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Class 430/316 - Multiple etching of substrate


Subclass of Class 430 - Radiation imagery chemistry: process, composition, or product thereof
Definition: Processes wherein portions of the medium are removed using
No. of patents: 492
Last issue date: 05/21/2013


1                      
NumberTitleIssue Date
8445185Method of manufacturing piezoelectric vibrating reed, piezoelectric vibrating reed, piezoelectric vibrator, oscillator, electronic apparatus, and radio-controlled timepiece
There are provided a method of manufacturing a piezoelectric vibrating reed capable of improving the reliability of a product by sorting out a defective product correctly, a piezoelectric vibrating reed, a piezoelectric vibrator having a piezoelectric vibrating reed...
05/21/2013
8399182Method of fabricating liquid crystal display device
A method of fabricating a transflective type liquid crystal display device includes: forming gate and data lines with a gate insulating layer therebetween on a substrate and crossing each other to define a pixel region that includes a switching region, a reflective ...
03/19/2013
8288081Method and system for exposure of a phase shift mask
The present disclosure provides a method of making a mask. The method includes providing a substrate having a first attenuating layer on the substrate and a first imaging layer on the first attenuating layer; performing a first exposure to the first imaging layer us...
10/16/2012
8252516Manufacturing a narrow track read head
Embodiments of the invention operate to narrow the track width of a read head used in a disk drive. In one embodiment, a magnetic read head has a track width of about 40 nm or less. The read head is fabricated by a method that includes fabricating a film stack from ...
08/28/2012
8178287Photoresist composition and method of forming a resist pattern
A resist material utilized in photolithography patterning includes a first material, and a second material dispersed in the first material. The second material is capable of diffusing to a top surface of the resist material, and has an etch rate different from that ...
05/15/2012
8168374Method of forming a contact hole
A method of forming a contact hole is provided. A pattern is formed in a photo resist layer. The pattern is exchanged into a silicon photo resist layer to form a first opening. Another pattern is formed in another photo resist layer. The pattern is exchanged into a ...
05/01/2012
7989147Method for fabricating liquid crystal display device
Disclosed is a method for fabricating a liquid crystal display device comprising: providing a first substrate having a pixel portion and a pad portion; sequentially laminating a gate insulating layer, a semiconductor layer and a first conductive layer on the first s...
08/02/2011
7910289Use of dual mask processing of different composition such as inorganic/organic to enable a single poly etch using a two-print-two-etch approach
In accordance with the invention, there are methods of making an integrated circuit, an integrated circuit device, and a computer readable medium. A method can comprise forming a first layer over a semiconductor substrate, forming a first mask layer over the semicon...
03/22/2011
7799512Method for forming ring pattern
A method for forming a ring pattern is disclosed. The ring pattern has a first wall and a second wall. The method includes the following steps: (a) providing a substrate; (b) forming a dielectric layer on the substrate; (c) forming a first patterned photoresist laye...
09/21/2010
7790360Methods of forming multiple lines
Some embodiments include formation of polymer spacers along sacrificial material, removal of the sacrificial material, and utilization of the polymer spacers as masks during fabrication of integrated circuitry. The polymer spacer masks may, for example, be utilized ...
09/07/2010
7419763Near-field exposure photoresist and fine pattern forming method using the same
A near-field photoresist for formation of a fine pattern with by near-field exposure includes an alkali-soluble novalac resin, a diazyde-type photosensitizer which is photoreactive by near-field exposure, a photoacid generator which generates acid by the near-field ...
09/02/2008
7396475Method of forming stepped structures employing imprint lithography
The present invention provides a method for forming a stepped structure on a substrate that features transferring, into the substrate, an inverse shape of the stepped structure disposed on the substrate. ...
07/08/2008
7384728Method of fabricating a semiconductor device
A method of fabricating a semiconductor device. A first organic layer, a silicon-containing sacrificial layer, and a second organic layer are sequentially formed on a substrate. A photolithography process is performed for forming a predetermined pattern in the secon...
06/10/2008
7380320Piezoelectric device and method of manufacturing the device
A piezoelectric device includes a substrate, a buffer layer on the substrate, a lower electrode layer on the buffer layer, a piezoelectric layer on the lower electrode layer, and an upper electrode layer on the piezoelectric layer. The piezoelectric layer has a base...
06/03/2008
7371636Method for fabricating storage node contact hole of semiconductor device
A method for fabricating a storage node contact hole of a semiconductor device includes: forming an inter-layer insulation layer over a substrate; forming a hard mask over the inter-layer insulation layer; etching the inter-layer insulation layer to form a storage n...
05/13/2008
7371507Methods for fabricating semiconductor devices
Methods for fabricating semiconductor devices are disclosed. A disclosed method comprises: forming a conductive layer, depositing a interlayer dielectric layer, forming an anti-reflective coating layer on the interlayer dielectric layer, forming a photoresist patter...
05/13/2008
7371485Multi-step process for etching photomasks
Method and apparatus for etching a metal layer disposed on a substrate, such as a photolithographic reticle, are provided. In one aspect, a method is provided for processing a photolithographic reticle including positioning the reticle on a support member in a proce...
05/13/2008
7365408Structure for photolithographic applications using a multi-layer anti-reflection coating
A bi-layer anti-reflective coating for use in photolithographic applications, and specifically, for use in ultraviolet photolithographic processes. The bi-layered anti-reflective coating is used to minimize pattern distortion due to reflections from neighboring feat...
04/29/2008
7364832Wet developable hard mask in conjunction with thin photoresist for micro photolithography
A novel process for using a hard mask or protective layer in conjunction with an extremely thin photoresist is provided. In this process, a thin film of the protective layer is coated on the surface of a substrate that is to be selectively modified by reactive ion e...
04/29/2008
7361453Method for creating a pattern in a material and semiconductor structure processed therewith
A method of manufacturing a semiconductor device with precision patterning is disclosed. A structure of a small dimension is created in a material, such as a semiconductor material, using a first and a second pattern, the patterns being identical but displaced over ...
04/22/2008
7355813Method of fabricating a narrow projection such as a write pole extending from a substrate
An article is formed as a substrate having a projection extending outwardly therefrom. The article may be a magnetic recording head and the projection a write pole. The projection has a width in a thinnest dimension measured parallel to a substrate surface of no mor...
04/08/2008
7351519Patterning of indium-tin oxide (ITO) for precision-cutting and aligning a liquid crystal display (LCD) panel
A method of improved patterning of indium-tin oxide (ITO) for precision-cutting and aligning a liquid crystal display (LCD) panel includes depositing a transparent ITO layer upon a transparent substrate, depositing a non-transparent plating layer upon the transparen...
04/01/2008
7352431Liquid crystal display and manufacturing method thereof
A method of manufacturing a liquid crystal display panel is provided, which includes: coating a negative organic photoresist on a substrate; performing divisional light exposure with a plurality of shots including first and second shots adjacent to each other; and d...
04/01/2008
7348133Method of manufacturing solid-state image sensing device
The invention provides a manufacturing method of a solid-state image sensing device where light-receiving sensitivity is improved. The manufacturing method of the solid-state image sensing device of the invention has forming an insulating film on a light-receiving r...
03/25/2008
7344825Method of fabricating semiconductor device, and developing apparatus using the method
In a resist pattern forming method in which bake processing is performed at a temperature not lower than a glass transition temperature in order to obtain the desired sidewall angle, resist removable is difficult. Accordingly, in the resist pattern forming method of...
03/18/2008
7335517Multichip semiconductor device, chip therefor and method of formation thereof
A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the c...
02/26/2008
7335585Method for preventing the formation of a void in a bottom anti-reflective coating filling a via hole
A method for manufacturing a semiconductor device which, on performing a via first Dual Damascene process, inhibits or prevents the formation of a void in a bottom anti-reflective coating filling a via hole. The method typically includes the steps of forming a botto...
02/26/2008
7328418Iso/nested control for soft mask processing
This method includes a method for etch processing that allows the bias between isolated and nested structures/features to be adjusted, correcting for a process wherein the isolated structures/features need to be smaller than the nested structures/features and wherei...
02/05/2008
7323292Process for using photo-definable layers in the manufacture of semiconductor devices and resulting structures of same
A process and related structure are disclosed for using photo-definable layers that may be selectively converted to insulative materials in the manufacture of semiconductor devices, including for example dynamic random access memories (DRAMs), synchronous DRAMs (SDR...
01/29/2008
7320855Silicon containing TARC/barrier layer
A top anti-reflective coating material (TARC) and barrier layer, and the use thereof in lithography processes, is disclosed. The TARC/barrier layer may be especially useful for immersion lithography using water as the imaging medium. The TARC/barrier layer comprises...
01/22/2008
7318992Lift-off positive resist composition
A lift-off positive resist composition capable of forming a fine lift-off pattern is provided. This composition comprises a base resin component (A) and an acid generator component (B) generating an acid under exposure, wherein the base resin component (A) is a sili...
01/15/2008
7317227Method for forming pattern of stacked film
A semiconductor film serving as an active region of a thin film transistor and an upper oxide film protecting the semiconductor film are dry etched to form the active region. In this case, a fluorine-based gas is used as the etching gas, and the etching gas is switc...
01/08/2008
7312113Method of forming source/drain region of semiconductor device
A method of forming a source/drain region of a semiconductor device includes forming a photoresist pattern through which an NMOS region of a semiconductor substrate is exposed, and then performing an ion implant process to form NMOS LDD regions in the semiconductor ...
12/25/2007
7306742Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template
A template 1 is brought close to or in contact with a surface to be patterned 111 and patterns are formed with liquid 62 on the surface 111. This method comprises the steps of: bringing the template 1 close to or essentially in con...
12/11/2007
7303855Photoresist undercoat-forming material and patterning process
An undercoat-forming material comprising a novolak resin having a fluorene or tetrahydrospirobiindene structure, an organic solvent, an acid generator, and a crosslinker, optionally combined with an intermediate layer having an antireflective effect, has an absorpti...
12/04/2007
7303860System and method for performing multi-resolution lithography
A micro-fabricated structure and method of forming a micro-fabricated structure are disclosed. The method includes the steps of forming a first pattern in a first photo-resist, transferring the first pattern in the first photo-resist to a mask layer, forming a secon...
12/04/2007
7304821Magnetic head coil structure and method for manufacturing the same
A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the pho...
12/04/2007
7297468Method for forming a structure element on a wafer by means of a mask and a trimming mask assigned hereto
A method for forming a structure element in a layer arranged on a wafer by a trimming mask set, a developing step, and an etching step for the transfer of the structure pattern are carried out between the exposure steps carried out by the masks. Consequently, edges ...
11/20/2007
7291446Method and system for treating a hard mask to improve etch characteristics
During pattern transfer to a film stack, the hard mask layer, such as a tunable etch resistant antireflective coating (TERA), is consumed when etching the underling layer(s), leading to reduced etch performance and potential damage to the underlying layer(s), such a...
11/06/2007
7291285Method and system for line-dimension control of an etch process
A method and system for controlling a dimension of an etched feature. The method includes: measuring a mask feature formed on a top surface of a layer on a substrate to obtain a mask feature dimension value; and calculating a mask trim plasma etch time based on the ...
11/06/2007
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