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Class 438/496 - Coating of semiconductive substrate with nonsemiconductive material


Subclass of Class 438 - Semiconductor device manufacturing: process
Definition: Process wherein the coating of a nonsemiconductive material
No. of patents: 62
Last issue date: 05/15/2012


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NumberTitleIssue Date
8178429Nanofabrication using dip pen nanolithography and metal oxide chemical vapor deposition
Fabrication of a semiconductor structure is achieved by using a Dip Pen Nanolithography (DPN) tip to apply a metal catalyst to a prepared substrate. The catalyst is applied in a predetermined pattern, and crystal growth is established at the catalyst site. ...
05/15/2012
8173525Systems and methods for nanomaterial transfer
Systems and methods of nanomaterial transfer are described. A method of nanomaterial transfer involving fabricating a template and synthesizing nanomaterials on the template. Subsequently, the nanomaterials are transferred to a substrate by pressing the template ont...
05/08/2012
8168518Method for crystallizing thin film, method for manufacturing thin film semiconductor device, method for manufacturing electronic apparatus, and method for manufacturing display device
A gate insulating film (13) is formed on a substrate (1) so as to cover a gate electrode (11), and an amorphous silicon film (semiconductor thin film) (15) is further formed. A light absorption layer (19) is formed thereon through ...
05/01/2012
7955960Nonvolatile memory device and method of fabricating the same
A nonvolatile memory device and a method of fabricating the same is provided to prevent charges stored in a charge trap layer from moving to neighboring memory cells. The method of fabricating a nonvolatile memory device, includes forming a first dielectric layer on...
06/07/2011
7648894Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same
The present invention relates to a coating composition for insulating film production, a preparation method of a low dielectric insulating film using the same, a low dielectric insulating film for a semiconductor device prepared therefrom, and a semiconductor device...
01/19/2010
7419891Method and system for providing a smaller critical dimension magnetic element utilizing a single layer mask
The method and system for providing a magnetic element are disclosed. The method and system include providing a magnetic element stack that includes a plurality of layers and depositing a stop layer on the magnetic element stack. The method and system also include p...
09/02/2008
7329361Method and apparatus for fabricating or altering microstructures using local chemical alterations
A method and apparatus for fabricating or altering a microstructure use means for heating to facilitate a local chemical reaction that forms or alters the submicrostructure. ...
02/12/2008
7326310Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is directed to formation of an insulating layer or a like layer having a complex shape with concavities and convexities while maintaini...
02/05/2008
7325903Quill-jet printer
A system for depositing a material is described. The system uses at least one cantilever, and more typically a plurality of cantilever to transfer small amounts of material from a source of material to a substrate surface. One application for the system is a printin...
02/05/2008
7323406Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures
A method for making novel elevated bond-pad structures with sidewall spacers is achieved. The elevated bond-pad structures increase the space between the chip and a substrate during flip-chip bonding. The increased spacing results in better under-filling and reduces...
01/29/2008
7304005Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device
A second laser light of a continuous wave oscillation is irradiated to a region melted by a first laser light of a pulsed oscillation having a harmonic. Specifically, the first laser light has a wavelength not longer than that of visible light (830 nm, preferably no...
12/04/2007
7294929Solder ball pad structure
An interconnect structure a substrate, a contact pad disposed over a surface of the substrate, and an insulative mask disposed over the contact pad. The insulative mask can include an opening that is aligned over and exposes an inner portion of the contact pad. The ...
11/13/2007
7282459Ejection method and optical device manufacturing method for arranging nozzles in agreement with sections subject to ejection
Aspects of the invention can provide an ejection method to form a micro lens efficiently on each of a plurality of semiconductor lasers in a wafer state. So that a distance in an x-axis direction between two mutually adjacent sections subject to ejection and a dista...
10/16/2007
7282430Melt-based patterning for electronic devices
The present invention provides methods and apparatus for melt-based patterning for electronic devices. It employs and provides processes and apparatus for fabricating an electronic device having a pattern formed on a surface by a deposition material. Further, the in...
10/16/2007
7255899Heat treatment apparatus and heat treatment method of substrate
A heat diffusion plate and a heating plate are placed in a heat treatment chamber in this order. The heating plate is used for preliminarily heating a glass substrate to a temperature in a range from 200° C. to 400° C. The glass substrate thus preliminarily heated...
08/14/2007
7235159Methods for producing and using catalytic substrates for carbon nanotube growth
A catalyst material for carbon nanotube synthesis includes a uniform dispersion of host particles on a substrate. The host particles themselves include catalyst nanoparticles that are effective to catalyze nanotube syntheses reactions and provide nucleation sites. M...
06/26/2007
7232496Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board
The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part. A ceramic green sheet is produced by forming on a substrate or on a layer formed on a ...
06/19/2007
7232770High temperature and chemical resistant process for wafer thinning and backside processing
A process which uses a silicone resin to form a wafer-to-carrier bonded package that enables wafer thinning and backside processing while the cured resin exhibits high chemical and thermal resistance. The process is versatile in that the constructed wafer package al...
06/19/2007
7229902Method for making a semiconductor device including a superlattice with regions defining a semiconductor junction
A method for making a semiconductor device may include forming a superlattice comprising a plurality of stacked groups of layers. Each group of layers of the superlattice may include a plurality of stacked base silicon monolayers defining a base silicon portion and ...
06/12/2007
7210340Front-wing cantilever for the conductive probe of electrical scanning probe microscopes
The present invention discloses a front-wing cantilever for the conductive probe of electrical scanning probe microscopes, wherein two symmetrical front wings are installed to extend from two lateral sides of the front end of the cantilever so that those two front w...
05/01/2007
7199031Semiconductor system having a pn transition and method for manufacturing a semiconductor system
A semiconductor system having a pn transition and a method for manufacturing a semiconductor system are disclosed. The semiconductor system is designed in the form of a chip having an edge region, the semiconductor system includes a first layer of a first conductivi...
04/03/2007
7193238Display device and a method for manufacturing the same
An image display device which includes a display pixel block and circuit blocks peripheral thereto. Each block has a circuit made of high-performance thin film transistors. The display pixel block and the peripheral circuit blocks including the four corners of the d...
03/20/2007
7179727Formation of lattice-tuning semiconductor substrates
A method of forming a lattice-tuning semiconductor substrate comprises the steps of defining parallel strips of a Si surface by the provision of spaced parallel oxide walls (2) on the surface, selectively growing a first SiGe layer on the strips such that fir...
02/20/2007
7179399Material for forming protective film
A material for forming a protective film comprising an organic solvent and a compound having at least two alicyclic structures. ...
02/20/2007
7176499Method of manufacturing a semiconductor light emitting device, semiconductor light emitting device, method of manufacturing a semiconductor device, semiconductor device, method of manufacturing a device, and device
When a semiconductor light emitting device or a semiconductor device is manufactured by growing nitride III-V compound semiconductor layers, which will form a light emitting device structure or a device structure, on a nitride III-V compound semiconductor substrate ...
02/13/2007
7118946Thin film transistor, circuit device and liquid crystal display
A thin film transistor includes a one conductive type semiconductor layer; a source region and a drain region which are separately provided in the semiconductor layer; and a gate electrode provided above or below the semiconductor layer with an insulating film inter...
10/10/2006
7091056Method of manufacturing a semiconductor light emitting device, semiconductor light emitting device, method of manufacturing a semiconductor device, semiconductor device, method of manufacturing a device, and device
When a semiconductor light emitting device or a semiconductor device is manufactured by growing nitride III–V compound semiconductor layers, which will form a light emitting device structure or a device structure, on a nitride III–V compound semiconductor substr...
08/15/2006
7071042Method of fabricating silicon integrated circuit on glass
A method of fabricating a silicon integrated circuit on a glass substrate includes preparing a glass substrate; fabricating a silicon layer on the glass substrate; implanting ions into the active areas of the silicon layer; covering the silicon layer with a heat pad...
07/04/2006
7056806Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
The present disclosure provides methods and apparatus useful in depositing materials on batches of microfeature workpieces. One implementation provides a method in which a quantity of a first precursor gas is introduced to an enclosure at a first enclosure pressure....
06/06/2006
7022593SiGe rectification process
A method for forming strain-relaxed SiGe films comprises depositing a graded strained SiGe layer on a substrate in which the concentration of Ge is greater at the interface with the substrate than at the top of the layer. The strained SiGe film is subsequently oxidi...
04/04/2006
7005339Method of integrating high voltage metal oxide semiconductor devices and submicron metal oxide semiconductor devices
The present invention provides a method of integrating at least one high voltage metal oxide semiconductor device and at least one Submicron metal oxide semiconductor device on a substrate. The method comprises: providing the substrate, forming a plurality of shallo...
02/28/2006
6949419Display device and a method for manufacturing the same
An image display device which includes a display pixel block and circuit blocks peripheral thereto. Each block has a circuit made of high-performance thin film transistors. The display pixel block and the peripheral circuit blocks including the four corners of the d...
09/27/2005
6924214Method for calculating a time-related fill level signal
In a method for calculating a time-related fill level signal (h(t)) from a sensor signal (s(t)) of a fill level sensor for detection of the fill level of a liquid, the time-related fill level signal (h(t)) is calculated as a function of the sensor signal (s(t)) and ...
08/02/2005
6921707Low temperature metal oxide coating formation
A process for forming metal oxides, including mixed metal oxides, in a dilute vapor phase at a temperature below approximately 350 degrees Fahrenheit. The resulting novel oxides can be formed as dense films or coatings with very high strain-to-crack values, or as na...
07/26/2005
6916374Atomic layer deposition methods and atomic layer deposition tools
An atomic layer deposition method includes positioning a plurality of semiconductor wafers into an atomic layer deposition chamber. Deposition precursor is emitted from individual gas inlets associated with individual of the wafers received within the chamber effect...
07/12/2005
6893968Defect-minimizing, topology-independent planarization of process surfaces in semiconductor devices
A process for planarizing a process layer having structures and has been applied to a working surface of a semiconductor device, includes abrading the process layer down to the working surface using a polishing device. The working surface is planarized, and a defect...
05/17/2005
6876017Polymer sacrificial light absorbing structure and method
Method and structure for optimizing dual damascene patterning with polymeric dielectric materials are disclosed. Certain embodiments of the invention comprise polymeric sacrificial light absorbing materials (“polymer SLAM”) functionalized to have a controllable ...
04/05/2005
6838153Layered product, capacitor and a method for producing the layered product
A method for producing a laminate having resin layers and thin metal layers by repeating a process unit comprising a step of laminating a resin layer by applying a resin material, a step of depositing a patterning material on the resin layer and a step of laminating...
01/04/2005
6770547Method for producing a semiconductor device
A semiconductor apparatus in which flip chip bonding is enabled without any underfill, and which comprises a semiconductor device, an electrically insulating layer formed on the semiconductor device by mask-printing an electrically insulating material containing par...
08/03/2004
6767807Method for producing organic thin film device and transfer material used therein
A transfer material comprising an organic thin film uniformly provided by a wet method, etc. with high productivity is used to efficiently produce an organic thin film device such as an organic EL device excellent in light-emitting efficiency, uniformity of light em...
07/27/2004
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