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| Number | Title | Issue Date |
| 8187902 | High performance sensors and methods for forming the same A sensor includes a proof mass suspended by a suspension beam, the suspension beam having a thickness less than a thickness of the proof mass. ... | 05/29/2012 |
| 8183077 | Force input control device and method of fabrication Methods of fabricating 3-dimensional force input control devices are disclosed. These roughly comprise: providing a first substrate, fabricating stress-sensitive IC components and signal processing IC on a side one of the first substrate, fabricating one or more clo... | 05/22/2012 |
| 8183076 | Micro-electro-mechanical system device, out-of-plane sensor and method for making micro-electro-mechanical system device The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a mass including a main body and two capacitor plates located at the two sides of the main body and connected with the main body, the two capacitor plates being at different... | 05/22/2012 |
| 8168461 | Micro-electro-mechanical device and method of manufacturing the same The present invention improves mechanical strength of a micro-electro-mechanical device (MEMS) having a movable portion to improve reliability. In a micro-electro-mechanical device (MEMS) having a movable portion, a portion which has been a hollow portion in the cas... | 05/01/2012 |
| 8163583 | Manufacturing method of micro electronic mechanical system structure A micro electronic mechanical system structure and a manufacturing method thereof are provided. A substrate has a plurality of conductive regions is provided. A dielectric layer is formed on the substrate. A plurality of openings and recesses are formed in the diele... | 04/24/2012 |
| 8143082 | Wafer bonding of micro-electro mechanical systems to active circuitry A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS component on its first surface. The active device wafer has a first s... | 03/27/2012 |
| 8138006 | Method for producing a micromechanical component having a trench structure for backside contact A method for manufacturing a micromechanical component is proposed. In this context, at least one trench structure having a depth less than the substrate thickness is to be produced in a substrate. In addition, an insulating layer and a filler layer are produced or ... | 03/20/2012 |
| 8119431 | Method of forming a micro-electromechanical system (MEMS) having a gap stop A method of forming a micro-electromechanical system (MEMS) includes providing a cap substrate, providing a support substrate, depositing a conductive material over the support substrate, patterning the conductive material to form a gap stop and a contact, wherein t... | 02/21/2012 |
| 8088638 | MEMS DC to DC switching converter The present invention provides a DC high voltage converter having an oscillator driver, main switch array and topological enhanced capacitors. The switch array utilizes MEM cantilevers and topological capacitors for charge storages for the generation of a high volta... | 01/03/2012 |
| 8071412 | Method of fabricating micro-electromechanical system microphone structure A method of fabricating a micro-electromechanical system microphone structure is disclosed. First, a substrate defining a MEMS region and a logic region is provided, and a surface of the substrate has a dielectric layer thereon. Next, at least one metal interconnect... | 12/06/2011 |
| 8071413 | Micro-electro-mechanical system (MEMS) sensor and method for making same The present invention discloses an MEMS sensor and a method for making the MEMS sensor. The MEMS sensor according to the present invention includes: a substrate including an opening; a suspended structure located above the opening; and an upper structure, a portion ... | 12/06/2011 |
| 8071411 | Low temperature ceramic microelectromechanical structures A method of providing microelectromechanical structures (MEMS) that are compatible with silicon CMOS electronics is provided. The method provides for processing and manufacturing is steps limiting a maximum exposure of an integrated circuit upon which the MEMS is ma... | 12/06/2011 |
| 8043880 | Microelectronic device One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and hermetically sealing the membrane. ... | 10/25/2011 |
| 8039284 | Dual metal silicides for lowering contact resistance A method for forming a semiconductor structure includes: providing a semiconductor substrate; forming an NMOS device at a surface of the semiconductor substrate, which comprises forming a first source/drain electrode on a first source/drain region of the NMOS device... | 10/18/2011 |
| 8030111 | Integration manufacturing process for MEMS device A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) for... | 10/04/2011 |
| 8026120 | Method of manufacturing MEMS device A method of manufacturing an MEMS device includes: forming a covering structure having an MEMS structure and a hollow portion, which is located on a periphery of the MEMS structure and is opened to an outside, on a substrate; and performing surface etching for the M... | 09/27/2011 |
| 8021906 | Hermetic sealing and electrical contacting of a microelectromechanical structure, and microsystem (MEMS) produced therewith Disclosed are methods and microsystems for vertically through-plating (6) cover plates (5) for microsystem components (2, 2a) by means of a conductive solder glass (8). Said methods and microsystems make it possible to simplify thr... | 09/20/2011 |
| 8012785 | Method of fabricating an integrated CMOS-MEMS device An embodiment of a method is provided that includes providing a substrate having a frontside and a backside. A CMOS device is formed on the substrate. A MEMS device is also formed on the substrate. Forming the MEMS device includes forming a MEMS mechanical structure... | 09/06/2011 |
| 7993949 | Heterogeneous substrate including a sacrificial layer, and a method of fabricating it The invention relates to a method of making a component from a heterogeneous substrate comprising first and second portions in at least one monocrystalline material, and a sacrificial layer constituted by at least one stack of at least one layer of monocrystalline S... | 08/09/2011 |
| 7989247 | In-plane sensor and method for making same According to the present invention, an in-plane sensor comprises: a fixed structure including a fixed finger and a fixed column connected to each other, the fixed finger having a supported end supported by the fixed column and a suspended end which is unsupported; a... | 08/02/2011 |
| 7985611 | Method for manufacturing integrated MEMS resonator device The present invention provides a method for manufacturing a micro-electro-mechanical system (MEMS) resonator device using the same device layer, dielectric layer, and conductive layer that is used to create other electrical devices in a complementary metal oxide sem... | 07/26/2011 |
| 7972886 | Method of manufacturing micro electro mechanical systems device Provided is a MEMS device which is robust to the misalignment and does not require the double-side wafer processing in the manufacture of a MEMS device such as an angular velocity sensor, an acceleration sensor, a combined sensor or a micromirror. After preparing a ... | 07/05/2011 |
| 7964427 | Silicon-based RF system and method of manufacturing the same A RF system which includes a silicon substrate formed with at least one via-hole filled with conductive material so that both sides of the silicon substrate are electrically connected with one another; at least one flat device formed on one side of the silicon subst... | 06/21/2011 |
| 7955884 | Semiconductor packages A semiconductor package includes a semiconductor chip including a semiconductor substrate and a plurality of cell transistors arranged on the semiconductor substrate. Channel regions of the cell transistors have channel lengths that extend in a first direction, and ... | 06/07/2011 |
| 7951635 | Method for the compensation of deviations occurring as a result of manufacture in the manufacture of micromechanical elements and their use The invention relates to a method for the compensation of deviations occurring as a result of manufacture in the manufacture of micromechanical elements and their use which should be deflected at a resonant frequency. It is therefore the object of the invention to c... | 05/31/2011 |
| 7943411 | Apparatus and method of wafer bonding using compatible alloy A method of forming an inertial sensor provides 1) a device wafer with a two-dimensional array of inertial sensors and 2) a second wafer, and deposits an alloy of aluminum/germanium onto one or both of the wafers. The alloy is deposited and patterned to form a plura... | 05/17/2011 |
| 7943410 | Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming An embedded MEMS semiconductor substrate is set forth and can be a starting material for subsequent semiconductor device processing. A MEMS device is formed in a semiconductor substrate, including at least one MEMS electrode and a buried silicon dioxide sacrificial ... | 05/17/2011 |
| 7935555 | Method and system for sealing a substrate A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described. The MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method may include form... | 05/03/2011 |
| 7927904 | Method of making BIOMEMS devices A MEMS device is manufactured by first forming a self-aligned monolayer (SAM) on a carrier wafer. Next, a first polymer layer is formed on the self-aligned monolayer. The first polymer layer is patterned form a microchannel cover, which is then bonded to a patterned... | 04/19/2011 |
| 7923278 | Integrated getter area for wafer level encapsulated microelectromechanical systems There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film encapsulated MEMS, and technique of fabricating or manufacturing a thin film encapsulated MEMS including an integrated getter area and/or an incre... | 04/12/2011 |
| 7919345 | Method of fabricating micromechanical components with free-standing microstructures or membranes A method is disclosed of fabricating micromechanical components provided with free-standing microstructures or membranes with predetermined mechanical stress, by initially depositing a sacrificial layer on a substrate followed by depositing a polysilicon layer on th... | 04/05/2011 |
| 7919346 | Micromechanical component and manufacturing method A micromechanical component has a substrate, a first intermediate layer which is situated thereupon, and a first layer which is situated thereupon and is structured down to the first intermediate layer. A second intermediate layer is situated above the first layer. ... | 04/05/2011 |
| 7901969 | Micromirror manufacturing method A micro-mirror manufacturing method for dividing a plurality of micro-mirror devices each having at least one mirror, formed on a semiconductor wafer into individual micro-mirror devices can be provided. The manufacturing method comprises a step of depositing an ino... | 03/08/2011 |
| 7892875 | MEMS resonator and manufacturing method of the same A method is for manufacturing a microelectromechanical system resonator having a semiconductor device and a microelectromechanical system structure unit formed on a substrate. The method includes: forming a lower electrode of an oxide-nitride-oxide capacitor unit in... | 02/22/2011 |
| 7863069 | Method of forming an integrated MEMS resonator A method of producing an integrated MEMS resonator includes providing a substrate including single crystal silicon and partially forming a resonator in a first portion of the substrate, the resonator having a resonating element formed by the substrate and an electro... | 01/04/2011 |
| 7858421 | Method of forming metal-oxide-semiconductor transistor A method of forming a metal-oxide-semiconductor (MOS) transistor device is disclosed. A semiconductor substrate is prepared first, and the semiconductor substrate has agate structure, a source region and a drain region. Subsequently, a stress buffer layer is formed ... | 12/28/2010 |
| 7838320 | Semiconductor physical quantity sensor and method for manufacturing the same A method for manufacturing a semiconductor physical quantity sensor having a fixed portion, a movable portion and an output terminal includes: forming a metal layer on a semiconductor layer; forming a resist on the metal layer; forming an opening and a side etching ... | 11/23/2010 |
| 7833815 | Microelectromechanical system package and the method for manufacturing the same A method for manufacturing a microelectromechanical system package is provided. A plurality of cavities is first formed on a surface of a silicon wafer. The surface of the silicon wafer is then bonded to the microelectromechanical system wafer in such a manner that ... | 11/16/2010 |
| 7799595 | Semiconductor physical quantity sensor of electrostatic capacitance type and method for manufacturing the same In a semiconductor physical quantity sensor of electrostatic capacitance type, mutually facing peripheral areas (bonding areas) of a glass substrate and a silicon substrate are contacted for anodic bonding, while at the same time, both substrates have an anodic bond... | 09/21/2010 |
| 7772025 | Electronic device and method of manufacturing the same An electronic device includes an electronic element having a detecting part on one surface thereof, a base member, bumps, and an adhesive film. The base member is arranged to face the one surface of the electric element. The bumps are arranged between the electric e... | 08/10/2010 |
