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| Number | Title | Issue Date |
| 8178379 | Integrated circuit, resistivity changing memory device, memory module, and method of fabricating an integrated circuit According to one embodiment of the present invention, a memory device includes a composite structure including a resistivity changing layer and an electrode layer being arranged on or above the resistivity changing layer. The resistivity changing memory device furth... | 05/15/2012 |
| 8173470 | Three-axis accelerometers and fabrication methods Disclosed are MEMS accelerometers and methods for fabricating same. An exemplary accelerometer comprises a substrate, and a proof mass that is a portion of the substrate and which is separated from the substrate surrounding it by a gap. An electrically-conductive an... | 05/08/2012 |
| 8158448 | Resonator and methods of making resonators A resonator and method of making a resonator are provided. A particular method includes etching a silicon substrate to form a resonator structure. The resonator structure includes at least one resonator beam. The method also includes converting at least a portion of... | 04/17/2012 |
| 8148187 | Method for manufacturing a micromechanical component having a volume-elastic medium and micromechanical component A method for manufacturing a micromechanical component is described, the micromechanical component having a medium. The medium has settable and changeable volume-elastic properties and generally completely encloses a sensor module and/or a module housing. The medium... | 04/03/2012 |
| 8143083 | Physical quantity sensor device and method for producing the same A circuit board is mounted on a package via an adhesive agent as an elastic member. A sensor element is stacked in fixed relation onto the circuit board. The sensor element, the circuit board, and the package are wired with bonding wires. A magnetic member made of a... | 03/27/2012 |
| 8124436 | MEMS switch capping and passivation method A MEMS switch with a platinum-series contact is capped through a process that also passivates the contact by controlling, over time, the amount of oxygen in the environment, pressures and temperatures. Some embodiments passivate a contact in an oxygenated atmosphere... | 02/28/2012 |
| 8124435 | Method for manufacturing a microelectromechanical component, and a microelectromechanical component The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention... | 02/28/2012 |
| 8124434 | Method and system for packaging a display A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator i... | 02/28/2012 |
| 8114697 | Piezoelectric microphone, speaker, microphone-speaker integrated device and manufacturing method thereof A piezoelectric microphone, a speaker, a microphone-speaker integrated device and a manufacturing method thereof are provided. The microphone-speaker integrated device includes a silicon substrate and an insulating layer deposited on the silicon substrate; a piezoel... | 02/14/2012 |
| 8093085 | Method of forming suspension object on monolithic substrate A method of forming a suspension object on a monolithic substrate is provided. A silicon base layer of the monolithic substrate has a circuit layer composed of at least one wet etching region, at least one circuit region, and at least one microstructure region. The ... | 01/10/2012 |
| 8093086 | Packaged device and method of manufacturing the same A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surf... | 01/10/2012 |
| 8093087 | Method for fabricating MEMS device Method for fabricating MEMS device has a first surface and a second surface and having a MEMS region and an IC region. A MEMS structure is formed over the first surface. A structural dielectric layer is formed over the first surface. The structural dielectric layer ... | 01/10/2012 |
| 8048704 | Method of forming a MEMS topped integrated circuit with a stress relief layer The bow in a wafer that results from fabricating a large number of MEMS devices on the top surface of the passivation layer of the wafer so that a MEMS device is formed over each die region is reduced by forming a stress relief layer between the passivation layer an... | 11/01/2011 |
| 8043881 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device fac... | 10/25/2011 |
| 8039285 | Thin film getter protection A method for installing a sorption element in a cavity including: disposing, within the cavity, a getter material, a reaction material, and a protective material, the protective material covering at least one part of the getter material so as to bury the at least on... | 10/18/2011 |
| 8030112 | Method for fabricating MEMS device A method for fabricating MEMS device includes: providing a single crystal substrate, having first surface and second surface and having a MEMS region and an IC region; forming SCS mass blocks on the first surface in the MEMS region; forming a structural dielectric l... | 10/04/2011 |
| 7998774 | Package, in particular for MEMS devices and method of making same A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated sensitive to the chemical/physical variations of a fluid. The active surface of the MEMS d... | 08/16/2011 |
| 7993950 | System and method of encapsulation Embodiments discussed herein generally include methods of fabricating MEMS devices within a structure. The MEMS device may be formed in a cavity above the structure, and additional metallization may occur above the MEMS device. The cavity may be formed by depositing... | 08/09/2011 |
| 7989248 | Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures A method of forming Monolithic CMOS-MEMS hybrid integrated, packaged structures includes the steps of providing: providing at least one semiconductor substrate having a CMOS device area including dielectric layers and metallization layers; applying at least one prot... | 08/02/2011 |
| 7972887 | Micro-electro-mechanical-system package and method for manufacturing the same According to an aspect of the present invention, there is provided a method for manufacturing a MEMS package, the method including: forming a MEMS device on a substrate; forming a sacrificing member on the MEMS device; forming a cavity formation film on the sacrific... | 07/05/2011 |
| 7968364 | MEMS switch capping and passivation method A MEMS switch with a platinum-series contact is capped through a process that also passivates the contact by controlling, over time, the amount of oxygen in the environment, pressures and temperatures. Some embodiments passivate a contact in an oxygenated atmosphere... | 06/28/2011 |
| 7964428 | Micromechanical component and method for fabricating a micromechanical component A method for fabricating a microelectromechanical or microoptoelectromechanical component. The method includes producing first and second layer composites. The first has a first substrate and a first insulation layer, which covers at least one part of the surface of... | 06/21/2011 |
| 7955885 | Methods of forming packaged micro-electromechanical devices Methods of forming packaged micro-electromechanical devices include forming a first substrate having a micro-electromechanical device therein, which extends adjacent a first surface of the first substrate. A first surface of a second substrate is then bonded to the ... | 06/07/2011 |
| 7943412 | Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters A method of formation of a microelectromechanical system (MEMS) resonator or filter which is compatible with integration with any analog, digital, or mixed-signal integrated circuit (IC) process, after or concurrently with the formation of the metal interconnect lay... | 05/17/2011 |
| 7892876 | Three-axis accelerometers and fabrication methods Disclosed are MEMS accelerometers and methods for fabricating same. An exemplary accelerometer comprises a substrate, and a proof mass that is a portion of the substrate and which is separated from the substrate surrounding it by a gap. An electrically-conductive an... | 02/22/2011 |
| 7875482 | Substrate with multiple encapsulated pressures A method of forming a device with multiple encapsulated pressures is disclosed herein. In accordance with one embodiment of the present invention, there is provided a method of forming a device with multiple encapsulated pressures, including providing a substrate, f... | 01/25/2011 |
| 7875481 | Semiconductor apparatus and method for manufacturing the same It is made possible to provide a highly integrated, thin apparatus can be obtained, even if the apparatus contains MEMS devices and semiconductor devices. A semiconductor apparatus includes: a first chip comprising a MEMS device formed therein; a second chip compris... | 01/25/2011 |
| 7863070 | Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale Apparatus and methods are provided for enabling wafer-scale encapsulation of microelectromechanical (MEM) devices (e.g., resonators, filters) to protect the MEMs from the ambient and to provide either a controlled ambient or a reduced pressure. In particular, method... | 01/04/2011 |
| 7851246 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device A semiconductor package has a semiconductor die with an optically active region which converts light to an electrical signal. An expansion region is formed around the semiconductor die. A through hole via (THV) is formed in the expansion region. Conductive material ... | 12/14/2010 |
| 7829363 | Method and apparatus for microjoining dissimilar materials Disclosed are apparatus and methods that provide for electrical contacts in a substrate. For example, the apparatus may comprise a trench formed in a substrate, with an electrical contact pad formed on interior walls of the trench that comprises a narrowed opening. ... | 11/09/2010 |
| 7829364 | Method of fabricating a suspension microstructure A suspension microstructure and its fabrication method, in which the method comprises the steps of: forming at least one insulation layer with inner micro-electro-mechanical structures on an upper surface of a silicon substrate, the micro-electro-mechanical structur... | 11/09/2010 |
| 7824945 | Method for making micro-electromechanical system devices A method for making micro-electromechanical system devices includes: (a) forming a sacrificial layer on a device wafer; (b) forming a plurality of loop-shaped through-holes in the sacrificial layer so as to form the sacrificial layer into a plurality of enclosed por... | 11/02/2010 |
| 7820468 | Stack type surface acoustic wave package, and method for manufacturing the same Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connect... | 10/26/2010 |
| 7790492 | Method for fabricating a transducer package with the transducer die unsupported by a substrate A transducer package fabrication process is provided, the completed transducer package achieving a thin package profile. The fabrication process utilizes an encapsulation material to eliminate the need for a transducer support substrate, the encapsulation material i... | 09/07/2010 |
| 7781249 | MEMS process and device A MEMS device comprising a flexible membrane that is free to move in response to pressure differences generated by sound waves. A first electrode mechanically coupled to the flexible membrane, and together form a first capacitive plate. A second electrode mechanical... | 08/24/2010 |
| 7772026 | MEMS device package and method for manufacturing the same A micro electro-mechanical system (MEMS) device package and a method of manufacturing the same are provided. The inventive MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, ea... | 08/10/2010 |
| 7767483 | Dual-suspension system for MEMS-based devices and method for fabricating same A method for fabricating a dual-suspension system for MEMS-based devices includes: etching the geometry of an upper spring system, a lower spring system, and a proof mass into a substrate; applying a protective barrier to cover at least the exposed portions of the f... | 08/03/2010 |
| 7763488 | Method of fabricating MEMS device A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded... | 07/27/2010 |
| 7763489 | Method of forming a micromechanical system containing a microfluidic lubricant channel Embodiments of the present invention generally relate to a electromechanical device that has an improved usable lifetime due to the presence of one or more channels that contain and deliver a lubricant material that can reduce the likelihood of stiction occurring be... | 07/27/2010 |
| 7736930 | Optical die-down quad flat non-leaded package An optical sensor package that includes an optical sensor die is mounted by flip chip interconnect onto a lead frame in a “die-down” orientation, that is, with the active side of the optical sensor die facing the lead frame. An opening is provided in the lead fr... | 06/15/2010 |
