, a substrate may be received in an etch chamber, where the substrate comprises a handle layer, a bonding layer in communication with the handle layer, and a device layer in communication with the bondin... | 11/23/2010 |
| 7829366 | Microelectromechanical systems component and method of making same A microelectromechanical systems (MEMS) component 20 includes a portion 32 of a MEMS structure 30 formed on a semiconductor substrate 34 and a portion 36 of the structure 30 formed in a non-semiconductor substrate 22.... | 11/09/2010 |
| 7820470 | Manufacturing method of micro-electro-mechanical device A method of forming a microstructure body and a semiconductor element for controlling the microstructure body over the same substrate to reduce manufacturing cost, for mass-production of micromachines having a microstructure. In manufacturing a micromachine, a sacri... | 10/26/2010 |
| 7820469 | Stress-controlled dielectric integrated circuit General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 10/26/2010 |
| 7795062 | Method of forming a pressure switch thin film device This invention provides a method of forming at least one pressure switch thin film device. The method includes providing a substrate and depositing a plurality of thin film device layers as a stack upon the substrate. An imprinted 3D template structure is provided u... | 09/14/2010 |
| 7795063 | Micro-electro-mechanical systems (MEMS) device and process for fabricating the same A micro-electro-mechanical systems (MEMS) device includes a back-plate substrate, having an intended region formed with a plurality of perforating holes. A first structural dielectric layer, disposed on the back-plate substrate, wherein the dielectric layer having a... | 09/14/2010 |
| 7785913 | System and method for forming moveable features on a composite substrate A method for forming moveable features suspended over a substrate is described, wherein a cavity beneath the moveable feature is first formed using a liquid etchant applied through one or more release holes. After formation of the cavity, the outline of the moveable... | 08/31/2010 |
| 7713772 | Micromechanical flow sensor with tensile coating A sensor integrated on a semiconductor device (1), in particular a flow sensor, comprises a measuring element (2) on a membrane (5). In order to prevent a buckling of the membrane (5) a tensile coating (9) is applied. The coating c... | 05/11/2010 |
| 7713771 | Pressure sensor A differential pressure sensor includes a micro-electromechanical sensor die fabricated as a plurality of sensor die sites on a semiconductor wafer, and then singularized, the sensor die having a top face surface including die electrical output pads exposed to a fir... | 05/11/2010 |
| 7709285 | Method of manufacturing a MEMS device and MEMS device A method for manufacturing a micro-electromechanical systems (MEMS) device, comprising providing a base layer (10) and a mechanical layer (12) on a substrate (14), providing a sacrificial layer (16) between the base layer (10) and ... | 05/04/2010 |
| 7704774 | Pressure sensor having a chamber and a method for fabricating the same A pressure sensor is manufactured by joining two wafers, the first wafer comprising CMOS circuitry and the second being an SOI wafer. A recess is formed in the top material layer of the first wafer, which is covered by the silicon layer of the second wafer to form a... | 04/27/2010 |
| 7687298 | Microelectromechanical device with integrated conductive shield A microelectromechanical device and method of fabricating the same, including a layer of patterned and deposited metal or mechanical-quality, doped polysilicon inserted between the appropriate device element layers, which provides a conductive layer to prevent the m... | 03/30/2010 |
| 7670861 | Controlling stress in MEMS structures The objects of the present invention are to form MEMS structures of which stress is controlled while maintaining the performance of high-performance LSI, to integrate MEMS Structures and LSI on a single chip, to electrically and chemically protect the MEMS structure... | 03/02/2010 |
| 7645627 | Method for manufacturing a sensor device A motion sensor in the form of an angular rate sensor and a method of making a sensor are provided and includes a support substrate and a silicon sensing ring supported by the substrate and having a flexive resonance. Drive electrodes apply electrostatic force on th... | 01/12/2010 |
| 7638350 | Fingerprint sensors using membrane switch arrays A method of making an integrated texture sensor for sensing a texture is described. In one embodiment, the method is directed to a sensor that that is protected from external contaminating particulates and will self-equalize using air from outside the sensor. Furthe... | 12/29/2009 |
