...that Thomas Edison's patent application on his phonograph was approved by the Patent Office in just seven weeks? In contrast, it took Gordon Gould, the inventor of the laser, 30 years to obtain his patent -- finally awarded in 1988!
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7871265 | Heat treatment device In a heat treatment device including a heating chamber having a heating plate heating a semiconductor wafer, a cooling plate cooling the wafer heated by the heating chamber, and a transporting device transporting the wafer into and from the heating chamber, the cool... | 01/18/2011 |
| 7780438 | Substrate heating apparatus and method and coating and developing system Disclosed is a substrate heating apparatus including a hot plate that heats a substrate, and a cooling plate that supports the substrate and moves between a first position (home position) and the second position above the hot plate to transfer wafers between the two... | 08/24/2010 |
| 7537448 | Thermal processing method and thermal processing unit The present invention is a thermal processing method including: a step of conducting a predetermined thermal process in a low temperature zone to a plurality of objects to be processed held in a tier-like manner by a heating unit, in a processing container that is m... | 05/26/2009 |
| 7377774 | Change-over apparatus for cooling gas passages in vacuum heat treating furnace A change-over apparatus for cooling a gas passage is provided with a cooling chamber and a gas cooling and circulating system. The apparatus is further provided with a stationary partition plate and a slidable shield plate. The stationary partition plate has a sucti... | 05/27/2008 |
| 7293986 | Vestibule assembly for a heat treatment furnace The present invention provides a heat treating process chamber having a housing with a flow passage in communication with a vestibule assembly. The vestibule assembly includes an outer ring with a first groove and an inner ring with a second groove. The first groove... | 11/13/2007 |
| 6967177 | Temperature control system An apparatus for controlling the substrate temperature of a substrate during processing of the substrate at a process energy. A chuck temperature input receives temperature measurements from temperature sensors at a substrate chuck, and a temperature set point input... | 11/22/2005 |
| 6906354 | T-RAM cell having a buried vertical thyristor and a pseudo-TFT transfer gate and method for fabricating the same A T-RAM array having a plurality of T-RAM cells is presented where each T-RAM cell has dual devices. Each T-RAM cell is planar and has a buried vertical thyristor and a horizontally stacked pseudo-TFT transfer gate. The buried vertical thyristor is located beneath t... | 06/14/2005 |
| 6821114 | Gas-cooled single chamber heat treating furnace, and method for gas cooling in the furnace A gas-cooled single-chamber type heat-treating furnace T in which cooling gas vents 9A and 9B opened and closed by doors 11A and 11B are provided on each of mutually opposed walls of an inner chamber 5 forming a processing room and... | 11/23/2004 |
| 6769908 | Wafer heat-treatment system and wafer heat-treatment method A wafer heat-treatment system for processing a wafer by a high-temperature heat-treatment process and cooling the heat-treated wafer, comprises walls surrounding a closed space placing the wafer and having a hollow sealing a gas therein, and a pressure-regulating un... | 08/03/2004 |
| 6746238 | Cooling system for reducing particles pollution The present invention relates to a cooling system of a furnace, and more particularly, to a multi-cycle cooling system, located by the furnace door. The multi-cycle cooling system comprises the first gas cooling cycle, the second gas cooling cycle, the first liquid ... | 06/08/2004 |
| 6575737 | Method and apparatus for improved substrate handling A transfer chamber is provided. The transfer chamber has a temperature adjustment plate located in an upper portion of the chamber, a substrate handler located in a lower portion of the chamber, and a rotatable substrate carriage adapted so as to raise an... | 06/10/2003 |
| 6474986 | Hot plate cooling method and heat processing apparatus In a heat processing apparatus structured to heat a wafer on a hot plate, a black plate at least the rear face of which practically has a color with a JIS lightness of 0V to 4V is positioned above the hot plate. Moreover, cooling air is blown out from noz... | 11/05/2002 |
| 6450805 | Hot plate cooling method and heat processing apparatus In a heat processing apparatus for heating a wafer on a hot plate, a black plate having at least a rear face practically having a color with a JIS lightness of 0V to 4V is positioned above the hot plate. Moreover, cooling air is blown out from nozzles ont... | 09/17/2002 |
| 6394797 | Substrate temperature control system and method for controlling temperature of substrate To provide a substrate temperature control system capable of unifying the temperature of the substrate and capable of shortening the temperature elevation time (temperature lowering time), the substrate temperature control system is equipped with a temper... | 05/28/2002 |
| 6354832 | Substrate processing apparatus and substrate processing method In a heat processing apparatus of a low-oxygen curing and cooling processing station, a plurality of blast ports are provided in a ring shutter along a thickness direction of a wafer and a heated inert gas is supplied into a heat processing chamber via th... | 03/12/2002 |
| 6131537 | Water-cooled baffle for a furnace A water-cooled baffle used in a furnace to control the clearance gap between the bottom of the baffle and the hearth of the furnace. The baffle includes a first pipe that extends at least to the walls of the furnace and serves as an arbor to allow rotatio... | 10/17/2000 |
| 6059567 | Semiconductor thermal processor with recirculating heater exhaust cooling system In summary, the vertical rapid cooling furnace of this invention for treating semiconductor wafers with self contained gas chilling and recycling comprises a hot wall reaction tube positioned within a cylindrical array of heating coils. Space between the ... | 05/09/2000 |
| 5350296 | Method and device for cooling a rotary kiln In a method for cooling a rotary kiln having a cylindrical outer jacket, cooling air is blown at high speed radially towards the jacket from an annular supply-air chamber surrounding the jacket and having a perforated inner wall which is located at a slig... | 09/27/1994 |
| 5184953 | Water cooling pipe correction to vertically unsymmetrical heating of blooms in walking-beam reheat furnace Apparatus is provided for decreasing temperature differentials within rectangular metal blooms being heated in a furnace. The apparatus includes elongated internally cooled members located above the blooms adjacent an exit end of the furnace. The longitud... | 02/09/1993 |
| 4948363 | Quick-change cooling line Quick-change cooling line which is located advantageously downstream of a finishing unit (11) and is suitable to cool round or ribbed wire rod having a section between 4 and 25 mm., the line consisting of a plurality of segments (110) each of which compri... | 08/14/1990 |
| 4830609 | Curing oven system for semiconductor devices An automated curing oven system for use in the manufacturing of semiconductors. This system may easily be incorporated with other automated machinery used for various semiconductor processing steps because it employs the same device holding magazine used ... | 05/16/1989 |
| 4690638 | Water cooled scrap preheating bucket A bucket cooled by circulating water and scrap preheating apparatus incorporating the bucket are disclosed. The bucket comprises a bucket-shaped container which contains scrap to be preheated and through which an exhaust gas from an electric furnace is pa... | 09/01/1987 |
| 4537572 | Assembly for positioning a thermogravimetric furnace An apparatus for positioning a thermogravimetric furnace includes a furnace mounting bracket which is rotatable about and linearly translatable along a single axis. In addition, simultaneous rotational and linearly movement of the furnace is excluded.... | 08/27/1985 |
| 4379547 | Continuous cold rolling and annealing apparatus for steel strip A continuous cold rolling and annealing apparatus for a steel strip so that interruption of a cold rolling mill part does not directly cause a continuous annealing furnace part to be interrupted, in which apparatus at least one cold rolling mill is locate... | 04/12/1983 |
| 4258906 | Device for gradient heating of wire A device for gradient heating of a wire includes a vacuum chamber with a thermostatically regulated base and a means for producing a temperature gradient arranged thereinside. The means for producing a temperature gradient is designed in the form of a met... | 03/31/1981 |
| 4239484 | Vacuum oven with gas cooling device There is provided a vacuum oven with a gas cooling device with which the heat treated charge for cooling is blown on with a cooling medium from nozzles arranged around it in which the nozzles in the heating chamber are arranged parallel to the axis of the... | 12/16/1980 |
| 4211088 | Internal cooling of heat exchanger tubes The present invention is an apparatus and method for cooling heat exchanger tubes at controlled conditions. The apparatus comprises a housing sealingly connected to each heat exchanger tube. There are water and air inlets to the housing. A means to genera... | 07/08/1980 |