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"During my service in the United States Congress, I took the initiative in creating the Internet."
Al Gore ; The basis for the later misquote by US Republicans that Gore had "invented" the Internet. Gore was the leading political champion of the modern-day Internet.
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| Number | Title | Issue Date |
| 8389337 | Patch on interposer assembly and structures formed thereby Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface o... | 03/05/2013 |
| 8389338 | Embedded die package on package (POP) with pre-molded leadframe A multiple-chip package has top and bottom pre-molded leadframes formed prior to the flip-chip attachment of semiconductor die to the leadframes. After die attachment, underfill is used to encase all but one surface of the die, and the top and bottom leadframes are ... | 03/05/2013 |
| 8367481 | Four MOSFET full bridge module A molded, leadless packaged semiconductor multichip module includes 100 has four mosfets 10, 12, 14, 16 for a full bridge circuit. The mosfets may include two N-channel and two P-channel devices or four mosfets of the same type, but four N-channel are ... | 02/05/2013 |
| 8367480 | Semiconductor device and method of forming dam material around periphery of die to reduce warpage A semiconductor device has a carrier. A first semiconductor die is mounted to the carrier with an active surface of the first semiconductor die oriented toward the carrier. A dam structure is formed on the carrier and around the first semiconductor die by depositing... | 02/05/2013 |
| 8349660 | Cavity closure process for at least one microelectronic device A process for closure of at least one cavity intended to encapsulate or be part of a microelectronic device, comprising the following steps: a) Producing a cavity in a first substrate comprising a first layer traversed by an openin... | 01/08/2013 |
| 8343811 | Semiconductor device A module including a carrier and a semiconductor chip applied to the carrier. An external contact element is provided having a first portion and a second portion extending perpendicular to the first portion, wherein a thickness of the second portion is smaller than ... | 01/01/2013 |
| 8334175 | Manufacturing method of LED package structure A method for manufacturing a holder of an LED package structure includes steps: providing first and second electrical portions; providing a mold including an upper die and a bottom die, the bottom die defining a receiving groove in a top surface thereof, the upper d... | 12/18/2012 |
| 8313983 | Fabrication method for resin-encapsulated semiconductor device A fabrication method for a resin encapsulated semiconductor device includes the steps of: (1) die-bonding a semiconductor device to a first electrical connection metallic terminal of a wiring substrate; (2) electrically connecting an electrode of the semiconductor d... | 11/20/2012 |
| 8304295 | Method of manufacturing an electronic device with a package locking system Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad a... | 11/06/2012 |
| 8304296 | Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof A method of manufacture of a semiconductor packaging system includes: providing a substrate; mounting a semiconductor chip to the substrate; mounting a pillar ball having a ball height electrically connected to the substrate; mounting an interposer above the semicon... | 11/06/2012 |
| 8298872 | Manufacturing method for semiconductor device Provided is a method of producing a semiconductor device having a structure wherein a semiconductor chip 3 is mounted on a wiring circuit substrate 2 and sealed with a resin. A wiring circuit substrate 2 having a connecting conductor portion tha... | 10/30/2012 |
| 8293588 | Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer A method of packaging an electronic device includes providing a patterned dielectric layer with an area sized to receive a first die, and another area sized to receive a second die, placing the first and second dies within the first and second areas, encapsulating t... | 10/23/2012 |
| 8263437 | Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit A semiconductor device has a first conductive layer formed over a sacrificial substrate. A first integrated passive device (IPD) is formed in a first region over the first conductive layer. A conductive pillar is formed over the first conductive layer. A high-resist... | 09/11/2012 |
| 8241966 | Methods of making an electronic component package and semiconductor chip packages An electronic component package having an EMI shielded space is disclosed. The package comprises a substrate having an electronic component located on its surface and a conductive enclosure having a top and downwardly extending sides enclosing the component and defi... | 08/14/2012 |
| 8241967 | Semiconductor package with a support structure and fabrication method thereof A semiconductor package with a support structure and a fabrication method thereof are provided. With a chip being electrically connected to electrical contacts formed on a carrier, a molding process is performed. A plurality of recessed portions formed on the carrie... | 08/14/2012 |
| 8216886 | Method for making semiconductor package A method for assembling a semiconductor package includes a rapid cooling step after post mold curing of an encapsulation material. The rapid cooling step includes blowing chilled, compressed air over the package for about two minutes. The rapid cooling step does not... | 07/10/2012 |
| 8211754 | Semiconductor device and manufacturing method thereof A semiconductor device including a semiconductor chip encapsulated by an encapsulation resin and a manufacturing method thereof, in which a size reduction may be attempted. The device includes a semiconductor chip, an external connection terminal pad electrically co... | 07/03/2012 |
| 8202766 | Method for fabricating through-silicon via structure A method for fabricating through-silicon via structure includes the steps of: providing a semiconductor substrate; forming at least one semiconductor device on surface of the semiconductor substrate; forming a dielectric layer on the semiconductor device, in which t... | 06/19/2012 |
| 8183094 | Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion A method of manufacturing a semiconductor device includes preparing a semiconductor chip having a main surface, forming a conductive portion made from a material having conductivity and malleability on the main surface, arranging the semiconductor chip within a die ... | 05/22/2012 |
| 8168475 | Semiconductor package formed within an encapsulation Provided are a semiconductor package which is small in size but includes a large number of terminals disposed at intervals equal to or greater than a minimum pitch, and a method of fabricating the semiconductor package. The semiconductor package includes a semicondu... | 05/01/2012 |
| 8143107 | Integrated circuit packaging system substrates and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: forming a substrate including: patterning a bonding pad on the substrate, patterning a first signal trace coupled to the bonding pad, patterning a second signal trace on the substrate, and c... | 03/27/2012 |
| 8133764 | Embedded inductor and method of producing thereof A method of manufacturing an inductor embedded into a semiconductor chip package (100) is described, which method comprises providing a carrier (102; 202; 302) having, between a first side and an opposite second side, a first conductive layer (104; ... | 03/13/2012 |
| 8110447 | Method of making and designing lead frames for semiconductor packages A lead frame with patterned conductive runs on the top surface to accept a wire bonded or flip-chip or COL configuration is disclosed. The top pattern is completed and the bottom is etched away creating cavities. The cavities are filled with a pre-mold material that... | 02/07/2012 |
| 8101470 | Foil based semiconductor package The present inventions relate to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. One embodiment of the present invention involves attaching multiple dice to a foil carrier structure. The foil carrier ... | 01/24/2012 |
| 8071431 | Overmolded semiconductor package with a wirebond cage for EMI shielding According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situ... | 12/06/2011 |
| 8043899 | Photosensitive resin composition A photosensitive resin composition comprising a photosensitive silicone compound of specified molecular weight having any of specified photosensitive substituents and a photopolymerization initiator in any of specified proportions is used. Thus, there can be obtaine... | 10/25/2011 |
| 8039319 | Method for fabricating QFN semiconductor package A method for making a quad flat non-lead (QFN) semiconductor package includes half etching a first side of a carrier to form top portions of a lead array and a die attach surface of a die attach pad, wherein the lead array includes at least one inner terminal lead d... | 10/18/2011 |
| 8021930 | Semiconductor device and method of forming dam material around periphery of die to reduce warpage A semiconductor device has a temporary carrier with a designated area for a first semiconductor die. A dam material is deposited on the carrier around the designated area for a first semiconductor die. The first semiconductor die is mounted to the designated area on... | 09/20/2011 |
| 8017448 | Method for manufacturing semiconductor device In a double-sided electrode package, a sealing resin layer is formed so as to fill peripheries of surface-side terminals formed on a package substrate. Since the side surfaces of the surface-side terminals have plural protruded rims, adhesion with the sealing resin ... | 09/13/2011 |
| 7998796 | Semiconductor device and manufacturing method thereof The present invention provides a technique capable of suppressing variations in the height of each solder ball where an NSMD is used as a structure for each land. Vias that extend through a wiring board are provided. Lands are formed at the back surface of the wirin... | 08/16/2011 |
| 7993981 | Electronic device package and method of manufacture A method of manufacturing an electronic device package. Coating a first side of a metallic layer with a first insulating layer and coating a second opposite side of the metallic layer with a second insulating layer. Patterning the first insulating layer to expose bo... | 08/09/2011 |
| 7993982 | Quad flat non-leaded package and manufacturing method thereof A quad flat non-leaded package including a first patterned conductive layer, a second patterned conductive layer, a chip, bonding wires and a molding compound is provided. The first patterned conductive layer defines a first space, and the second patterned conductiv... | 08/09/2011 |
| 7985628 | Integrated circuit package system with interconnect lock An integrated circuit package system includes: mounting a device structure over a package carrier; connecting an internal interconnect between the device structure and the package carrier; forming an interconnect lock over the internal interconnect over the device s... | 07/26/2011 |
| 7985630 | Method for manufacturing semiconductor module A method for manufacturing a semiconductor module, includes the steps of preparing a board; mounting a semiconductor device on the second metal foil; placing a resin case onto the board for surrounding a first metal foil, an insulating sheet, the second metal foil, ... | 07/26/2011 |
| 7985629 | Resin sealing method of semiconductor device A resin sealing method of a semiconductor device, is provided with: providing a semiconductor device on which a dummy dump is formed; providing a support body including an adhesive layer provided on a surface of the support body; forming a recess in the adhesive lay... | 07/26/2011 |
| 7981730 | Integrated conformal shielding method and process using redistributed chip packaging An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (1) using a double side adhesive... | 07/19/2011 |
| 7977161 | Method of manufacturing a semiconductor package using a carrier A method of manufacturing a semiconductor package includes providing a carrier, forming a post slot and a terminal slot in the carrier, depositing a post in the post slot, depositing a terminal in the terminal slot, forming an encapsulant slot in the carrier, wherei... | 07/12/2011 |
| 7947535 | Thin package system with external terminals A thin package system with external terminals and a leadframe is provided. An external bond finger defining template is provided and used to form external bond fingers on the leadframe. A die is provided and attached to the leadframe. At least portions of the die an... | 05/24/2011 |
| 7943432 | Mold cleaning sheet and manufacturing method of a semiconductor device using the same A cleaning sheet with frame for cleaning a molding die comprising a cleaning heat main body that covers the entire mating surface of a molding die and a reinforcing frame which can be disposed along the peripheral edge to the outside of the plural cavities of the ma... | 05/17/2011 |
| 7943433 | Method of manufacturing semiconductor device A semiconductor chip has a rectangular main surface with first and second vertices on a diagonal line and first and second sides connecting the first and second vertices. A wire is formed between an electrode and a pad of the semiconductor chip. The wire is enclosed... | 05/17/2011 |
