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| Number | Title | Issue Date |
| 8183122 | Semiconductor device including semiconductor thin film, which is subjected to heat treatment to have alignment mark, crystallizing method for the semiconductor thin film, and crystallizing apparatus for the semiconductor thin film Exact alignment of a recrystallized region, which is to be formed in an amorphous or polycrystalline film, is facilitated. An alignment mark is formed, which is usable in a step of forming an electronic device, such as a thin-film transistor, in the recrystallized r... | 05/22/2012 |
| 8183123 | Method of forming mark in IC-fabricating process A method of forming a mark in an IC fabricating process is described. Two parts of the mark each including a plurality of linear patterns are respectively defined by two exposure steps that either belong to two lithography processes respectively or constitute a doub... | 05/22/2012 |
| 8153499 | Method for fabrication of a semiconductor device and structure A method of manufacturing a semiconductor wafer, the method including: providing a base wafer including a semiconductor substrate, metal layers and first alignment marks; transferring a monocrystalline layer on top of the metal layers, wherein the monocrystalline la... | 04/10/2012 |
| 8148233 | Semiconductor power device having a top-side drain using a sinker trench A semiconductor power device includes a plurality of groups of stripe-shaped gate trenches extending in a silicon region over a substrate, and a plurality of stripe-shaped sinker trenches each extending between two adjacent groups of the plurality of groups of strip... | 04/03/2012 |
| 8148232 | Overlay mark enhancement feature Methods and apparatuses for alignment are disclosed. An exemplary method includes providing a substrate having a device region and an alignment region; forming a first material layer over the substrate; forming a device feature and a dummy feature in the first mater... | 04/03/2012 |
| 8138058 | Substrate with marker, manufacturing method thereof, laser irradiation apparatus, laser irradiation method, light exposure apparatus, and manufacturing method of semiconductor device To provide a laser irradiation apparatus which performs alignment of an irradiated object and emits a laser beam precisely, a laser irradiation method, and a manufacturing method of a TFT with high reliability with the use of a method for precisely targeting a desir... | 03/20/2012 |
| 8124495 | Semiconductor device having enhanced photo sensitivity and method for manufacture thereof Provided are a semiconductor device and a method for its manufacture. In one example, the method includes forming an isolation structure having a first refraction index over a sensor embedded in a substrate. A first layer having a second refraction index that is dif... | 02/28/2012 |
| 8119493 | Method of forming a semiconductor device an alignment mark formed in a groove A method of forming a semiconductor device includes the following processes. A first groove is formed in a semiconductor substrate. An insulating film is formed in the first groove. An interlayer insulating film is formed over the semiconductor substrate. A removing... | 02/21/2012 |
| 8080462 | Mark structure for coarse wafer alignment and method for manufacturing such a mark structure A method for forming a mark structure on a substrate comprising a plurality of lines. The lines extend parallel to each other in a first direction and are arranged with a pitch between each pair of lines that is directed in a second direction perpendicular to the fi... | 12/20/2011 |
| 8076214 | Display substrate and method of manufacturing the same A display substrate includes a signal line, a thin-film transistor (“TFT”), a key pattern, a light-blocking pattern, a color filter, a pixel electrode and an alignment key. The signal line and the key pattern are formed on a substrate. The TFT is electrically co... | 12/13/2011 |
| 8058137 | Method for fabrication of a semiconductor device and structure A method of manufacturing a semiconductor wafer, the method including: providing a base wafer including a semiconductor substrate, metal layers and first alignment marks; transferring a monocrystalline layer on top of the metal layers, wherein the monocrystalline la... | 11/15/2011 |
| 8058136 | Self-alignment method for recess channel dynamic random access memory A self-alignment method for a recess channel dynamic random access memory includes providing a substrate with a target layer, a barrier layer and a lining layer, wherein the target layer has shallow trench isolation structures; patternizing the lining layer, barrier... | 11/15/2011 |
| 8043928 | Efficient provision of alignment marks on semiconductor wafer A semiconductor wafer includes multi chip areas each including two or more device chip areas and arranged in an X-axis direction and a Y-axis direction, a plurality of scribe lines formed parallel to the X axis and the Y axis such as to separate the device chip area... | 10/25/2011 |
| 8043927 | Method of manufacturing a CMOS image sensor In a method of manufacturing a complementary metal-oxide semiconductor (CMOS) image sensor (CIS), an epitaxial layer may be formed on a first substrate including a chip area and a scribe lane area. A first impurity layer may be formed adjacent to the first substrate... | 10/25/2011 |
| 8039356 | Through silicon via lithographic alignment and registration A method of manufacturing an integrated circuit structure forms a first opening in a substrate and lines the first opening with a protective liner. The method deposits a material into the first opening and forms a protective material over the substrate. The protecti... | 10/18/2011 |
| 8026149 | Substrate with marker, manufacturing method thereof, laser irradiation apparatus, laser irradiation method, light exposure apparatus, and manufacturing method of semiconductor device To provide a laser irradiation apparatus which performs alignment of an irradiated object and emits a laser beam precisely, a laser irradiation method, and a manufacturing method of a TFT with high reliability with the use of a method for precisely targeting a desir... | 09/27/2011 |
| 8003482 | Methods of processing semiconductor substrates in forming scribe line alignment marks A method of processing a semiconductor substrate in forming scribe line alignment marks includes forming pitch multiplied non-circuitry features within scribe line area of a semiconductor substrate. Individual of the features, in cross-section, have a maximum width ... | 08/23/2011 |
| 7998827 | Method of forming a multi-level interconnect structure by overlay alignment procedures A method of manufacturing a semiconductor device, includes forming a structure wherein a first alignment mark is provided in a first alignment-mark arrangement area of a first layer, a second alignment mark is provided in a second alignment-mark arrangement area of ... | 08/16/2011 |
| 7998826 | Method of forming mark in IC-fabricating process A method of forming a mark in an IC fabricating process is described. Two parts of the mark each including a plurality of linear patterns are respectively defined by two exposure steps that either belong to two lithography processes respectively or constitute a doub... | 08/16/2011 |
| 7989303 | Method of creating an alignment mark on a substrate and substrate In an embodiment, a method of creating an alignment mark on a substrate includes forming a plurality of lines segmented into electrically conducting line segments and space segments, thereby forming spaces between the lines to form a macroscopic structure in a first... | 08/02/2011 |
| 7981762 | Method of forming pre-metal dielectric layer of semiconductor device A method of forming a pre-metal dielectric (PMD) layer of a semiconductor device using a chemical mechanical polishing (CMP) process which can be suitable for easily recognizing an alignment key. Such a method can reduce or otherwise eliminate alignment key erosion ... | 07/19/2011 |
| 7972932 | Mark forming method and method for manufacturing semiconductor device A mark forming method includes forming a first mask layer on a semiconductor substrate; forming at least three first patterns having periodicity on the first mask layer; forming a second mask layer on the first mask layer having the first patterns formed thereon; an... | 07/05/2011 |
| 7964472 | Method of producing semiconductor device A semiconductor device is manufactured by forming a mask having a first opening and a second opening wider than the first opening on a principal surface of a first conductivity type semiconductor substrate, etching semiconductor portions of the first conductivity ty... | 06/21/2011 |
| 7960242 | Method for fabrication of a semiconductor device and structure A method of manufacturing a semiconductor wafer, the method comprising: providing a base wafer comprising a semiconductor substrate, metal layers and first alignment marks; transferring a monocrystalline layer on top of said metal layers, wherein said monocrystallin... | 06/14/2011 |
| 7955946 | Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices The invention includes methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, a... | 06/07/2011 |
| 7947563 | Chip ID applying method suitable for use in semiconductor integrated circuit A chip forming position specifying method for applying chip IDs indicative of positions on a wafer where semiconductor chips are formed, and thereby specifying their positions. In the chip forming position specifying method, different marks are formed for every chip... | 05/24/2011 |
| 7943478 | Semiconductor device manufacturing method In a semiconductor device manufacturing method, a surface of a substrate structure including a semiconductor layer is covered with a first film including first and second openings. The first opening is configured as an alignment mark. The second opening is configure... | 05/17/2011 |
| 7932157 | Test structure formation in semiconductor processing Test structures are formed during semiconductor processing. The test structures allow performance characteristics to be monitored as the process proceeds. The test structures are formed with a single mask that is used in a manner that also allows alignment marks to ... | 04/26/2011 |
| 7927960 | Method of improving overlay performance in semiconductor manufacture A method for registering a pattern on a semiconductor wafer with an oxide surface includes etching into the surface four sets of two trenches each. Each trench in a set is parallel to the other. The trenches are configured such that each set forms one side of a box ... | 04/19/2011 |
| 7923344 | Method of fabricating backside illuminated image sensor A method for fabricating a backside illuminated image sensor is provided. An exemplary method can include providing a substrate with a front surface and a back surface; forming a first alignment mark for global alignment on the front surface of the substrate; formin... | 04/12/2011 |
| 7883985 | Chip and multi-chip semiconductor device using the chip, and method for manufacturing same The chip for the multi-chip semiconductor device having the markings for alignment formed on the front surface and/or the back surface of the chip only by the processing from the front surface of the chip (photolithography, etch) and the method for manufacturing sam... | 02/08/2011 |
| 7879682 | Marker structure and method for controlling alignment of layers of a multi-layered substrate The invention includes a lithographic system having a first source for generating radiation with a first wavelength and an alignment system with a second source for generating radiation with a second wavelength. The second wavelength is larger than the first wavelen... | 02/01/2011 |
| 7858487 | Method and apparatus for indicating directionality in integrated circuit manufacturing An integrated circuit includes a visually discernable indicator formed as part of the integrated circuit to indicate a directionality of a non-visually discernable characteristic of the integrated circuit. ... | 12/28/2010 |
| 7846810 | Method of measuring warpage of rear surface of substrate A method of measuring warpage of a rear surface of a substrate includes a substrate detection step, a best fit plane calculation step, and a warpage calculation step. Further, the method of measuring warpage of a rear surface of a substrate can further includes afte... | 12/07/2010 |
| 7838386 | Method and system for patterning alignment marks on a transparent substrate Disclosed is a method and a system for forming alignment marks on a transparent substrate. A light reflective layer is deposited over an optically transparent substrate of a wafer. A region is defined around an alignment mark on the optically transparent substrate. ... | 11/23/2010 |
| 7825001 | Electronic device, method for manufacturing the same, and silicon substrate for electronic device An electronic device is formed by epitaxially growing a Si substrate on a Si layer of an SOI substrate in which the Si layer is deposited on a front surface of a substrate with an insulating layer interposed therebetween; forming an element on a front-surface side o... | 11/02/2010 |
| 7825000 | Method for integration of magnetic random access memories with improved lithographic alignment to magnetic tunnel junctions A magnetic memory device including a Magnetic Tunnel Junction (MTJ) device comprises a substrate and Front End of Line (FEOL) circuitry. A Via level (VA) InterLayer Dielectric (ILD) layer, a bottom conductor layer, and an MTJ device formed over the top surface of th... | 11/02/2010 |
| 7816223 | Alignment key, method for fabricating the alignment key, and method for fabricating thin film transistor substrate using the alignment key Provided are an alignment key, a method for fabricating the alignment key, and a method for fabricating a thin film transistor substrate using the alignment key. The method for fabricating the alignment key includes forming a first metal layer on a base substrate, f... | 10/19/2010 |
| 7807544 | Solar cell fabrication using extrusion mask Large-area ICs (e.g., silicon wafer-based solar cells) are produced by positioning a mask between an extrusion head and the IC wafer during extrusion of a dopant bearing material or metal gridline material. The mask includes first and second peripheral portions that... | 10/05/2010 |
| 7795105 | Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement A method is disclosed for producing an integrated circuit arrangement with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement. The invention also relates to a method for producing aligning marks. During the method, a pl... | 09/14/2010 |
