Did You Know...
...that it was melting ice cream that inspired the invention of the outboard motor? It was a lovely August day and Ole Evinrude was rowing his boat to his favorite island picnic spot. As he rowed, he watched his ice cream melt and wished he had a faster way to get to the island. At that moment the idea for the outboard motor was born!
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| Number | Title | Issue Date |
| 8110447 | Method of making and designing lead frames for semiconductor packages A lead frame with patterned conductive runs on the top surface to accept a wire bonded or flip-chip or COL configuration is disclosed. The top pattern is completed and the bottom is etched away creating cavities. The cavities are filled with a pre-mold material that... | 02/07/2012 |
| 8101470 | Foil based semiconductor package The present inventions relate to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. One embodiment of the present invention involves attaching multiple dice to a foil carrier structure. The foil carrier ... | 01/24/2012 |
| 8071431 | Overmolded semiconductor package with a wirebond cage for EMI shielding According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situ... | 12/06/2011 |
| 8043899 | Photosensitive resin composition A photosensitive resin composition comprising a photosensitive silicone compound of specified molecular weight having any of specified photosensitive substituents and a photopolymerization initiator in any of specified proportions is used. Thus, there can be obtaine... | 10/25/2011 |
| 8039319 | Method for fabricating QFN semiconductor package A method for making a quad flat non-lead (QFN) semiconductor package includes half etching a first side of a carrier to form top portions of a lead array and a die attach surface of a die attach pad, wherein the lead array includes at least one inner terminal lead d... | 10/18/2011 |
| 8021930 | Semiconductor device and method of forming dam material around periphery of die to reduce warpage A semiconductor device has a temporary carrier with a designated area for a first semiconductor die. A dam material is deposited on the carrier around the designated area for a first semiconductor die. The first semiconductor die is mounted to the designated area on... | 09/20/2011 |
| 8017448 | Method for manufacturing semiconductor device In a double-sided electrode package, a sealing resin layer is formed so as to fill peripheries of surface-side terminals formed on a package substrate. Since the side surfaces of the surface-side terminals have plural protruded rims, adhesion with the sealing resin ... | 09/13/2011 |
| 7998796 | Semiconductor device and manufacturing method thereof The present invention provides a technique capable of suppressing variations in the height of each solder ball where an NSMD is used as a structure for each land. Vias that extend through a wiring board are provided. Lands are formed at the back surface of the wirin... | 08/16/2011 |
| 7993981 | Electronic device package and method of manufacture A method of manufacturing an electronic device package. Coating a first side of a metallic layer with a first insulating layer and coating a second opposite side of the metallic layer with a second insulating layer. Patterning the first insulating layer to expose bo... | 08/09/2011 |
| 7993982 | Quad flat non-leaded package and manufacturing method thereof A quad flat non-leaded package including a first patterned conductive layer, a second patterned conductive layer, a chip, bonding wires and a molding compound is provided. The first patterned conductive layer defines a first space, and the second patterned conductiv... | 08/09/2011 |
| 7985630 | Method for manufacturing semiconductor module A method for manufacturing a semiconductor module, includes the steps of preparing a board; mounting a semiconductor device on the second metal foil; placing a resin case onto the board for surrounding a first metal foil, an insulating sheet, the second metal foil, ... | 07/26/2011 |
| 7985628 | Integrated circuit package system with interconnect lock An integrated circuit package system includes: mounting a device structure over a package carrier; connecting an internal interconnect between the device structure and the package carrier; forming an interconnect lock over the internal interconnect over the device s... | 07/26/2011 |
| 7985629 | Resin sealing method of semiconductor device A resin sealing method of a semiconductor device, is provided with: providing a semiconductor device on which a dummy dump is formed; providing a support body including an adhesive layer provided on a surface of the support body; forming a recess in the adhesive lay... | 07/26/2011 |
| 7981730 | Integrated conformal shielding method and process using redistributed chip packaging An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (1) using a double side adhesive... | 07/19/2011 |
| 7977161 | Method of manufacturing a semiconductor package using a carrier A method of manufacturing a semiconductor package includes providing a carrier, forming a post slot and a terminal slot in the carrier, depositing a post in the post slot, depositing a terminal in the terminal slot, forming an encapsulant slot in the carrier, wherei... | 07/12/2011 |
| 7947535 | Thin package system with external terminals A thin package system with external terminals and a leadframe is provided. An external bond finger defining template is provided and used to form external bond fingers on the leadframe. A die is provided and attached to the leadframe. At least portions of the die an... | 05/24/2011 |
| 7943432 | Mold cleaning sheet and manufacturing method of a semiconductor device using the same A cleaning sheet with frame for cleaning a molding die comprising a cleaning heat main body that covers the entire mating surface of a molding die and a reinforcing frame which can be disposed along the peripheral edge to the outside of the plural cavities of the ma... | 05/17/2011 |
| 7943433 | Method of manufacturing semiconductor device A semiconductor chip has a rectangular main surface with first and second vertices on a diagonal line and first and second sides connecting the first and second vertices. A wire is formed between an electrode and a pad of the semiconductor chip. The wire is enclosed... | 05/17/2011 |
| 7935576 | Semiconductor device and manufacturing method of the same Semiconductor device 10 includes wiring substrate 11 including wiring 14 and wiring 15 in predetermined patterns, semiconductor chips 19 and 23 which are mounted on wiring substrate 11 with electrodes electrically con... | 05/03/2011 |
| 7927923 | Method and apparatus for directing molding compound flow and resulting semiconductor device packages Flow diverting structures for preferentially impeding, redirecting or both impeding and redirecting the flow of flowable encapsulant material, such as molding compound, proximate a selected surface or surfaces of a semiconductor die or dice during encapsulation are ... | 04/19/2011 |
| 7906377 | Fabrication method of circuit board A fabrication method of a circuit board is provided. A substrate, a top pad, a base pad electrically connecting the top pad, and a top and a base solder resist layers are provided. The top and the base pads are disposed on two opposite surfaces of the substrate, res... | 03/15/2011 |
| 7888186 | Method for assembling stackable semiconductor packages A method for assembling a stackable semiconductor package includes providing a substrate having a first surface and a second surface. The first surface includes bond pads and one or more die pads. Conductive bumps are formed on the bond pads and one or more semicond... | 02/15/2011 |
| 7879655 | Semiconductor device and a manufacturing method of the same A semiconductor device is disclosed wherein first wiring lines in a first row extend respectively from first connecting portions toward one side of a semiconductor chip, while second wiring lines extend respectively from second connecting portions toward the side op... | 02/01/2011 |
| 7871864 | Locking feature and method for manufacturing transfer molded IC packages The invention discloses integrated circuits (ICs), molded IC packages, and to leadframe arrays, package arrays and methods for their manufacture. Leadframe arrays and package arrays used for the manufacture of IC packages by transfer molding processes include a lock... | 01/18/2011 |
| 7838340 | Pre-molded clip structure A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surf... | 11/23/2010 |
| 7816187 | Method for fabricating semiconductor package free of substrate A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in t... | 10/19/2010 |
| 7807510 | Method of manufacturing chip integrated substrate There are provided the steps of connecting a chip component 13 to a first substrate 10 through a wire 14, providing an electrode 21 on a second substrate 20, attaching, to the first substrate 10, a molding tool 30 hav... | 10/05/2010 |
| 7803665 | Method for encapsulating a device in a microcavity Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from t... | 09/28/2010 |
| 7741161 | Method of making integrated circuit package with transparent encapsulant A method for making an IC package with transparent encapsulant includes providing a leadframe, where the leadframe includes a first die pad and a second die pad, disposing a first die on the first die pad and a second die on the second die pad, forming a cavity on t... | 06/22/2010 |
| 7682878 | Encapsulation circuitry on a substrate An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall t... | 03/23/2010 |
| 7666715 | Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the sem... | 02/23/2010 |
| 7648857 | Process for precision placement of integrated circuit overcoat material The present invention provides a process for manufacturing an integrated circuit (IC) package and an integrated circuit (IC) package. The process, without limitation, includes providing an integrated circuit chip having a configuration, and forming a layer of overco... | 01/19/2010 |
| 7648858 | Methods and apparatus for EMI shielding in multi-chip modules Methods and structures provide a shielded multi-layer package for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating la... | 01/19/2010 |
| 7645640 | Integrated circuit package system with leadframe substrate A system for manufacturing an integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and th... | 01/12/2010 |
| 7592204 | Package design of small diameter sensor A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignmen... | 09/22/2009 |
| 7572679 | Heat extraction from packaged semiconductor chips, scalable with chip area A semiconductor device (100A) with plastic encapsulation compound (102) and metal sheets (103a and 104) on both surfaces, acting as heat spreaders. One or more thermal conductors (103a) of preferably uniform height co... | 08/11/2009 |
| 7572680 | Packaged integrated circuit with enhanced thermal dissipation A semiconductor package (10) uses a plurality of thermal conductors (56-64) that extend upward within an encapsulant (16) from one or more thermal bond pads (22, 24, 26) on a die (14) to disperse heat. The thermal conductors... | 08/11/2009 |
| 7563649 | Chip packaging with metal frame pin grid array A packaging technology for silicon chips is similar to ball grid array packaging technology of the prior art without, however, the use of printed board substrate of the prior art Instead pins are used that are part of a planar frame, the pins folded to a position 90... | 07/21/2009 |
| 7563648 | Semiconductor device package and method for manufacturing same A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the... | 07/21/2009 |
| 7528014 | Semiconductor device and method of manufacturing the same A manufacturing method of a semiconductor device including preparing a lead frame having a die pad, leads arranged around the die pad and a silver plating layer formed over a first portion of each of the leads, mounting a semiconductor chip over a main surface of th... | 05/05/2009 |
