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| Number | Title | Issue Date |
| 8187903 | Method of epitaxially growing piezoresistors A method of forming a device with a piezoresistor is disclosed herein. In one embodiment, the method includes providing a substrate, etching a trench in the substrate to form a vertical wall, growing a piezoresistor layer epitaxially on the vertical wall, and separa... | 05/29/2012 |
| 8183078 | Device with integrated circuit and encapsulated N/MEMS and method for production A method for producing a device including at least one integrated circuit and at least one N/MEMS. The method produces the N/MEMS in at least one upper layer arranged at least above a first section of a substrate, produces the integrated circuit in a second section ... | 05/22/2012 |
| 8163584 | Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure The beam bending of a MEMS device is minimized by reducing interfacial strength between a sacrificial layer and a MEMS structure. ... | 04/24/2012 |
| 8163585 | Method for manufacturing a sensor element, and sensor element A method for manufacturing a capped sensor element by providing a substrate with a sensor structure, the sensor structure being produced in the substrate using a sacrificial material, applying a cap made of zeolite to the sensor structure and the sacrificial materia... | 04/24/2012 |
| 8138007 | MEMS device with stress isolation and method of fabrication A MEMS device (20) with stress isolation includes elements (28, 30, 32) formed in a first structural layer (24) and elements (68, 70) formed in a second structural layer (26), with the layer (26) being spaced apart from the ... | 03/20/2012 |
| 8138008 | Forming an oxide MEMS beam Solutions for forming a semiconductor including an oxide MEMS beam are disclosed. In one embodiment, a method of forming a beam within a sealed cavity includes: depositing a lower insulator layer comprising one or more layers; depositing an upper insulator layer ove... | 03/20/2012 |
| 8119432 | Method and apparatus for MEMS oscillator A resonator includes a CMOS substrate having a first electrode and a second electrode. The CMOS substrate is configured to provide one or more control signals to the first electrode. The resonator also includes a resonator structure including a silicon material laye... | 02/21/2012 |
| 8114699 | Integration manufacturing process for MEMS device A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) for... | 02/14/2012 |
| 8114698 | High light extraction efficiency nitride based light emitting diode by surface roughening A III-nitride light emitting diode (LED) and method of fabricating the same, wherein at least one surface of a semipolar or nonpolar plane of a III-nitride layer of the LED is textured, thereby forming a textured surface in order to increase light extraction. The te... | 02/14/2012 |
| 8097483 | Manufacturing a MEMS element having cantilever and cavity on a substrate Method for manufacturing a capacitor on a substrate, the capacitor including a first electrode (5) and a second electrode (12; 25), the first and second electrodes being separated by a cavity (16; 32), the substrate including an insulating surfa... | 01/17/2012 |
| 8084285 | Forming a micro electro mechanical system A method of forming a micro-electro mechanical system (MEMS), includes (1) removing material from a first wafer to define a first movable portion corresponding to an x-y accelerometer and a second movable portion corresponding to a z accelerometer, where each movabl... | 12/27/2011 |
| 8076169 | Method of fabricating an electromechanical device including at least one active element The invention relates to a method of fabricating an electromechanical device including an active element, wherein the method comprises the following steps: a) making a monocrystalline first stop layer on a monocrystalline layer of a first substrate; b)... | 12/13/2011 |
| 8053265 | Mitigation of high stress areas in vertically offset structures Alternative methods of constructing a vertically offset structure are disclosed. An embodiment includes forming a flexible layer having first and second end portions, an intermediate portion coupling the first and second portions, and upper and lower surfaces. The d... | 11/08/2011 |
| 8053266 | Piezo-diode cantilever MEMS fabrication method A piezo thin-film diode (piezo-diode) cantilever microelectromechanical system (MEMS) and associated fabrication processes are provided. The method deposits thin-films overlying a substrate. The substrate can be made of glass, polymer, quartz, metal foil, Si, sapphi... | 11/08/2011 |
| 8043882 | Method of making microminiature moving device A microminiature moving device has disposed on a single-crystal silicon substrate movable elements such as a movable rod and a movable comb electrode that are displaceable in parallel to the substrate surface and stationary parts that are fixedly secured to the sing... | 10/25/2011 |
| 8008105 | Methods for fabricating micro-electro-mechanical devices A method for fabricating a micro-electro-mechanical device (such as a cMUT) is disclosed. The method combines a substrate, a middle spring layer and a top plate using wafer bonding technology or sacrificial technology. A cavity is formed on either the top of the sub... | 08/30/2011 |
| 7998775 | Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures When a native oxide grows on a polysilicon member of, e.g., a MEMS device, delamination between the polysilicon member and subsequently formed layers may occur because the native oxide is undercut during removal of sacrificial oxide layers. Nitriding the native oxid... | 08/16/2011 |
| 7981715 | MEMS/NEMS structure comprising a partially monocrystalline anchor and method for manufacturing same The invention relates to a method for producing a MEMS/NEMS structure from a substrate made in a monocrystalline semiconductor material, the structure comprising a flexible mechanical element connected to the substrate by at least one anchoring zone, the method comp... | 07/19/2011 |
| 7972888 | Methods for manufacturing MEMS sensor and thin film and cantilever beam thereof with epitaxial growth process A method for manufacturing a MEMS sensor and its thin film and cantilever beam includes steps of etching a top surface of a single-crystal silicon wafer in combination of a deposition process, an outer epitaxial growth process, a wet etching process and a back etchi... | 07/05/2011 |
| 7960200 | Orientation-dependent etching of deposited AlN for structural use and sacrificial layers in MEMS In accordance with the present invention, accurate and easily controlled sloped walls may be formed using AlN and preferably a heated TMAH for such purpose as the fabrication of MEMS devices, wafer level packaging and fabrication of fluidic devices. Various embodime... | 06/14/2011 |
| 7935556 | Microelectromechanical system and process of making the same A micro electromechanical system and a fabrication method thereof, which has trenches formed on a substrate to prevent circuits from interfering each other, and to prevent over-etching of the substrate when releasing a microstructure. ... | 05/03/2011 |
| 7932116 | Hollow sealing structure and manufacturing method for hollow sealing structure A manufacturing method for a hollow sealing structure, includes, a process for filling a recessed portion in a principal surface of a substrate with a first sacrificial layer, a process for forming a functional element portion on the principal surface of the substra... | 04/26/2011 |
| 7927905 | Method of producing microsprings having nanowire tip structures A stress-engineered microspring is formed generally in the plane of a substrate. A nanowire (or equivalently, a nanotube) is formed at the tip thereof, also in the plane of the substrate. Once formed, the length of the nanowire may be defined, for example photolitho... | 04/19/2011 |
| 7927906 | Method for MEMS threshold sensor packaging Apparatus, methods, and systems for bonding a cover wafer to a MEMS threshold sensors located on a silicon disc. The cover wafer is trenched to form a region when bonded to the silicon wafer that produces a gap over the contact bond pads of the MEMS threshold sensor... | 04/19/2011 |
| 7915066 | Methods of making electromechanical three-trace junction devices Methods of producing an electromechanical circuit element are described. A lower structure having lower support structures and a lower electrically conductive element is provided. A nanotube ribbon (or other electromechanically responsive element) is formed on an up... | 03/29/2011 |
| 7910390 | Resonant MEMS device that detects photons, particles and small forces A resonant MEMS device that detects photons, particles and small forces including atomic forces is disclosed. The device comprises a planar substrate 1, two electrodes 2 and 3 on top of the substrate, a resonant micro-electromechanical (MEMS) st... | 03/22/2011 |
| 7906359 | Method of forming a surface micromachined MEMS device A method of forming a surface micromachined MEMS device applies an insulator to a substrate, and then deposits a conductive path on the insulator. The conductive path is capable of transmitting an electronic signal between two points on the MEMS device. The insulato... | 03/15/2011 |
| 7901970 | Micro-electromechanical system (MEMS) based current and magnetic field sensor having capacitive sense components A micro-electromechanical system (MEMS) based current & magnetic field sensor includes a MEMS-based magnetic field sensing component having a capacitive magneto-MEMS component, a compensator and an output component for sensing magnetic fields and for providing, in r... | 03/08/2011 |
| 7897424 | Method of manufacturing an electrical-mechanical memory device A memory device includes a bit line, a reading word line, a bit line contact, an electrode, a writing word line and a contact tip. The bit line is formed on a substrate. The reading word line is formed over the bit line. The bit line contact is disposed between adja... | 03/01/2011 |
| 7875484 | Monolithic IC and MEMS microfabrication process Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and micro-electromechanical devices are built on separate areas of a single wa... | 01/25/2011 |
| 7875483 | Manufacturing method of microelectromechanical system To provide a method of easily forming a three-dimensional structure typified by a cantilever by using a thin film formed over an insulating surface, and provide a microelectromechanical system formed by such a method. A three-dimensional structure typified by a cant... | 01/25/2011 |
| 7858423 | MEMS based RF components with vertical motion and parallel-plate structure and manufacture thereof using standard CMOS technologies A process of manufacturing parallel-plate microstructures by integrating the microstructures in a chip using a CMOS process is provided. A MEMS variable capacitor, a tunable band-pass filter, tunable matching networks, and capacitive RF-MEME switches all having vert... | 12/28/2010 |
| 7858422 | MEMS coupler and method to form the same A MEMS coupler and a method to form a MEMS structure having such a coupler are described. In an embodiment, a MEMS structure comprises a member and a substrate. A coupler extends through a portion of the member and connects the member with the substrate. The member ... | 12/28/2010 |
| 7829365 | Micro electro-mechanical system and method of manufacturing the same A micro electro-mechanical system, which can be stably formed so as to prevent sticking of a movable part and which has a narrow gap, and a method of manufacturing the same are provided. The micro electro-mechanical system includes at least one fixed electrode forme... | 11/09/2010 |
| 7824946 | Isolated metal plug process for use in fabricating carbon nanotube memory cells The present invention is directed to structures and methods of fabricating electromechanical memory cells having nanotube crossbar elements. Such memory cells include a substrate having transistor with a contact that electrically contacts with the transistor. A firs... | 11/02/2010 |
| 7816166 | Method to form a MEMS structure having a suspended portion A method to form a MEMS structure is described. In an embodiment, a structure having a first release layer between a substrate and a member is provided. A second release layer is adjacent to a sidewall of the member. At least a portion of each of the first and the s... | 10/19/2010 |
| 7811849 | Placing a MEMS part on an application platform using a guide mask A method for fabricating a micro-electro-mechanical system (MEMS) device. The method comprises placing a guiding mask on an application platform, the guiding mask including an opening that defines the position of a MEMS part to be placed on the application platform.... | 10/12/2010 |
| 7811848 | Method for forming buried cavities within a semiconductor body, and semiconductor body thus made A method for the formation of buried cavities within a semiconductor body envisages the steps of: providing a wafer having a bulk region made of semiconductor material; digging, in the bulk region, trenches delimiting between them walls of semiconductor material; fo... | 10/12/2010 |
| 7790494 | Method of fabricating a multi-bit electro-mechanical memory device A memory device may include a substrate, a bit line, at least a first lower word line, at least a first trap site, a pad electrode, at least a first cantilever electrode, and/or at least a first upper word line. The bit line may be formed on the substrate in a first... | 09/07/2010 |
| 7790493 | Wafer-level, polymer-based encapsulation for microstructure devices Disclosed herein is a method of fabricating a device having a microstructure. The method includes forming a connector on a semiconductor substrate, coating the connector with a polymer layer, and immersing the semiconductor substrate and the coated connector in an e... | 09/07/2010 |
